EMIF06-mSD01F2

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主要特性
- Mini and micro (T-Flash) Secure Digital memory card in mobile phones and communication systems
阅读更多阅读较少信息

样片和购买

产品型号

封装

包装类型

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EMIF06-MSD01F2

Chip Scale Package 0.5mm pitch

Tape And Reel

0.42

1000

EAR99

CHINA

查看供货情况

Distributor availability ofEMIF06-MSD01F2

代理商名称	地区	库存	最小订购量	Third party link
DIGIKEY	WORLDWIDE	6390	1	Order Now
MOUSER	WORLDWIDE	5182	1	Order Now

代理商库存报告日期: 2019-12-06

代理商名称

DIGIKEY

库存

6390

Min.Order

地区

WORLDWIDE Order Now

MOUSER

库存

5182

Min.Order

地区

WORLDWIDE Order Now

代理商库存报告日期: 2019-12-06

获取样片

EMIF06-MSD01F2

封装

Chip Scale Package 0.5mm pitch

包装类型

Tape And Reel

More Info

单价(US$)

0.42*

Distributor availability ofEMIF06-MSD01F2

代理商名称	地区	库存	最小订购量	Third party link
DIGIKEY	WORLDWIDE	6390	1	Order Now
MOUSER	WORLDWIDE	5182	1	Order Now

代理商库存报告日期: 2019-12-06

代理商名称

DIGIKEY

库存

6390

Min.Order

地区

WORLDWIDE Order Now

MOUSER

库存

5182

Min.Order

地区

WORLDWIDE Order Now

代理商库存报告日期: 2019-12-06

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处或我们的经销商。

00 选择要下载的文档

技术文档

产品规格
- 描述版本文档大小操作
  
  DS5103
  Mini and micro SD Card - EMI filtering and 25 kV ESD protection 1.2
  186.31 KB
  PDF
  
  DS5103
  
  Mini and micro SD Card - EMI filtering and 25 kV ESD protection
  
  PDF

	描述	版本	文档大小	操作
	DS5103 Mini and micro SD Card - EMI filtering and 25 kV ESD protection	1.2	186.31 KB	PDF

应用手册

描述	版本	文档大小	操作
AN4541 EMI filters for SD3.0 card high-speed SD card protection and filtering devices	1.1	1.13 MB	PDF
AN5241 Fundamentals of ESD protection at system level	1.1	1.45 MB	PDF
AN3353 IEC 61000-4-2 standard testing	1.2	171.08 KB	PDF
AN2348 IPAD™ 400 µm Flip Chip: package description and recommendations for use	5.0	261.7 KB	PDF
AN1235 IPAD™ 500 µm Flip Chip: package description and recommendations for use	8.0	251.82 KB	PDF

AN4541

EMI filters for SD3.0 card high-speed SD card protection and filtering devices

PDF

AN5241

Fundamentals of ESD protection at system level

PDF

AN3353

IEC 61000-4-2 standard testing

PDF

AN2348

IPAD™ 400 µm Flip Chip: package description and recommendations for use

PDF

AN1235

IPAD™ 500 µm Flip Chip: package description and recommendations for use

PDF

技术文档
- 描述版本文档大小操作
  
  TN1173
  Packing information for IPAD, protection, rectifiers, thyristors and AC Switches 6.0
  444.57 KB
  PDF
  
  TN1173
  
  Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
  
  PDF

	描述	版本	文档大小	操作
	TN1173 Packing information for IPAD, protection, rectifiers, thyristors and AC Switches	6.0	444.57 KB	PDF

硬件型号、CAD库及SVD

硬件型号、CAD库及SVD
- 描述版本文档大小操作
  
  emif06-msd01f2 OrCad Symbol and Footprint files 1.0
  16.08 KB
  ZIP
  
  emif06-msd01f2 OrCad Symbol and Footprint files
  
  ZIP

	描述	版本	文档大小	操作
	emif06-msd01f2 OrCad Symbol and Footprint files	1.0	16.08 KB	ZIP

产品型号	供货状态	封装	等级规格	符合RoHS级别	Material Declaration**
EMIF06-MSD01F2	批量生产	Chip Scale Package 0.5mm pitch	工业	Ecopack2	PDF XML

EMIF06-MSD01F2

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

PDF XML

More Info

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.