EMIF06-HMC02F2

批量生产

6-line EMI filter and ESD protection for mini and micro SD card interfaces

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  • The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size.

    Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. Compared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally.

    主要特性

    • 6 lines low-pass-filter
    • High efficiency in EMI filtering
    • Very low PCB space consuming: < 4 mm²
    • Lead-free package
    • Very thin package: 0.65 mm
    • High efficiency in ESD suppression
    • High reliability offered by monolithic integration
    • High reducing of parasitic elements through integration and wafer level packaging

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
EMIF06-HMC02F2 Chip Scale Package 0.5mm pitch Tape And Reel
批⁠量⁠生⁠产
- EAR99 CHINA 没有经销商,请联系我们的销售办事处 立即购买

EMIF06-HMC02F2

封装

Chip Scale Package 0.5mm pitch

包装类型

Tape And Reel

单价(US$)

*

供货状态

批⁠量⁠生⁠产

单价(US$)

-

数量

-

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS11483
      6-line IPAD™, EMI filter including ESD protection
      1.0
      280.11 KB
      PDF
      DS11483

      6-line IPAD™, EMI filter including ESD protection

    • 描述 版本 文档大小 操作
      AN4541
      EMI filters for SD3.0 card high-speed SD card protection and filtering devices
      1.1
      1.13 MB
      PDF
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4541

      EMI filters for SD3.0 card high-speed SD card protection and filtering devices

      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      7.0
      433.12 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      6-line EMI filter and ESD protection for mini and micro SD card interfaces 1.0
      16.66 KB
      ZIP

      6-line EMI filter and ESD protection for mini and micro SD card interfaces

产品型号 供货状态 封装 等级规格 符合RoHS级别 材料声明**
EMIF06-HMC02F2
批量生产
Chip Scale Package 0.5mm pitch Industrial Ecopack2

EMIF06-HMC02F2

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

Marketing Status

批量生产

Package

Chip Scale Package 0.5mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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