BALF-ATM-01E3

批量生产

50 ohms / matched to ATSAMR21E18 balun transformer, with integrated harmonic filter

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  • The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.

    主要特性

    • 2.4 – 2.5 GHz balun with integrated matching network
    • Matching optimized for following chipsets: ATSAMR21E18
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Coated CSP on glass bumpless
    • Small footprint 2.5 mm²

样片和购买

产品型号
封装
包装类型
Minimum Sellable Quantity
供货状态
ECCN (US)
Country of Origin
Approximate Price (US$)* / Qty
从ST订购
从分销商订购
BALF-ATM-01E3 FLIP CHIP BUMPLESS CSPG Tape And Reel 5000
批⁠量⁠生⁠产
EAR99 CHINA 0.43 查看供货情况

...的经销商可用性BALF-ATM-01E3

代理商名称
地区 库存 最小订购量 第三方链接
Farnell Element14 EUROPE 200 1 马上订购

代理商库存报告日期: 2020-03-27

代理商名称

Farnell Element14

库存

200

Min.Order

1

地区

EUROPE 马上订购

代理商库存报告日期: 2020-03-27

BALF-ATM-01E3

封装

FLIP CHIP BUMPLESS CSPG

包装类型

Tape And Reel

Approximate Price (US$)* / Qty

0.43

...的经销商可用性BALF-ATM-01E3

代理商名称
地区 库存 最小订购量 第三方链接
Farnell Element14 EUROPE 200 1 马上订购

代理商库存报告日期: 2020-03-27

代理商名称

Farnell Element14

库存

200

Min.Order

1

地区

EUROPE 马上订购

代理商库存报告日期: 2020-03-27

Minimum Sellable Quantity

5000

供货状态

批⁠量⁠生⁠产

Budgetary Price (US$)* / Qty

0.43

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
BALF-ATM-01E3
批量生产
FLIP CHIP BUMPLESS CSPG Industrial Ecopack2

BALF-ATM-01E3

Package:

FLIP CHIP BUMPLESS CSPG

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

FLIP CHIP BUMPLESS CSPG

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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