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BALF-SPI2-01D3

批量生产
储存到myST

50 Ω标称输入/平衡-不平衡变换器与S2-LP共轭匹配，868 - 930 MHz，具有集成谐波滤波器

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  • This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.

    主要特性

    • 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
    • Low insertion loss
    • Low amplitude imbalance
    • Low phase imbalance
    • Small footprint
    • Very low profile < 620 μm after reflow
    • High RF performance
    • RF BOM and area reduction
    • ECOPACK®2 compliant component
    阅读更多 阅读较少信息

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All resources

产品规格 (1)

Resource title
Latest update
DS12249 50 Ω nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter 2.1
20 Mar 2018
20 Mar 2018
DS12249 50 Ω nominal input / conjugate matched balun to ST S2-LP, 860-930 MHz with integrated harmonic filter 2.1

应用手册 (3)

Resource title
Latest update
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
13 Sep 2018
13 Sep 2018
AN4315 BAL-NRF02D3 matched balun with integrated harmonics filter for Nordic Semiconductor chips with ultralow power transceivers 2.2
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
13 Sep 2018
13 Sep 2018
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0
22 Sep 2015
22 Sep 2015
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

技术文档 (1)

Resource title
Latest update
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0
25 Aug 2020
25 Aug 2020
TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0

宣传册 (2)

Resource title
Latest update
TINIEST MATCHED BALUNS for WiFi, Bluetooth & Sub-GHz 1.0
05 Nov 2020
05 Nov 2020
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25 Feb 2020
25 Feb 2020
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EDA Symbols, Footprints and 3D Models

STMicroelectronics - BALF-SPI2-01D3

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质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
BALF-SPI2-01D3
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack2

BALF-SPI2-01D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML
More Info

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度（ºC） Minimum Sellable Quantity
Budgetary Price (US$)*/Qty
更多信息
最小值
最大值
BALF-SPI2-01D3 Available at 3 distributors

经销商的可用性BALF-SPI2-01D3

代理商名称
地区 库存 最小订购量 第三方链接
FUTURE WORLDWIDE 25 1 马上订购
ARROW EUROPE 19999 0 马上订购
ANGLIA Live EUROPE 5046 1 马上订购

代理商库存报告日期: 2021-01-15

代理商名称

FUTURE

库存

25

Min.Order

1

地区

WORLDWIDE 马上订购

ARROW

库存

19999

Min.Order

0

地区

EUROPE 马上订购

ANGLIA Live

库存

5046

Min.Order

1

地区

EUROPE 马上订购

代理商库存报告日期: 2021-01-15

批量生产
EAR99 NEC Tape And Reel Chip Scale Package 0.4mm pitch - - 5000
更多信息

单价(US$):

-

Country of Origin:

FRANCE

BALF-SPI2-01D3

供货状态

批量生产

ECCN (US)

EAR99
更多信息

Budgetary Price (US$)*/Qty

经销商的可用性BALF-SPI2-01D3

代理商名称
地区 库存 最小订购量 第三方链接
FUTURE WORLDWIDE 25 1 马上订购
ARROW EUROPE 19999 0 马上订购
ANGLIA Live EUROPE 5046 1 马上订购

代理商库存报告日期: 2021-01-15

代理商名称

FUTURE

库存

25

Min.Order

1

地区

WORLDWIDE 马上订购

ARROW

库存

19999

Min.Order

0

地区

EUROPE 马上订购

ANGLIA Live

库存

5046

Min.Order

1

地区

EUROPE 马上订购

代理商库存报告日期: 2021-01-15

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

Chip Scale Package 0.4mm pitch

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Minimum Sellable Quantity

5000

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处 或我们的 经销商 。