产品概述

描述

The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering. The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.

所有功能
Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)

High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)

Very low PCB space consumption:

1.1 x 2.4 mm

Ultralow leakage current: 20 nA max.

Very thin package: 0.605 mm

Smart pinout for easier PCB layout

High reduction of parasitic elements through integration and wafer level packaging

Lead-free package

Complies with the following standards:

IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)
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All resources

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	Resource title		Latest update

产品规格 (1)

	Resource title		Latest update
PDF	DS9928 EMI filter with integrated ESD protection for micro-SD Card™ 4.0		10 Oct 2016	10 Oct 2016 DS9928 EMI filter with integrated ESD protection for micro-SD Card™ 4.0

应用手册 (5)

	Resource title	Latest update
PDF	AN4541 EMI filters for SD3.0 card high-speed SD card protection and filtering devices 1.1	13 Sep 2018	13 Sep 2018 AN4541 EMI filters for SD3.0 card high-speed SD card protection and filtering devices 1.1
PDF	AN5241 Fundamentals of ESD protection at system level 1.1	06 Aug 2019	06 Aug 2019 AN5241 Fundamentals of ESD protection at system level 1.1
PDF	AN3353 IEC 61000-4-2 standard testing 1.2	24 Mar 2020	24 Mar 2020 AN3353 IEC 61000-4-2 standard testing 1.2
PDF	AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0	13 Sep 2018	13 Sep 2018 AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use 5.0
PDF	AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0	22 Sep 2015	22 Sep 2015 AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use 8.0

技术文档 (1)

	Resource title		Latest update
PDF	TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0		25 Aug 2020	25 Aug 2020 TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 8.0

EDA Symbols, Footprints and 3D Models

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HW Models (1)

	Resource title		Latest update
ZIP	EMIF06-HSD03F3 S-parameter model (.sxp) 1.0		11 Sep 2015	11 Sep 2015 EMIF06-HSD03F3 S-parameter model (.sxp) 1.0

CAD Symbol & Footprint models (2)

	Resource title		Latest update
ZIP	emif06-hsd03f3 Altium Symbol and Footprint files 1.0		02 Apr 2021	02 Apr 2021 emif06-hsd03f3 Altium Symbol and Footprint files 1.0
ZIP	emif06-hsd03f3 OrCad Symbol and Footprint files 1.2		18 Mar 2020	18 Mar 2020 emif06-hsd03f3 OrCad Symbol and Footprint files 1.2