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This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
主要特性
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
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开发工具硬件
生态系统
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Picture 产品型号 制造商 描述 SIGFOX-MOD1-C XoverIoT The SIGFOX-MOD1 is a ultra-low-power module designed especially for sensor node applications mounted with chip antenna. SIGFOX-MOD1-E XoverIoT The SIGFOX-MOD1-E is an ultra-low-power module designed especially for sensor node applications. Same features as the SIGFOX-MOD1-C but with an U.FL connector for usage of external antennas. 产品型号The SIGFOX-MOD1 is a ultra-low-power module designed especially for sensor node applications mounted with chip antenna.
The SIGFOX-MOD1-E is an ultra-low-power module designed especially for sensor node applications. Same features as the SIGFOX-MOD1-C but with an U.FL connector for usage of external antennas.
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Picture 产品型号 制造商 描述 
X-NUCLEO-S2868A1 ST Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo 产品型号Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo
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| 产品型号 | 供货状态 | 封装 | 等级规格 | 符合RoHS级别 | Material Declaration** |
|---|---|---|---|---|---|
| BALF-SPI2-01D3 | 批量生产 | Chip Scale Package 0.4mm pitch | 工业 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
