STiD337

建议
Design Win

卫星收发器基于ARM® Cortex®的SoC,具有集成的DVB-S2/S2X正向链路和用于返回链路的IQ流转化器

下载数据摘要

产品概述

描述

The STiD337 is a system-on-chip (SoC) for interactive satellite applications that includes an integrated DVB-S2/S2X demodulator for the satellite forward link with flexible GSE and MPEG-TS PID filtering.

The compute platform is based on a dual-core ARM®Cortex®-A9 architecture with Neon™ coprocessors and multiple ST231 DSP offload processors.

The return link implements an IQ streamer which streams a linked list of pre-calculated data to the integrated 10-bit DACs for IQ output to external up-converters.

Accurate Network clock recovery (NCR) with precision real-time control is implemented for the most demanding applications.

Multiple interfaces such as integrated Ethernet physical layer (PHY), USB, PCIe, VCXO, GPIO, SPI, I2C, and I2S are included to provide a complete low-cost satellite modem.

  • 所有功能

    • Integrated DVB-S/S2/S2X demodulator
    • Dual core ARM®Cortex®-A9 application CPU:
      • Up to 1.2 GHz and 6000 DMIPS
      • NEON™ accelerator
      • 512-Kbyte L2 cache
    • DDR3/3L 16-bit interface running at up to 1066 MHz (DDR3-2133)
    • Integrated ARM®Cortex®-M4 standby controller with low-power micro and power islands
    • Quad ST231 offload CPUs
    • IQ data pipe and streaming engine to high-speed DACs
    • Sample-rate conversion filter including root-raised-cosine
    • High-speed IQ signal DACs
    • High-precision low-speed DACs
    • Connectivity:
      • 2 x USB 2.0 ports
      • 1 x PCIe port
      • 1 x SD card
      • 1 x eMMC
      • 1 x RGMII muxed with internal Ethernet PHY
      • 4 x input transport streams
      • 6 x UART
      • 9 x I2C
    • Package: FCBGA 16 mm x 16 mm, 0.65 mm pitch, 552 balls

EDA符号、封装和3D模型

STMicroelectronics - STiD337

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STID337-DCB
NRND
FCBGA16X16 工业 Ecopack2
STiD337
建议
- 工业 -

STID337-DCB

Package:

FCBGA16X16

Material Declaration**:

PDF XML

Marketing Status

NRND

Package

FCBGA16X16

Grade

Industrial

RoHS Compliance Grade

Ecopack2

STiD337

Package:

-

Material Declaration**:

Marketing Status

建议

Package

-

Grade

Industrial

RoHS Compliance Grade

-

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
供货状态
Budgetary Price (US$)*/Qty
从ST订购
Order from distributors
封装
包装类型
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
温度(ºC)
Operating Temperature (°C) (min)
最小值
最大值
STiD337
Available at distributors

经销商的可用性 STiD337

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
- - - - - - -

-

STID337-DCB
Available at distributors

经销商的可用性 STID337-DCB

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
FCBGA16X16 Tray CHINA 3A991.a.2 NEC - -

-

STiD337 建议

Budgetary Price (US$)*/Qty:
-
封装:
-
包装类型:
-
RoHS:
-
Country of Origin:
-
ECCN (US):
-
ECCN (EU):
-

产品型号:

STiD337

Operating Temperature (°C)

Min:

-

Max:

-

STID337-DCB NRND

Budgetary Price (US$)*/Qty:
-
封装:
FCBGA16X16
包装类型:
Tray
RoHS:
-
Country of Origin:
CHINA
ECCN (US):
3A991.a.2
ECCN (EU):
NEC

产品型号:

STID337-DCB

Operating Temperature (°C)

Min:

-

Max:

-

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商