6-line EMI filter and ESD protection for mini and micro SD card interfaces

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样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
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EMIF06-MSD01F2 Chip Scale Package 0.5mm pitch Tape And Reel
批量生产
0.42 1000 EAR99 CHINA 查看供货情况

Distributor availability ofEMIF06-MSD01F2

代理商名称
地区 库存 最小订购量 Third party link
DIGIKEY WORLDWIDE 6390 1 Order Now
MOUSER WORLDWIDE 5182 1 Order Now

代理商库存报告日期: 2019-12-06

代理商名称

DIGIKEY

库存

6390

Min.Order

1

地区

WORLDWIDE Order Now

MOUSER

库存

5182

Min.Order

1

地区

WORLDWIDE Order Now

代理商库存报告日期: 2019-12-06

获取样片

EMIF06-MSD01F2

封装

Chip Scale Package 0.5mm pitch

包装类型

Tape And Reel

单价(US$)

0.42*

Distributor availability ofEMIF06-MSD01F2

代理商名称
地区 库存 最小订购量 Third party link
DIGIKEY WORLDWIDE 6390 1 Order Now
MOUSER WORLDWIDE 5182 1 Order Now

代理商库存报告日期: 2019-12-06

代理商名称

DIGIKEY

库存

6390

Min.Order

1

地区

WORLDWIDE Order Now

MOUSER

库存

5182

Min.Order

1

地区

WORLDWIDE Order Now

代理商库存报告日期: 2019-12-06

供货状态

批量生产

单价(US$)

0.42

数量

1000

ECCN (US)

EAR99

Country of Origin

CHINA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

适合您的资源

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS5103
      Mini and micro SD Card - EMI filtering and 25 kV ESD protection
      1.2
      186.31 KB
      PDF
      DS5103

      Mini and micro SD Card - EMI filtering and 25 kV ESD protection

    • 描述 版本 文档大小 操作
      AN4541
      EMI filters for SD3.0 card high-speed SD card protection and filtering devices
      1.1
      1.13 MB
      PDF
      AN5241
      Fundamentals of ESD protection at system level
      1.1
      1.45 MB
      PDF
      AN3353
      IEC 61000-4-2 standard testing
      1.2
      171.08 KB
      PDF
      AN2348
      IPAD™ 400 µm Flip Chip: package description and recommendations for use
      5.0
      261.7 KB
      PDF
      AN1235
      IPAD™ 500 µm Flip Chip: package description and recommendations for use
      8.0
      251.82 KB
      PDF
      AN4541

      EMI filters for SD3.0 card high-speed SD card protection and filtering devices

      AN5241

      Fundamentals of ESD protection at system level

      AN3353

      IEC 61000-4-2 standard testing

      AN2348

      IPAD™ 400 µm Flip Chip: package description and recommendations for use

      AN1235

      IPAD™ 500 µm Flip Chip: package description and recommendations for use

    • 描述 版本 文档大小 操作
      TN1173
      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches
      6.0
      444.57 KB
      PDF
      TN1173

      Packing information for IPAD, protection, rectifiers, thyristors and AC Switches

硬件型号、CAD库及SVD

    • 描述 版本 文档大小 操作
      emif06-msd01f2 OrCad Symbol and Footprint files 1.0
      16.08 KB
      ZIP

      emif06-msd01f2 OrCad Symbol and Footprint files

产品型号 供货状态 封装 等级规格 符合RoHS级别 Material Declaration**
EMIF06-MSD01F2
批量生产
Chip Scale Package 0.5mm pitch 工业 Ecopack2

EMIF06-MSD01F2

Package:

Chip Scale Package 0.5mm pitch

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

Chip Scale Package 0.5mm pitch

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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