产品概述
描述
With the STM32F723 Discovery kit (32F723EDISCOVERY), users develop applications easily on the STM32F7 Series high-performance microcontrollers based on Arm® Cortex®‑M7 core. The Discovery kit combines the STM32F723 features with 240×240 pixel LCD with touch panel, SAI audio codec, MEMS microphones, USBs OTG HS and OTG FS, Quad-SPI NOR Flash memory, and microSD™ card connector.
An embedded ST-LINK/V2-1 debugger/programmer is included. Specialized add-on boards can be connected through the ARDUINO® Uno V3, Pmod™, or STMod+ expansion connectors.
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所有功能
- STM32F723IEK6 microcontroller with 512 Kbytes of Flash memory and 176+16 Kbytes of SRAM, in a BGA176 package
- 240×240-pixel TFT LCD with a parallel interface and capacitive touch panel
- USB OTG HS and OTG FS
- SAI audio codec
- Four digital ST-MEMS microphones
- 8‑Mbit 16‑bit wide PSRAM
- 512-Mbit Quad-SPI NOR Flash memory
- User and reset push-buttons
- Board connectors:
ESP‑01 Wi‑Fi Two user USB with Micro-AB Jack for audio line with stereo input and output Stereo speaker output Pmod™ connector STMod+ connector to embedded fanout daughterboard compatible with MikroElektronika mikroBUS™ adapter Click boards™, ESP‑01, and Seeed Studio™ Grove modules. Provision for headers for direct breadboard plug‑in ARDUINO 3.3 or 5.0 V power supply output for external applications - Flexible power-supply options: ST-LINK USB VBUS, user USB HS and FS connectors, or external sources
- Comprehensive free software libraries and examples available with the STM32Cube MCU Package
- On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port, and debug port
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
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全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
Board Manufacturing Specifications (4)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 2.0 | 21 Dec 2021 | 21 Dec 2021 | |
| ZIP | 1.1 | 21 Dec 2021 | 21 Dec 2021 | |
| ZIP | 2.1 | 24 Aug 2023 | 24 Aug 2023 | |
| ZIP | 2.1 | 21 Jun 2023 | 21 Jun 2023 |
物料清单 (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 2.0 | 21 Dec 2021 | 21 Dec 2021 | |
| ZIP | 2.1 | 21 Jun 2023 | 21 Jun 2023 |
Schematic Pack (3)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.1 | 21 Dec 2021 | 21 Dec 2021 | ||
| 1.0 | 21 Dec 2021 | 21 Dec 2021 | ||
| 1.1 | 24 Aug 2023 | 24 Aug 2023 |
质量与可靠性
| 产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
|---|---|---|---|
| STM32F723E-DISCO | 批量生产 | Ecopack1 | |
STM32F723E-DISCO
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32F723E-DISCO | distributors 无法联系到经销商，请联系我们的销售办事处 | STM32F723IE | 批量生产 | ST | 3A991.a.2 | NEC | - | CHINA | true | |
distributors
无法联系到经销商，请联系我们的销售办事处
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