产品概述

描述

The EMIF06-HMC02F2 is a highly integrated array designed to suppress EMI / RFI noise for High Speed MultiMediaCard™ port filtering. The EMIF06-HMC02F2 Flip-Chip packaging means the package size is equal to the die size. Additionally, this filter includes an ESD protection circuitry which prevents the protected device from destruction when subjected to ESD surges up to 15 kV. Compared to EMIF06-HMC01F2, the EMIF06-HMC02F2 has its ground balls connected together internally.

所有功能
6 lines low-pass-filter

High efficiency in EMI filtering

Very low PCB space consuming: < 4 mm²

Lead-free package

Very thin package: 0.65 mm

High efficiency in ESD suppression

High reliability offered by monolithic integration

High reducing of parasitic elements through integration and wafer level packaging
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All resources

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	Resource title		Latest update

产品规格 (1)

	Resource title		Latest update
PDF	DS11483 6-line IPAD™, EMI filter including ESD protection 1.0		01 Mar 2016	01 Mar 2016 DS11483 6-line IPAD™, EMI filter including ESD protection 1.0

应用手册 (5)

	Resource title	Latest update
PDF	AN4541 EMI filters for SD3.0 card high-speed SD card protection and filtering devices 1.1	13 Sep 2018	13 Sep 2018 AN4541 EMI filters for SD3.0 card high-speed SD card protection and filtering devices 1.1
PDF	AN5241 Fundamentals of ESD protection at system level 1.1	06 Aug 2019	06 Aug 2019 AN5241 Fundamentals of ESD protection at system level 1.1
PDF	AN3353 IEC 61000-4-2 standard testing 1.2	24 Mar 2020	24 Mar 2020 AN3353 IEC 61000-4-2 standard testing 1.2
PDF	AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0	13 Sep 2018	13 Sep 2018 AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
PDF	AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0	22 Sep 2015	22 Sep 2015 AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

技术文档 (1)

	Resource title		Latest update
PDF	TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0		25 Aug 2020	25 Aug 2020 TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0

EDA Symbols, Footprints and 3D Models

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	Resource title		Latest update

CAD Symbol & Footprint models (1)

	Resource title		Latest update
ZIP	emif06-hmc02f2 Orcad Symbol and Footprint files 1.2		18 Mar 2020	18 Mar 2020 emif06-hmc02f2 Orcad Symbol and Footprint files 1.2

质量与可靠性

产品型号	Marketing Status	封装	等级规格	符合RoHS级别	材料声明**
EMIF06-HMC02F2	批量生产	CSP P 0.5 mm	工业	Ecopack2

EMIF06-HMC02F2

Package:

CSP P 0.5 mm

Material Declaration**:

More Info

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

样片和购买

	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	温度（ºC）		Country of Origin	Budgetary Price (US$)*/Qty
	产品型号	从分销商订购	从ST订购	供货状态	ECCN (US)	ECCN (EU)	包装类型	封装	最小值	最大值	Country of Origin	Budgetary Price (US$)*/Qty
	EMIF06-HMC02F2	无法联系到经销商，请联系我们的销售办事处		批量生产	EAR99	NEC	Tape And Reel	CSP P 0.5 mm	-	-	FRANCE