Wide band directional coupler with ISO port

下载数据手册

Buy from our eStore

立即购买
概述
工具与软件
资源
解决方案
质量与可靠性
Sales Briefcase
eDesignSuite
开始
样片和购买
Partner products
  • The CPL-WBF-00D3 is a low band coupler designed to measure RF antenna output power in GSM / WCDMA / TD-SCDMA / LTE applications. This coupler has been customized for wide band operating frequencies (EGSM, CELL, PCS, DCS, TD-SCDMA, WCDMA and LTE) with less than 0.30 dB insertion losses in the bandwidth (698 MHz to 2700 MHz).

    The CPL-WBF-00D3 has been designed using STMicroelectronics IPD (integrated passive device) technology on non-conductive glass substrate to optimize RF performance. The device is delivered 100% tested, in tape and reel.

    主要特性

    • 50 Ω nominal input / output impedance
    • Wide operating frequency range (698 MHz to 2700 MHz)
    • Low insertion loss
    • 30 dB coupling factor with high flatness
    • High directivity
    • High ESD robustness (IEC 61000-4-2 level 4)
    • Flip Chip package
    • Small footprint

样片和购买

产品型号
封装
包装类型
Minimum Sellable Quantity
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
CPL-WBF-00D3 Chip Scale Package 0.4mm pitch Tape And Reel 5000
批量生产
0.2 100 EAR99 CHINA 没有经销商,请联系我们的销售办事处 立即购买

CPL-WBF-00D3

封装

Chip Scale Package 0.4mm pitch

包装类型

Tape And Reel

单价(US$)

0.2*

Minimum Sellable Quantity

5000

供货状态

批量生产

单价(US$)

0.2

数量

100

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS9150
      Wide band directional coupler with ISO port
      3.0
      793.7 KB
      PDF
      DS9150

      Wide band directional coupler with ISO port

    • 描述 版本 文档大小 操作
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      Wide band directional coupler with ISO port 1.0
      12.68 KB
      ZIP

      Wide band directional coupler with ISO port

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
CPL-WBF-00D3
批量生产
Chip Scale Package 0.4mm pitch 工业 Ecopack2

CPL-WBF-00D3

Package:

Chip Scale Package 0.4mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.4mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

支持中心或 提供反馈