STA333IS

批量生产

声音终端2通道高效数字音频系统

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概述
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样片和购买
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文件
CAD资源
工具与软件
质量与可靠性
开始
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Sales Briefcase

产品概述

描述

The STA333IS is an integrated circuit comprising digital audio processing, digital amplifier control and an FFXpower output stage to create a high-power, single-chip FFX solution for all-digital amplification with high quality and high efficiency. The STA333IS power section consists of four independent half-bridge stages. Two channels can be provided by two full bridges, delivering up to 10 W + 10 W of power.
Also featured in the STA333IS are new advanced modes for reducing AM radio interference. The serial audio data input interface accepts all possible formats, including the popular I2S format. Two channels of FFXprocessing are provided.
The STA333IS is part of the Sound Terminal®family that provides full digital audio streaming to the speaker, offering cost effectiveness, low-power dissipation and sound enrichment.
  • 所有功能

    • Wide-range supply voltage (4.5 V - 20 V)
    • 2 channels of ternary PWM (stereo mode)
    • 2 channels of 24-bit FFX
    • 100 dB SNR and dynamic range
    • Selectable 32- to 192-kHz input sampling rates
    • Digital gain -80 dB to +48 dB in 0.5 dB steps
    • Software volume update
    • Individual channel and master gain/attenuation
    • Individual channel and master software and hardware mute
    • Independent channel volume bypass
    • Automatic zero-detect mute
    • Automatic invalid input detect mute
    • Short-circuit detection at startup (Out-Vcc, Out-Gnd, Out 1b-Out 2a)
    • 2-channel I2S input data interface
    • 2 Hz DC cut filter (input)
    • Input channel mapping
    • Automatic volume control for limiting maximum power
    • 96 kHz internal processing sampling rate, 24-bit precision
    • Advanced modes for AM interference frequency switching and noise suppression
    • Embedded thermal-overload and short-circuit protection
    • Video application: 576 * fSinput mode support

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EDA Symbols, Footprints and 3D Models

STMicroelectronics - STA333IS

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STA333IS
批量生产
Chip Scale Package 0.5mm pitch 工业 Ecopack3

STA333IS

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.5mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack3

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
STA333IS 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel Chip Scale Package 0.5mm pitch 0 70 ITALY 0.6006 / 1k

STA333IS

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

0.6006 / 1k

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

Chip Scale Package 0.5mm pitch

Operating Temperature (°C)

(最小值)

0

(最大值)

70

Budgetary Price (US$)* / Qty

0.6006 / 1k

Country of Origin

ITALY

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商