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This device is an ultra-miniature balun. The BALF-SPI2-01D3 integrates matching network and harmonics filter. Matching impedance has been customized for the ST S2-LP transceiver. The BALF-SPI2-01D3 uses STMicroelectronics IPD technology on non-conductive glass substrate which optimize RF performance.
主要特性
- 50 Ω nominal input / conjugate matched to ST S2-LP for 860 - 930 MHz frequency operation
- Low insertion loss
- Low amplitude imbalance
- Low phase imbalance
- Small footprint
- Very low profile < 620 μm after reflow
- High RF performance
- RF BOM and area reduction
- ECOPACK®2 compliant component
样片和购买
| 产品型号 | 封装 | 包装类型 | Minimum Sellable Quantity | 供货状态 | 预算价格(US$) | 数量 | ECCN (US) | Country of Origin | 从分销商订购 | 从ST订购 |
|---|---|---|---|---|---|---|---|---|---|---|
| BALF-SPI2-01D3 | Chip Scale Package 0.4mm pitch | Tape And Reel | 5000 |
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0.176 | 500 | EAR99 | CHINA | 查看供货情况 | 立即购买 |
(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office or our Distributors
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生态系统
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Picture 产品型号 制造商 描述 
X-NUCLEO-S2868A1 ST Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo 产品型号Sub-1 GHz 868 MHz RF expansion board based on S2-LP radio for STM32 Nucleo
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| 产品型号 | 供货状态 | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| BALF-SPI2-01D3 |
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Chip Scale Package 0.4mm pitch | 工业 | Ecopack2 |
(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.
