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  • This family of MCUs is targeted at automotive powertrain controller applications for four-cylinder gasoline and diesel engines, chassis control applications, transmission control applications, steering and braking applications, as well as low-end hybrid applications.

    The family is designed to achieve ISO26262 ASIL-A compliance.
    This document provides electrical specifications, pin assignments, and package diagrams for the SPC572Lx series of microcontroller units (MCUs). For functional characteristics, see the device reference manual.
    This family of MCUs is targeted at automotive powertrain controller applications for four-cylinder gasoline and diesel engines, chassis control applications, transmission control applications, steering and braking applications, as well as low-end hybrid applications.
    The family is designed to achieve ISO26262 ASIL-A compliance.

    Key Features

    • AEC-Q100 qualified
    • One main 32-bit Power Architecture® VLE Compliant CPU core, single issue
      • Single-precision floating point operations
    • 1568 KB on-chip RWW flash memory
      • Supporting EEPROM emulation (32 KB)
    • 64 KB general-purpose data SRAM
    • System Memory Protection Unit (SMPU)
    • Multi-channel direct memory access controllers (eDMA) with 16-channel for up to 60 DMA sources
    • Interrupt controller (INTC)
    • Four 32-bit and one 64-bit Periodic Interrupt Timer channels (PIT)
    • Single phase-locked loops with stable clock domain for peripherals and core (PLL)
    • System integration unit lite (SIUL2)
    • Boot assist flash (BAF) supports factory programming through UART/LIN, CAN
    • Generic timer module (GTM101)
      • Intelligent complex timer module
      • 72 channels (16 input and 56 output)
    • Enhanced analog-to-digital converter system with:
      • Three 12-bit SAR analog converters
      • One 16-bit Sigma-Delta analog converters
    • Decimation unit to support SD ADC data conditioning
    • Two deserial serial peripheral interface (DSPI) modules
    • Two LIN and UART communication interfaces (LINFlexD) modules
    • One μs-bus channel (composed by one DSPI and one LINFlexD)
    • Four SENT channels
    • Two modular controller area network (M_CAN) modules
    • Fast Ethernet controller (FEC)
    • Fast Asynchronous Serial Transmission (LFAST)
    • Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
    • Device and board test support per Joint Test Action Group (JTAG) (IEEE 1149.1 and IEEE 1149.7)
    • Single 5 V +/-10% Power supply supporting cold start conditions (down to 3.0 V)
    • Self Test capability
    • Designed for eTQFP80 and eTQFP100

样片和购买

产品型号
供货状态
包装类型
CPU Clock Frequency (MHz) (max)
Flash Size (kB) (Data)
Features set
温度(ºC) 预算价格(US$)
More info
从分销商订购
从ST订购
min
max
SPC572L60E3BC6AR
建议
Tape And Reel 80 32 4.5-5.5V -40 105 -
MORE INFO

数量:

-

ECCN (US):

-

Country of Origin:

-

没有经销商,请联系我们的销售办事处
SPC572L60E3BC6AY
建议
Tray 80 32 4.5-5.5V -40 105 -
MORE INFO

数量:

-

ECCN (US):

-

Country of Origin:

-

没有经销商,请联系我们的销售办事处
SPC572L60E3BC4AR
建议
Tape And Reel 64 32 4.5-5.5V -40 105 -
MORE INFO

数量:

-

ECCN (US):

-

Country of Origin:

-

没有经销商,请联系我们的销售办事处

SPC572L60E3BC6AR

供货状态

建议

包装类型

Tape And Reel

单价(US$)

*

CPU Clock Frequency (MHz) (max)

80

Flash Size (kB) (Data)

32

Features set

4.5-5.5V

Operating Temperature (°C)

(min)

-40

(max)

105

单价(US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

SPC572L60E3BC6AY

供货状态

建议

包装类型

Tray

单价(US$)

*

CPU Clock Frequency (MHz) (max)

80

Flash Size (kB) (Data)

32

Features set

4.5-5.5V

Operating Temperature (°C)

(min)

-40

(max)

105

单价(US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

SPC572L60E3BC4AR

供货状态

建议

包装类型

Tape And Reel

单价(US$)

*

CPU Clock Frequency (MHz) (max)

64

Flash Size (kB) (Data)

32

Features set

4.5-5.5V

Operating Temperature (°C)

(min)

-40

(max)

105

单价(US$)

-

数量

-

ECCN (US)

-

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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软件

支持和应用

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技术文档

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产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
SPC572L60E3BC4AR
建议
TQFP 100 14x14x1.0 1.0 ExpadDown 工业 Ecopack2
SPC572L60E3BC6AR
建议
TQFP 100 14x14x1.0 1.0 ExpadDown 工业 Ecopack2
SPC572L60E3BC6AY
建议
TQFP 100 14x14x1.0 1.0 ExpadDown 工业 Ecopack2

SPC572L60E3BC4AR

Package:

TQFP 100 14x14x1.0 1.0 ExpadDown

Material Declaration**:

Marketing Status

建议

Package

TQFP 100 14x14x1.0 1.0 ExpadDown

Grade

Industrial

RoHS Compliance Grade

Ecopack2

SPC572L60E3BC6AR

Package:

TQFP 100 14x14x1.0 1.0 ExpadDown

Material Declaration**:

Marketing Status

建议

Package

TQFP 100 14x14x1.0 1.0 ExpadDown

Grade

Industrial

RoHS Compliance Grade

Ecopack2

SPC572L60E3BC6AY

Package:

TQFP 100 14x14x1.0 1.0 ExpadDown

Material Declaration**:

Marketing Status

建议

Package

TQFP 100 14x14x1.0 1.0 ExpadDown

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.