BALF-2690-02D3

批量生产

50 Ω标称输入/平衡-不平衡变换器与STLC2690共轭匹配,具有集成谐波滤波器

下载数据手册 样片和购买
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样片和购买
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质量与可靠性
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  • STMicroelectronics BALF-2690-02D3 is a balun design to transform single ended signal to differential signals in Bluetooth applications. This BALF-2690-02D3 has been customized for STLC2690 Bluetooth transceiver with less than 1.2 dB insertion losses in the bandwidth (2400 MHz-2500 MHz).

    The BALF-2690-02D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate which optimize RF performance.

    主要特性

    • 50 Ω nominal input / matched output differential impedance
    • Integrated harmonic filter
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Small footprint < 1.54 mm²

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS9922
      50 ohm nominal input / conjugate match balun for STLC2690, with integrated harmonic filter
      4.0
      508.05 KB
      PDF
      DS9922

      50 ohm nominal input / conjugate match balun for STLC2690, with integrated harmonic filter

    • 描述 版本 文档大小 操作
      AN4315
      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers
      2.2
      687.23 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4315

      BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
      433.12 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      balf-2690-02d3 OrCad Symbol and Footprint files 1.2
      13.82 KB
      ZIP

      balf-2690-02d3 OrCad Symbol and Footprint files

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
      951.55 KB
      PDF

      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

    • 描述 版本 文档大小 操作
      Products and solutions for Smart industry 3.0
      3.32 MB
      PDF
      Semiconductor solutions for healthcare applications 1.0
      665.18 KB
      PDF

      Products and solutions for Smart industry

      Semiconductor solutions for healthcare applications

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
BALF-2690-02D3
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack2

BALF-2690-02D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
更多信息
最小值
最大值
BALF-2690-02D3 没有经销商,请联系我们的销售办事处 立即购买
批量生产
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch - - 5000
更多信息

单价(US$):

-

Country of Origin:

FRANCE

BALF-2690-02D3

供货状态

批量生产

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商