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  • 主要特性

    • AEC-Q100 qualified
    • High performance e200z4 triple core:
      • 32-bit Power Architecture technology CPU
      • Core frequency as high as 180 MHz
      • Variable Length Encoding (VLE)
      • Floating Point, End-to-End Error Correction
    • 6582 KB (6144 KB code flash+ 256 KB data flash) on-chip flash memory:
      • supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
      • Supports read while read between the two code Flash partitions.
    • 608 KB on-chip general-purpose SRAM (in addition to 160 KB core local data RAM): 64KB in CPU_0, 64 KB in CPU_1 and 32 KB in CPU_2
    • 182 KB HSM dedicated flash memory (144 KB code + 32 KB data)
    • Multi-channel direct memory access controller (eDMA)
      • one eDMA with 64 channels
      • one eDMA with 32 channels
    • 1 interrupt controller (INTC)
    • Comprehensive new generation ASIL-D safety concept:
      • ASIL-D of ISO 26262
      • One CPU channel in lockstep
      • Logic BIST
      • FCCU for collection and reaction to failure notifications
      • Memory BIST
      • Cyclic redundancy check (CRC) unit
      • Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
    • Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
    • Body cross triggering unit (BCTU)
      • Triggers ADC conversions from any eMIOS channel
      • Triggers ADC conversions from up to 2 dedicated PIT_RTIs
    • Enhanced modular IO subsystem (eMIOS): up to 64 timed IO channels with 16-bit counter resolution
    • Enhanced analog-to-digital converter system with:
      • 4 independent fast 12-bit SAR analog converters
      • One supervisor 12-bit SAR analog converter
      • One standby 10-bit SAR analog converter
    • Communication interfaces:
      • 18 LINFlexD modules
      • 10 deserial serial peripheral interface (DSPI) modules
      • 8 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
      • Dual-channel FlexRay controller
      • Two independent Ethernet controllers 10/100Mbps compliant IEEE 802.3-2008
    • Low power capabilities
      • Versatile low power modes
      • Ultra low power standby with RTC
      • Smart Wake-up Unit for contact monitoring
      • Fast wakeup schemes
    • Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
    • Nexus development interface (NDI) per IEEEISTO 5001-2003 standard, with some support for 2010 standard
    • Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
    • Junction temperature range -40 °C to 150 °C

样片和购买

产品型号
供货状态
包装类型
CPU Clock Frequency (MHz) (max)
Flash Size (kB) (Data)
Features set
温度(ºC) 预算价格(US$)
更多信息
从分销商订购
从ST订购
min
max
SPC58NG84C3GEC0X
Active
Tape And Reel 180 256 - - - 25.4
更多信息

数量:

1000

ECCN (US):

5A991B4A

Country of Origin:

-

No availability of distributors reported, please contact our sales office

SPC58NG84C3GEC0X

供货状态

批量生产

包装类型

Tape And Reel

Unit Price (US$)

25.4*

CPU Clock Frequency (MHz) (max)

180

Flash Size (kB) (Data)

256

Features set

-

Operating Temperature (°C)

(min)

-

(max)

-

Unit Price (US$)

25.4

数量

1000

ECCN (US)

5A991B4A

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

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技术文档

    • 描述 版本 文档大小 操作
      DS11758
      32-bit Power Architecture microcontroller for automotive ASIL-D applications
      6.0
      2.39 MB
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      AN5173
      Notes on EDC after ECC functionality
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      154.73 KB
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      AN5011
      SPC58xCx/SPC58xG8x Getting Started
      2.0
      560.83 KB
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      SPC58xGx self-test procedures
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      749.73 KB
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      AN5266
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      1.0
      1.12 MB
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      AN5171
      Windriver support on SPC5Studio
      1.0
      1.26 MB
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      Notes on EDC after ECC functionality

      AN5011

      SPC58xCx/SPC58xG8x Getting Started

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      SPC58xNx/SPC58xEx/SPC58xGx FCCU fault sources and reaction

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      Windriver support on SPC5Studio

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      TN1239
      How to change DCF STCU configuration
      1.0
      225.2 KB
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      TN1296
      I2S emulation on DSPI
      1.0
      380.75 KB
      PDF
      TN1289
      SPC58 line - How to use the Memory Protection Layers
      1.1
      1.28 MB
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      TN1264
      SPC584Gx, SPC58EGx, SPC58NGx IO definition: signal description and input multiplexing tables
      2.0
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      TN1286
      SPC58NG84C3GXC0X documentation addendum
      1.0
      182.97 KB
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      TN1271
      SPC58xB/C/G Low Power Modes
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产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
SPC58NG84C3GEC0X
Active
FPBGA 17X17X1.8 292 汽车 Ecopack2

SPC58NG84C3GEC0X

Package:

FPBGA 17X17X1.8 292

Material Declaration**:

PDF XML

Marketing Status

Active

Package

FPBGA 17X17X1.8 292

Grade

Automotive

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.