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The SPC58 H Line is a general-purpose MCU targeting high-end Body, Networking and Security applications. SPC58 H Line extends the Chorus Series of successful 40nm Automotive MCUs. and offers a seamless extension with compatible devices from 2 M up to 10 Mbytes Flash. Combining the 3x PowerPC cores (200Mhz) with a rich set of communication interfaces like 2x Ethernet, 16x ISO CAN FD and 24x LIN, it introduces new features to support Connected Gateway applications with Gigabit ethernet MAC for fast download, an hyperbus interface to extend the internal RAM and the eMMC interface to allow big data file storage.
To manage OTA update while the application keeps running, the 10 Mbyte flash can be programmed in background and its context swapped on reset.
The Smart Standby domain including RAM, RTC, ADC and a new low power SPI module increases the contact monitoring capability keeping the consumption extremely low (< 160 μA) and guaranteeing a fast start-up on wake-up event (< 500 μs).
The SPC58 H Line offers the highest performance and integrated devices available in high-efficiency pin count packages like eTQFP144 fully scalable up to FPBGA386. Designed according to ISO 26262, the SPC58 H Line supports ASIL-B/D offering 1 lockstep core as well as a EVITA full Security supporting asymmetric keys. With its 100 Mbit IPC the Chorus H Line is designed for system scalability coupling 2 Chorus H devices to build a system with 6 cores, 20 Mbytes flash and 2x Gigabit ethernet.主要特性
- AEC-Q100 qualified
- High performance e200z4 triple core:
- 32-bit Power Architecture technology CPU
- Core frequency as high as 200 MHz
- Variable Length Encoding (VLE)
- Floating Point, End-to-End Error Correction
- 10496 KB (10240 KB code Flash + 256 KB data Flash) on-chip Flash memory:
- Supports read during program and erase operations, and multiple blocks allowing EEPROM emulation
- Supports read while read between the two code Flash partitions
- Hardware support for Flash context switching (for FOTA with multi software versions)
- 1088 KB on-chip general-purpose SRAM (in addition to 192 KB core local data RAM):
- 64 KB in CPU_0, 64 KB in CPU_1 and 64 KB in CPU_2
- 224 KB HSM dedicated Flash memory (192 KB code + 32 KB data)
- Multi-channel direct memory access controller (eDMA):
- One eDMA with 64 channels
- One eDMA with 16 channels
- One interrupt controller (INTC)
- Comprehensive new generation ASIL-D safety concept:
- ASIL-D of ISO 26262
- One CPU channel in lockstep
- Logic BIST
- FCCU for collection and reaction to failure notifications
- Memory BIST
- Cyclic redundancy check (CRC) unit
- Memory Error Management Unit (MEMU) for collection and reporting of error events in memories
- Crossbar switch architecture for concurrent access to peripherals, Flash, or RAM from multiple bus masters with end-to-end ECC
- Body cross triggering unit (BCTU):
- Triggers ADC conversions from any eMIOS channel
- Triggers ADC conversions from up to 2 dedicated PIT_RTIs
- Enhanced modular IO subsystem (eMIOS):
- up to 96 timed IO channels with 16-bit counter resolution
- Enhanced analog-to-digital converter system with:
- 4 independent fast 12-bit SAR analog converters
- One supervisor 12-bit SAR analog converter
- One standby 10-bit SAR analog converter
- 100 ADC channels
- Communication interfaces:
- 24 LINFlexD modules
- 10 deserial serial peripheral interface (DSPI) modules
- 1 deserial serial peripheral interface (DSPI_LP) module available in low power mode
- 16 MCAN interfaces with advanced shared memory scheme and ISO CAN-FD support
- Dual-channel FlexRay controller
- One SD/SDIO/eMMC module
- One OctalSPI module with double Chip Select
- Two independent Ethernet controllers, one 10/100Mbps and the other one 10/100Mbps or 1Gbps, compliant IEEE 802.3-2008 and OPEN RGMII EPL v2.3
- Four I2C modules
- Two PSI5 modules
- Low power capabilities:
- Versatile low power modes
- Ultra low power standby with RTC
- Smart Wake-up Unit for contact monitoring
- Fast wakeup schemes
- Dual phase-locked loops with stable clock domain for peripherals and FM modulation domain for computational shell
- Nexus development interface (NDI) per IEEE-ISTO 5001-2003 standard, with some support for 2010 standard
- Boot assist Flash (BAF) supports factory programming using a serial bootload through the asynchronous CAN or LIN/UART
- Low power supply options:
- Single internal linear regulator with external ballast
- External low voltage supply (1.2 V)
- Temperature range:
- -40 °C to 105 °C
- -40 °C to 125 °C
精选 视频
First Automotive MCUs introducing Phase Change Memory (PCM)
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - SPC58NH92C5
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
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3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| SPC58NH92C5RMH0X |
目标
|
FPBGA 19X19X1.8 386 | 汽车应用 | Ecopack2 |
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SPC58NH92C5RMH0X
Package:
FPBGA 19X19X1.8 386Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | CPU Clock Frequency (MHz) (max) | Flash Size (kB) (Data) | Features set | Country of Origin | Budgetary Price (US$)*/Qty | 更多信息 | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||||||
| SPC58NH92C5RMH0X | 无法联系到经销商，请联系我们的销售办事处 |
目标
|
5A991B4A | 5A002A4 | Tray | FPBGA 19X19X1.8 386 | -40 | 125 | 200 | 256 | - | FRANCE | ||||
供货状态
目标ECCN (US)
5A991B4ABudgetary Price (US$)*/Qty
