产品概述
描述
STM32Cube is an STMicroelectronics original initiative to significantly improve developer productivity by reducing development effort, time and cost. STM32Cube covers the whole STM32 portfolio.
STM32Cube includes STM32CubeMX, a graphical software configuration tool that allows the generation of C initialization code using graphical wizards.
It also comprises the STM32CubeC0 MCU Package composed of the STM32Cube hardware abstraction layer (HAL) and the low-layer (LL) APIs, plus a consistent set of middleware components (Azure® RTOS , FileX/LevelX, ThreadX, and OpenBootloader). All embedded software utilities are delivered with a full set of examples running on STMicroelectronics boards.
The STM32Cube HAL is an STM32 embedded software layer that ensures maximized portability across the STM32 portfolio, while the LL APIs make up a fast, light-weight, expert-oriented layer which is closer to the hardware than the HAL. HAL and LL APIs can be used simultaneously with a few restrictions.
Both the HAL and LL APIs are production–ready, checked with CodeSonar® static analysis tool, and developed in compliance with MISRA C® guidelines, following a process certified according to IEC 61508 systematic capability 2 level (SC2). Reports are available on demand.
STM32CubeC0 gathers in one single package all the generic embedded software components required to develop an application on STM32C0 microcontrollers. Following STM32Cube initiative, this set of components is highly portable to other STM32 Series. In addition, the low-layer APIs provide an alternative, high-performance, low-footprint solution to the STM32CubeC0 HAL at the cost of portability and simplicity.
HAL and LL APIs are available in open-source BSD license for user convenience.
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所有功能
- Consistent and complete embedded software that provides hardware abstraction to easily develop end-user firmware
- Maximized portability between all STM32 series supported by STM32Cube
- More than 100 examples and applications for easy understanding, all compatible with STM32CubeMX to facilitate the configuration through a graphical tool
- Production‑ready HAL and LL API drivers, checked with CodeSonar® static analysis tool and developed in compliance with MISRA C® guidelines, following a process certified according to IEC 61508 systematic capability 2 level (SC2)
- CMSIS CORE, DSP, and RTOS software components
- STM32C0 comprehensive middleware offer built around Microsoft® Azure® RTOS middleware, plus OpenBL
- Free-of-charge, user-friendly license terms
- Update mechanism with new-release notification capability
- Published on GitHub in addition to www.st.com to propagate bug fixes and improvements faster, open for pull requests and issues to facilitate user contributions and direct feedback
获取软件
| 产品型号 | 一般描述 | ECCN (EU) | ECCN (US) | 供应商 | Latest version | 下载 |
|---|---|---|---|---|---|---|
| Patch_CubeC0 | Patch for STM32CubeC0 | NEC | 3D991 | ST | 1.0.1 | x 许可协议接受Please indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
| STM32CubeC0 | STM32Cube MCU Package for STM32C0 series | NEC | 3D991 | ST | 1.0.0 | x 许可协议接受Please indicate your acceptance or NON-acceptance by selecting “I ACCEPT” or “I DO NOT ACCEPT” as indicated below in the media. BY INSTALLING COPYING, DOWNLOADING, ACCESSING OR OTHERWISE USING THIS SOFTWARE PACKAGE OR ANY PART THEREOF (AND THE RELATED DOCUMENTATION) FROM STMICROELECTRONICS INTERNATIONAL N.V, SWISS BRANCH AND/OR ITS AFFILIATED COMPANIES (STMICROELECTRONICS), THE RECIPIENT, ON BEHALF OF HIMSELF OR HERSELF, OR ON BEHALF OF ANY ENTITY BY WHICH SUCH RECIPIENT IS EMPLOYED AND/OR ENGAGED AGREES TO BE BOUND BY THIS SOFTWARE PACKAGE LICENSE AGREEMENT. Under STMicroelectronics’ intellectual property rights and subject to applicable licensing terms for any third-party software incorporated in this software package and applicable Open Source Terms (as defined here below), the redistribution, reproduction and use in source and binary forms of the software package or any part thereof, with or without modification, are permitted provided that the following conditions are met:
THIS SOFTWARE PACKAGE IS PROVIDED BY STMICROELECTRONICS AND CONTRIBUTORS "AS IS" AND ANY EXPRESS, IMPLIED OR STATUTORY WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE AND NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS ARE DISCLAIMED TO THE FULLEST EXTENT PERMITTED BY LAW. IN NO EVENT SHALL STMICROELECTRONICS OR CONTRIBUTORS BE LIABLE FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUENTIAL DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, STRICT LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY WAY OUT OF THE USE OF THIS SOFTWARE PACKAGE, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGE. EXCEPT AS EXPRESSLY PERMITTED HEREUNDER AND SUBJECT TO THE APPLICABLE LICENSING TERMS FOR ANY THIRD-PARTY SOFTWARE INCORPORATED IN THE SOFTWARE PACKAGE AND OPEN SOURCE TERMS AS APPLICABLE, NO LICENSE OR OTHER RIGHTS, WHETHER EXPRESS OR IMPLIED, ARE GRANTED UNDER ANY PATENT OR OTHER INTELLECTUAL PROPERTY RIGHTS OF STMICROELECTRONICS OR ANY THIRD PARTY. |
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| 1.0 | 10 Jan 2023 | 10 Jan 2023 |
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| 1.0 | 22 Jul 2022 | 22 Jul 2022 |
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| 1.0 | 28 Oct 2022 | 28 Oct 2022 | ||
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| 2.0 | 10 Jul 2019 | 10 Jul 2019 |
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| 22.08 | 10 Aug 2022 | 10 Aug 2022 | ||
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