STiD135

批量生产
Design Win

卫星全带多调谐器解调器

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概述
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样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
Partner products
Sales Briefcase

产品概述

描述

The STiD135 has been designed for Satellite Broadband applications, leveraging Ka-band and multi-spot beam technology carried by the latest high-throughput satellites (HTSs). The STiD135 has been designed to enable single-carrier usage of HTS transponders. The device implements two high-symbol-rate (HSR) demodulators compliant with Annex M of the DVB-S2/S2X specification, and provides full hardware support for network clock recovery (NCR) in order to enable external return-channel modulators.
The STiD135 may be used in standard broadcast environments as an 8-channel DVB-S2/S2X receiver enabling multi-channel distribution and/or fast channel change scenarios.
Acknowledgement
(1)The HSR feature was designed in partnership with the CNES
  • 所有功能

    • Two high-symbol-rate (HSR)(1)demodulators:
      • Maximum baud rate 500 Msymbol/s
      • Up to two slices each
      • DVB-S2/S2X and Annex M compliant
    • Up to 8 multi-standard demodulators:
      • S/S2/S2X/DTV
    • Four integrated full-band tuners and ADCs
    • High-speed digital multiplexer to connect any tuner to any demodulator
    • Network clock recovery (NCR) support
    • Flexible transport stream processor:
      • PID filtering, PCR re-stamping and re-labelling, GSE label filtering
      • TS merger (multiplex)
      • Channel bonding
    • Low power consumption
    • Wake-on-network PID or GSE label
    • Fast auto scan
    • Signal monitoring, spectral analysis, bit error rate test and reporting
    • Interfaces:
      • Crystal oscillator
      • I2C serial bus interface, including private repeater for optional LNA
      • Transport stream output: 8 serial, 2 parallel or multiplexed
      • JTAG for boundary scan
      • DiSEqC 1.x and DiSEqC2.x compatible receiver, 22-kHz
      • FSK modem
      • Flexible GPIOs and interrupts
    • Technology:
      • Single rail supply with inbuilt SMPSs
      • Fine-grained power management
      • VQFPN-mr 13x13 mm2 package, RoHS
      • Temperature range -40 to +85 °C ambient

EDA符号、封装和3D模型

STMicroelectronics - STiD135

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STID135-WB
批量生产
VQFPN-MR 13X13 160 工业 Ecopack2

STID135-WB

Package:

VQFPN-MR 13X13 160

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VQFPN-MR 13X13 160

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
STID135-WB 无法联系到经销商,请联系我们的销售办事处
批量生产
3A991.a.2 NEC Tray VQFPN-MR 13X13 160 - - CHINA

STID135-WB

供货状态

批量生产

ECCN (US)

3A991.a.2

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tray

封装

VQFPN-MR 13X13 160

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Budgetary Price (US$)* / Qty

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商