The BALF-ATM-01E3 from STMicroelectronics is an integrated balun, which also integrates a matching network in a monolithic glass substrate. Matching impedance has been customized for the ATMEL chip. The device uses STMicroelectronics’ IPD technology on a non-conductive glass substrate to optimize RF performance.
- 2.4 – 2.5 GHz balun with integrated matching network
- Matching optimized for following chipsets: ATSAMR21E18
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Coated CSP on glass bumpless
- Small footprint 2.5 mm²
Smart Antenna Tuning with STMicroelectronics (all LTE bands)
Antenna desense medication with ECMF™ common-mode filters integrating ESD protection
STHVDAC, STPTIC: better sensitivity and longer battery life
|FLIP CHIP BUMPLESS CSPG||工业||Ecopack2|
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.