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  • The EMIF01-1008AF4 is a highly integrated device designed as a low-pass filter that rejects frequencies in the 600 MHz to 1.55 GHz band.

    It also incorporates a bidirectional 5.5 V ESD protection to protect the system against electrostatic discharges up to 15 kV.

    主要特性

    • Low clamping voltage
    • Bidirectional ESD protection
    • Stand-off voltage of 5.5 V
    • Excellent rejection levels: < -30 dB from 600 MHz to 1.55 GHz
    • 0201-3L package: 0.76 x 0.34 mm
    • Very thin package: 0.24 mm maximum
    • Resin coating on all 6 faces
    • Complies with IEC 61000-4-2 level 4 on pin 3:
      • ±15 kV (air discharge)
      • ±8 kV (contact discharge)
    • MIL STD 883G - Method 3015-7 on pin 1:
      • ±2 kV HBM (human body model)

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
EMIF01-1008AF4 CSPS BUMPLESS COATING Tape And Reel
批量生产
- - EAR99 - 没有经销商,请联系我们的销售办事处

EMIF01-1008AF4

封装

CSPS BUMPLESS COATING

包装类型

Tape And Reel

单价(US$)

*

供货状态

批量生产

单价(US$)

-

数量

-

ECCN (US)

EAR99

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS12944
      Single-line low-pass filter and ESD protection
      1.0
      532.4 KB
      PDF
      DS12944

      Single-line low-pass filter and ESD protection

    • 描述 版本 文档大小 操作
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
EMIF01-1008AF4
批量生产
CSPS BUMPLESS COATING 工业 Ecopack2

EMIF01-1008AF4

Package:

CSPS BUMPLESS COATING

Material Declaration**:

Marketing Status

批量生产

Package

CSPS BUMPLESS COATING

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.