32-bit Power Architecture MCU for Automotive Powertrain Applications

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  • The microcontroller’s e200z4 host processor core is built on Power Architecture technology and designed specifically for embedded applications. In addition to the Power Architecture technology, this core supports instructions for digital signal processing (DSP).

    Key Features

    • 150 MHz e200z4 Power Architecture core
      • Variable length instruction encoding (VLE)
      • Superscalar architecture with 2 execution units
      • Up to 2 integer or floating point instructions per cycle
      • Up to 4 multiply and accumulate operations per cycle
    • Memory organization
      • 4 MB on-chip flash memory with ECC and Read While Write (RWW)
      • 192 KB on-chip RAM with standby functionality (32 KB) and ECC
      • 8 KB instruction cache (with line locking), configurable as 2- or 4-way
      • 14 + 3 KB eTPU code and data RAM
      • 5 × 4 crossbar switch (XBAR)
      • 24-entry MMU
      • External Bus Interface (EBI) with slave and master port
    • Fail Safe Protection
      • 16-entry Memory Protection Unit (MPU)
      • CRC unit with 3 sub-modules
      • Junction temperature sensor
    • Interrupts
      • Configurable interrupt controller (with NMI)
      • 64-channel DMA
    • Serial channels
      • 3 × eSCI
      • 3 × DSPI (2 of which support downstream Micro Second Channel [MSC])
      • 3 × FlexCAN with 64 messages each
      • 1 × FlexRay module (V2.1) up to 10 Mbit/s with dual or single channel and 128 message objects and ECC
    • 1 × eMIOS
      • 24 unified channels
    • 1 × eTPU2 (second generation eTPU)
      • 32 standard channels
      • 1 × reaction module (6 channels with three outputs per channel)
    • 2 enhanced queued analog-to-digital converters (eQADCs)
      • Forty 12-bit input channels (multiplexed on 2 ADCs); expandable to 56 channels with external multiplexers
      • 6 command queues
      • Trigger and DMA support
      • 688 ns minimum conversion time
    • On-chip CAN/SCI/FlexRay Bootstrap loader with Boot Assist Module (BAM)
    • Nexus: Class 3+ for core; Class 1 for the eTPU
    • JTAG (5-pin)
    • Development Trigger Semaphore (DTS)
    • Clock generation
      • On-chip 4–40 MHz main oscillator
      • On-chip FMPLL (frequency-modulated phase-locked loop)
    • Up to 120 general purpose I/O lines
      • Individually programmable as input, output or special function
      • Programmable threshold (hysteresis)
    • Power reduction mode: slow, stop and stand-by modes
    • Flexible supply scheme
      • 5 V single supply with external ballast
      • Multiple external supply: 5 V, 3.3 V and 1.2 V
    • Designed for LQFP176, LBGA208, PBGA324 and Known Good Die (KGD)

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SPC564A80L7CFBR

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SPC564A80L7CFBY

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Tray

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Operating Temperature (°C)

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-40

(max)

125

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1000

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SPC564A80L7CFAR

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CPU Clock Frequency (MHz) (max)

150

Flash Size (kB) (Data)

-

Features set

Flexray

Operating Temperature (°C)

(min)

-40

(max)

125

单价(US$)

16.5

数量

1000

ECCN (US)

5A991B4A

Country of Origin

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SPC564A80L7CFAR
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LQFP 176 24x24x1.4 汽车 Ecopack2
SPC564A80L7CFAY
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LQFP 176 24x24x1.4 汽车 Ecopack2
SPC564A80L7CFBR
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LQFP 176 24x24x1.4 汽车 Ecopack2
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LQFP 176 24x24x1.4 汽车 Ecopack2
SPC564A80L7COBR
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LQFP 176 24x24x1.4 汽车 Ecopack2
SPC564A80L7COBY
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SPC564A80L7CFAR

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Package

LQFP 176 24x24x1.4

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SPC564A80L7COBR

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LQFP 176 24x24x1.4

Material Declaration**:

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Marketing Status

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Package

LQFP 176 24x24x1.4

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LQFP 176 24x24x1.4

Material Declaration**:

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