BAL-CC1101-01D3

批量生产

50 Ω标称输入/平衡-不平衡变换器与CC1101共轭匹配,具有集成谐波滤波器

下载数据手册
概述
样片和购买
解决方案
资源
工具与软件
质量与可靠性
eDesignSuite
开始
Partner products
Sales Briefcase
  • STMicroelectronics BAL-CC1101-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. This has been customized for the CC1101 / CC1150 TI transceiver.

    It’s a design using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance.

    主要特性

    • 50 Ω nominal input / conjugate match to CC1101 / CC1150
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated Flip-Chip on glass
    • Small footprint: < 2.1 mm²

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS10072
      50 ohm nominal input / conjugate match balun to CC1101 / CC1150 (868-928 MHz), with integrated harmonic filter
      3.0
      636.58 KB
      PDF
      DS10072

      50 ohm nominal input / conjugate match balun to CC1101 / CC1150 (868-928 MHz), with integrated harmonic filter

    • 描述 版本 文档大小 操作
      AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
      2.2
      687.23 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
      433.12 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

    • 描述 版本 文档大小 操作
      Products and solutions for Smart industry 3.0
      3.32 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      PDF

      Products and solutions for Smart industry

      Semiconductor solutions for healthcare applications

质量与可靠性

产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
BAL-CC1101-01D3
批量生产
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BAL-CC1101-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
封装
包装类型
Minimum Sellable Quantity
供货状态
ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
BAL-CC1101-01D3 没有经销商,请联系我们的销售办事处 Chip Scale Package 0.4mm pitch Tape And Reel 5000
批量生产
EAR99 FRANCE

BAL-CC1101-01D3

封装

Chip Scale Package 0.4mm pitch

包装类型

Tape And Reel

Budgetary Price (US$)*/Qty

Minimum Sellable Quantity

5000

供货状态

批量生产

Budgetary Price (US$)* / Qty

ECCN (US)

EAR99

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商