产品概述
-
所有功能
- AEC-Q100 qualified
- High performance e200z4 triple core:
- 32-bit Power Architecture technology CPU
- Core frequency as high as 180 MHz
- Variable Length Encoding (VLE)
- Floating Point, End-to-End Error Correction
- 6582 KB (6144 KB code flash+ 256 KB data flash) on-chip flash memory:
- supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
- Supports read while read between the two code Flash partitions.
- 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM): 64KB in CPU_0, 64 KB in CPU_1 and 32 KB in CPU_2
- 182 KB HSM dedicated flash memory (144 KB code + 32 KB data)
- Multi-channel direct memory access controller (eDMA)
- one eDMA with 64 channels
- one eDMA with 32 channels
- 1 interrupt controller (INTC)
- Comprehensive new generation ASIL-D safety concept:
- ASIL-D of ISO 26262
- One CPU channel in lockstep
- Logic BIST
- FCCU for collection and reaction to failure notifications
- Memory BIST
- Cyclic redundancy check (CRC) unit
- Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
- Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
- Body cross triggering unit (BCTU)
- Triggers ADC conversions from any eMIOS channel
- Triggers ADC conversions from up to 2 dedicated PIT_RTIs
- Enhanced modular IO subsystem (eMIOS): up to 64 timed IO channels with 16-bit counter resolution
- Enhanced analog-to-digital converter system with:
- 4 independent fast 12-bit SAR analog converters
- One supervisor 12-bit SAR analog converter
- One standby 10-bit SAR analog converter
- Communication interfaces:
- 18 LINFlexD modules
- 10 deserial serial peripheral interface (DSPI) modules
- 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
- Dual-channel FlexRay controller
- Two independent Ethernet controllers 10/100Mbps compliant IEEE 802.3-2008
- Low power capabilities
- Versatile low power modes
- Ultra low power standby with RTC
- Smart Wake-up Unit for contact monitoring
- Fast wakeup schemes
- Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
- Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard
- Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
- Junction temperature range -40 °C to 150 °C
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EDA符号、封装和3D模型
STMicroelectronics - SPC58NG84C3
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| SPC58NG84C3GEC0X | 批量生产 | FPBGA 17X17X1.8 292 B0.55 P0.8 | Automotive Safety | Ecopack2 | |
| SPC58NG84C3QTH0X | 批量生产 | FPBGA 17X17X1.8 292 B0.55 P0.8 | Automotive Safety | Ecopack2 | |
| SPC58NG84C3QTH0Y | 批量生产 | FPBGA 17X17X1.8 292 B0.55 P0.8 | Automotive Safety | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | CPU Clock Frequency (MHz) (max) | Flash Size (kB) (Data) | Features set | Country of Origin | Budgetary Price (US$)*/Qty | Flash Size (kB) (Data) | Features set | 单价(US$) | Country of Origin | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | ||||||||||||||||||
| SPC58NG84C3QTH0Y | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 5A991.b.4.a | NEC | Tray | FPBGA 17X17X1.8 292 B0.55 P0.8 | -40 | 125 | 180 | 256 | - | MALTA | | 256 | - | 31 | MALTA | ||
| SPC58NG84C3QTH0X | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 5A991.b.4.a | NEC | Tape and Reel | FPBGA 17X17X1.8 292 B0.55 P0.8 | -40 | - | 180 | 256 | - | MALTA | | 256 | - | 27.8 | MALTA | ||
| SPC58NG84C3GEC0X | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | 5A991.b.4.a | NEC | Tape and Reel | FPBGA 17X17X1.8 292 B0.55 P0.8 | -40 | 105 | 180 | 256 | - | MALTA | | 256 | - | 30.7 | MALTA | ||
SPC58NG84C3QTH0Y 批量生产
封装:
FPBGA 17X17X1.8 292 B0.55 P0.8
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
SPC58NG84C3QTH0X 批量生产
封装:
FPBGA 17X17X1.8 292 B0.55 P0.8
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
SPC58NG84C3GEC0X 批量生产
封装:
FPBGA 17X17X1.8 292 B0.55 P0.8
ECCN (US):
5A991.b.4.a
Budgetary Price (US$)*/Qty:
-
distributors
无法联系到经销商，请联系我们的销售办事处
Don't show this again