STiD337

建议
Design Win

卫星收发器基于ARM® Cortex®的SoC,具有集成的DVB-S2/S2X正向链路和用于返回链路的IQ流转化器

下载数据摘要
概述
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
开始
Partner products
Sales Briefcase

产品概述

描述

The STiD337 is a system-on-chip (SoC) for interactive satellite applications that includes an integrated DVB-S2/S2X demodulator for the satellite forward link with flexible GSE and MPEG-TS PID filtering. The compute platform is based on a dual-core ARM®Cortex®-A9 architecture with Neon™ coprocessors and multiple ST231 DSP offload processors.
The return link implements an IQ streamer which streams a linked list of pre-calculated data to the integrated 10-bit DACs for IQ output to external up-converters.
Accurate Network clock recovery (NCR) with precision real-time control is implemented for the most demanding applications.
Multiple interfaces such as integrated Ethernet physical layer (PHY), USB, PCIe, VCXO, GPIO, SPI, I2C, and I2S are included to provide a complete low-cost satellite modem.
  • 所有功能

    • Integrated DVB-S/S2/S2X demodulator
    • Dual core ARM®Cortex®-A9 application CPU:
      • Up to 1.2 GHz and 6000 DMIPS
      • NEON™ accelerator
      • 512-Kbyte L2 cache
    • DDR3/3L 16-bit interface running at up to 1066 MHz (DDR3-2133)
    • Integrated ARM®Cortex®-M4 standby controller with low-power micro and power islands
    • Quad ST231 offload CPUs
    • IQ data pipe and streaming engine to high-speed DACs
    • Sample-rate conversion filter including root-raised-cosine
    • High-speed IQ signal DACs
    • High-precision low-speed DACs
    • Connectivity:
      • 2 x USB 2.0 ports
      • 1 x PCIe port
      • 1 x SD card
      • 1 x eMMC
      • 1 x RGMII muxed with internal Ethernet PHY
      • 4 x input transport streams
      • 6 x UART
      • 9 x I2C
    • Package: FCBGA 16 mm x 16 mm, 0.65 mm pitch, 552 balls

EDA符号、封装和3D模型

STMicroelectronics - STiD337

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STID337-DCB
NRND
FCBGA16X16 工业 Ecopack2
STID337-YCB
NRND
FCBGA16X16 工业 Ecopack2
STiD337
建议
- 工业 -

STID337-DCB

Package:

FCBGA16X16

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

FCBGA16X16

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STID337-YCB

Package:

FCBGA16X16

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

FCBGA16X16

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STiD337

Package:

-

Material Declaration**:

Marketing Status

建议

Package

-

Grade

Industrial

RoHS Compliance Grade

-

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

Swipe or click the button to explore more details Don't show this again
产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
STiD337 无法联系到经销商,请联系我们的销售办事处
建议
- - - - - - -
STID337-DCB 无法联系到经销商,请联系我们的销售办事处
NRND
3A991.a.2 NEC Tray FCBGA16X16 - - CHINA
STID337-YCB 无法联系到经销商,请联系我们的销售办事处
NRND
3A991.a.2 NEC Tray FCBGA16X16 - - CHINA

STiD337 建议

封装:
-
ECCN (US):
-
Budgetary Price (US$)*/Qty:
-

产品型号:

STiD337

ECCN (EU):

-

包装类型:

-

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

-

无法联系到经销商,请联系我们的销售办事处

STID337-DCB NRND

封装:
FCBGA16X16
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

产品型号:

STID337-DCB

ECCN (EU):

NEC

包装类型:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

CHINA

无法联系到经销商,请联系我们的销售办事处

STID337-YCB NRND

封装:
FCBGA16X16
ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

产品型号:

STID337-YCB

ECCN (EU):

NEC

包装类型:

Tray

Operating Temperature (°C)

Min:

-

Max:

-

Country of Origin:

CHINA

无法联系到经销商,请联系我们的销售办事处
Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商