L9690

批量生产
Design Win Education

用于高级气囊应用的汽车级12通道芯片

下载数据摘要
概述
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
开始
Partner products
Sales Briefcase

产品概述

描述

The L9690 is an advanced airbag system chip solution targeted for the global airbag market.

High frequency power supply design optimizes system cost by using smaller and less expensive external components. All switching regulators operate at 2 MHz and all buck converters have integrated synchronous rectifiers.

The reserve capacitor is electrically isolated from the boost regulator by integrated switches and external resistors, controlling in-rush current. A capacitor discharge switch is integrated to discharge the capacitor at shutdown.

Low quiescent current permits the device to be directly connected to battery. In this mode, device start-up and shutdown are controlled through the wake-up input pin (actually, shutdown needs also dedicated SPI command too). The power supply and crossover function are controlled automatically through the internal state machine.

For systems with high feature content, two L9690 devices can be used in a master/slave configuration.

The L9690 provides two fully isolated deployment voltage regulators, using the external safing FETs as power elements in the regulator loop. Deployment voltage is set to a nominal 18V value to further optimize system cost.

Integrated safing logic uses a rolling average algorithm and decodes all sensor information within the system remote sensor SPI bus. Number of samples and thresholds are user-programmable. An alternative safing function permits arming from an external source through the Global SPI bus (E2E communication).

Dual SPI interfaces separate device global functions and remote sensors. LIN interface is available, providing OCS message decoding for passenger loop inhibition.

  • 所有功能

    • AEC-Q100 qualified
    • Single chip and master/slave configurations
    • Boost regulator for energy reserve
      • 2 MHz operation
      • Output voltage 24 V/33 V ±6%, user-selectable, peak inductor current regulation
      • Capacitor value and ESR diagnostics
    • Boost regulator for low voltage system operation
      • 2 MHz operation
      • Output voltage, 10 V ±8%, 870 mA max
    • Buck regulator for remote sensor
      • 2 MHz operation
      • Output voltage, 6.5 V/8 V ±4%, 700 mA max
    • Buck regulator for micro controller unit
      • 2 MHz operation
      • Output voltage, 3.3 V ±3%, 450 mA max
    • Remote sensor interface and SYNC pulse supply voltage inputs and monitorings
    • Linear regulator with external power PNP transistor, 5 V ±5%, 135 mA max
    • Integrated energy reserve crossover switch with switch active output indicator, configured as input for slave mode operation
    • Battery voltage monitor and shutdown with wake-up control
    • System voltage diagnostics with integrated ADCs
    • Squib/LEA deployment drivers
      • 12 channel HSD/LSD for squib load
      • 2 over 12 channels supporting LEA load
      • 2 channel couples supporting common-return connection
      • 18 V deployment voltage
      • Low, high and automatic dynamic deployment current profiles
      • R measure, STB, STG and leakage diagnostics
      • High and low side driver FET tests
      • LEA presence diagnostics
    • Two isolated high side safing FET regulators and diagnostics
    • Six channel PSI-5 v2.3 remote sensor interface
    • Three channel general purpose low side drivers with 0-100% PWM control
    • Nine channel hall-effect, resistive or switch sensor interface
    • User-programmable safing logic and rolling average algorithm
    • E2E arming procedure through Global SPI
    • Temporal watchdog timer
    • End-of-life disposal interface
    • Temperature sensor
    • 32 bit Global SPI bus interface
    • 32 bit Remote Sensor SPI bus interface, SafeSPI v1.0 compatible
    • LIN v2.2A interface with OCS message decoding capability
    • 5.4 V min operating voltage at VIN battery input for start-up
    • Full ISO 26262 compliant, ASIL-D systems ready
    • Packaging 128 pin

EDA符号、封装和3D模型

STMicroelectronics - L9690

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
L9690-TR
批量生产
TQFP 128 14x14x1.0 Automotive Safety Ecopack2

L9690-TR

Package:

TQFP 128 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TQFP 128 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

Swipe or click the button to explore more details Don't show this again
产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
L9690-TR Available at distributors

经销商的可用性 L9690-TR

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape and Reel TQFP 128 14x14x1.0 -40 175 MALAYSIA

L9690-TR 批量生产

封装:
TQFP 128 14x14x1.0
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

L9690-TR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

175

Country of Origin:

MALAYSIA

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商