BAL-WILC10-01D3

批量生产

50 Ω / 与WILC1000平衡-不平衡变换器共轭匹配

下载数据手册
概述
样片和购买
解决方案
Documentation
CAD Resources
工具与软件
质量与可靠性
eDesignSuite
开始
Partner products
Sales Briefcase
  • This device is an ultra-miniature matched balun. Matching impedance has been optimized for the ATMEL SmartConnect WILC1000 Wireless Link Controller. It is using STMicroelectronics IPD technology on non-conductive glass substrate which optimizes RF performance.

    主要特性

    • 2.45 GHz Balun with integrated matching network
    • Matching optimized for ATMEL WILC1000
    • Low insertion loss
    • Low amplitude imbalance
    • Coated Flip-Chip on glass
    • Small footprint < 0.90 mm²

特别推荐

EDA Symbols, Footprints and 3D Models

STMicroelectronics - BAL-WILC10-01D3

Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.

Symbols

Symbols

Footprints

Footprints

3D model

3D models

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
BAL-WILC10-01D3
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack2

BAL-WILC10-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
更多信息
最小值
最大值
BAL-WILC10-01D3 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch - - 5000
更多信息

单价(US$):

-

Country of Origin:

FRANCE

BAL-WILC10-01D3

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商