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The EMIF06-HSD03F3 chip is a highly integrated device designed to suppress EMI/RFI noise for interface line filtering.
The EMIF06-HSD03F3 Flip-Chip packaging means the package size is equal to the die size. That’s why EMIF06-HSD03F3 is a very small device. Additionally, this filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up 18 kV.
主要特性
- Very low line capacitance to compensate long PCB tracks (2.5 pF typ.)
- High efficiency in ESD suppression up to 18 kV (IEC 61000-4-2)
- Very low PCB space consumption:
- 1.1 x 2.4 mm
- Ultralow leakage current: 20 nA max.
- Very thin package: 0.605 mm
- Smart pinout for easier PCB layout
- High reduction of parasitic elements through integration and wafer level packaging
- Lead-free package
- Complies with the following standards:
- IEC 61000-4-2 level 4:±15 kV (air discharge), ±8 kV (contact discharge)
精选 视频
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产品规格 (1)
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| 10 Oct 2016 |
10 Oct 2016
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应用手册 (5)
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| 24 Mar 2020 |
24 Mar 2020
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| 13 Sep 2018 |
13 Sep 2018
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| 22 Sep 2015 |
22 Sep 2015
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技术文档 (1)
| Resource title | Latest update | |||
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| 25 Aug 2020 |
25 Aug 2020
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - EMIF06-HSD03F3
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
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硬件型号、CAD库及SVD (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 11 Sep 2015 |
11 Sep 2015
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| ZIP | 18 Mar 2020 |
18 Mar 2020
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样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| EMIF06-HSD03F3 | 无法联系到经销商，请联系我们的销售办事处 |
批量生产
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EAR99 | NEC | Tape And Reel | CSP P 0.4 mm | -30 | 85 | CHINA | |||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
