BALF-SPI-02D3

批量生产

50Ω / Conjugate match to SPIRIT1 433MHz Balun Transformer & Integrated Filtering

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  • STMicroelectronics BALF-SPI-02D3 is an ultra miniature balun. The BALF-SPI-02D3 integrates matching network and harmonics filter. Matching impedance has been customized for the SPIRIT1 ST transceiver.

    The BALF-SPI-02D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.

    主要特性

    • 50 Ω nominal input / conjugate match to SPIRIT1
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Small footprint

样片和购买

产品型号
封装
包装类型
Minimum Sellable Quantity
供货状态
ECCN (US)
Country of Origin
Approximate Price (US$)* / Qty
从ST订购
从分销商订购
BALF-SPI-02D3 Chip Scale Package 0.4mm pitch Tape And Reel 5000
批⁠量⁠生⁠产
EAR99 CHINA 0.52 没有经销商,请联系我们的销售办事处

BALF-SPI-02D3

封装

Chip Scale Package 0.4mm pitch

包装类型

Tape And Reel

Approximate Price (US$)* / Qty

0.52

Minimum Sellable Quantity

5000

供货状态

批⁠量⁠生⁠产

Budgetary Price (US$)* / Qty

0.52

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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技术文档

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      DS10771
      50 Ω nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter
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      587.21 KB
      PDF
      DS10771

      50 Ω nominal input / conjugate match balun to SPIRIT1 434 MHz, with integrated harmonic filter

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      AN4315
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      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
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      AN4315

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      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
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      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      balf-spi-02d3 OrCad Symbol and Footprint files 1.2
      12.59 KB
      ZIP

      balf-spi-02d3 OrCad Symbol and Footprint files

出版刊物和宣传资料

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      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz 1.0
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      Tiniest Matched Baluns for Wifi, Bluetooth & Sub-GHz

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产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
BALF-SPI-02D3
批量生产
Chip Scale Package 0.4mm pitch Industrial Ecopack2

BALF-SPI-02D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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