SPC574S60E3

批量生产
Design Win Education

用于汽车底盘和安全应用的32位Power Architecture MCU

下载数据手册
概述
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
开始
Partner products
Sales Briefcase

产品概述

描述

The SPC574Sx is a family of next generation microcontrollers built on the Power Architecture embedded category.

The SPC574Sx family of 32-bit microcontrollers is the latest achievement in integrated automotive application controllers. It belongs to an expanding family of automotive-focused products designed to address the next wave of Chassis and Safety electronics applications within the vehicle. The advanced and cost-efficient host processor core of this automotive controller family complies with the Power Architecture embedded category and only implements the VLE (variable-length encoding) APU, providing improved code density. It operates at speeds of up to 140 MHz and offers high performance processing optimized for low power consumption. It capitalizes on the available development infrastructure of current Power Architecture devices and is supported with software drivers, operating systems and configuration code to assist with users implementations.

  • 所有功能

    • AEC-Q100 qualified
    • High performance e200z4d dual core
      • 32-bit Power Architecture technology CPU
      • Core frequency as high as 140 MHz
      • Dual issue 5-stage pipeline in-order execution core
      • Variable Length Encoding (VLE)
      • Core MPU
      • Floating Point, End-to-End Error Correction
      • 8 KB instruction cache with error detection code
      • 32 KB local data RAM and 4 KB data cache along with 8 KB instruction cache
    • 1600 KB (1.5 MB code + 64 KB data) on-chip flash memory: supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
    • 128 KB on-chip RAM (96 KB on chip RAM + 32 KB local data RAM)
    • Multi-channel direct memory access controller (eDMA) with 32 channels
    • Comprehensive new generation ASILD safety concept
      • ASILD SEooC approach (Safety Element out of Context)
      • FCCU for collection and reaction to failure notifications
      • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
      • End-to-end Error Correction Code (e2eECC) logic
      • Cyclic redundancy check (CRC) unit
    • 8 enhanced 12-bit SAR analog converters
      • 2 sets of: 3 ADCs and one supervisor ADC
      • 1.5 µs conversion time at 12 MHz
      • Up to 32 physical channels
      • Dual Programmable CTU
    • 4 general purpose eTimer units (6 channels each)
    • 4 FlexPWM units
      • 2 (4 channels each) used for motor control with hardware synchronization between the control systems
      • 2 (2 channels each) used for SWG emulation
    • Communication interfaces
      • 4 LINFlexD modules
      • 4 deserial serial peripheral interface (DSPI) modules
      • 2 MCAN interfaces with advanced shared memory scheme (808 x 32-bit words for MCAN0 and 520 x 32-bit words for MCAN1) and CAN-FD support
      • 1 FlexRay module with 2 channels, 128 message buffers
      • 2 SENT interfaces (3 channels each)
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus Class 3 debug and trace interface
    • On-chip CAN/UART Bootstrap loader with BAF. Physical Interface (PHY) can be UART
    • Advanced and flexible supply scheme
      • On-chip voltage regulator for 1.2 V core logic supply. Bypass mode supported for external 1.2 V core logic supply
      • 3.3 V or 5 V IO and ADC supply (2 independent power domains available)
    • Junction temperature range -40 °C to 150 °C

您可能还会喜欢...

EDA符号、封装和3D模型

STMicroelectronics - SPC574S60E3

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
SPC574S60E3CE0AR
批量生产
TQFP 100 14x14x1.0 Automotive Safety Ecopack2
SPC574S60E3CE0AY
批量生产
TQFP 100 14x14x1.0 Automotive Safety Ecopack2

SPC574S60E3CE0AR

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

SPC574S60E3CE0AY

Package:

TQFP 100 14x14x1.0

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TQFP 100 14x14x1.0

Grade

Automotive Safety

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

Swipe or click the button to explore more details Don't show this again
产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) CPU Clock Frequency (MHz) (max)
Budgetary Price (US$)*/Qty
Flash Size (kB) (Data)
Features set
单价(US$)
Country of Origin
最小值
最大值
SPC574S60E3CE0AY Available at distributors

经销商的可用性 SPC574S60E3CE0AY

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
5A991.b.4.a NEC Tray TQFP 100 14x14x1.0 -40 125 140

64

-

12.9

MALTA

SPC574S60E3CE0AR Available at distributors

经销商的可用性 SPC574S60E3CE0AR

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
5A991.b.4.a NEC Tape and Reel TQFP 100 14x14x1.0 -40 125 140

64

-

12.9

MALTA

SPC574S60E3CE0AY 批量生产

封装:
TQFP 100 14x14x1.0
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-

产品型号:

SPC574S60E3CE0AY

ECCN (EU):

NEC

包装类型:

Tray

Operating Temperature (°C)

Min:

-40

Max:

125

CPU Clock Frequency (MHz) (max):

140

Flash Size (kB) (Data):

64

Features set:

-

Country of Origin:

MALTA

SPC574S60E3CE0AR 批量生产

封装:
TQFP 100 14x14x1.0
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-

产品型号:

SPC574S60E3CE0AR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

125

CPU Clock Frequency (MHz) (max):

140

Flash Size (kB) (Data):

64

Features set:

-

Country of Origin:

MALTA

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商