产品概述
描述
The B-L475E-IOT01A Discovery kit for IoT node allows users to develop applications with direct connection to cloud servers. The Discovery kit enables a wide diversity of applications by exploiting low-power communication, multiway sensing and Arm® Cortex® -M4 core-based STM32L4 Series features.
The support for Arduino Uno V3 and PMOD connectivity provides unlimited expansion capabilities with a large choice of specialized add-on boards.
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所有功能
- Ultra-low-power STM32L4 Series MCUs based on Arm® Cortex®-M4 core with 1 Mbyte of Flash memory and 128 Kbytes of SRAM, in LQFP100 package
- 64-Mbit Quad-SPI (Macronix) Flash memory
- Bluetooth® V4.1 module (SPBTLE-RF)
- Sub-GHz (868 MHz or 915 MHz) low-power-programmable RF module (SPSGRF-868 or SPSGRF-915)
- 802.11 b/g/n compliant Wi-Fi® module from Inventek Systems (ISM43362-M3G-L44)
- Dynamic NFC tag based on M24SR with its printed NFC antenna
- 2 digital omnidirectional microphones (MP34DT01)
- Capacitive digital sensor for relative humidity and temperature (HTS221)
- High-performance 3-axis magnetometer (LIS3MDL)
- 3D accelerometer and 3D gyroscope (LSM6DSL)
- 260-1260 hPa absolute digital output barometer (LPS22HB)
- Time-of-Flight and gesture-detection sensor (VL53L0X)
- 2 push-buttons (user and reset)
- USB OTG FS with Micro-AB connector
- Expansion connectors:
- Arduino™ Uno V3
- PMOD
- Flexible power-supply options:
- ST LINK USB VBUS or external sources
- On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: mass storage, Virtual COM port and debug port
- Comprehensive free software HAL library including a variety of examples, as part of the STM32Cube MCU Package
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR™, Keil®, GCC-based IDEs, Arm® Mbed Enabled™
- Arm® Mbed™ online (see http://mbed.org)
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精选 视频
The STM32Cube.AI is an extension pack of the widely used STM32CubeMX configuration and code generation tool enabling AI on STM32 Arm® Cortex®-M-based microcontrollers.
This video describes the main components and features of the B-L475E-IOT board and shows a typical use of this platform as an IoT node using AWS (Amazon Web Services) to demonstrate the interactions between that node and a cloud server to build an intelligent system.
ARM mbed Integrated Development Environment using STM32 Nucleo platform
Recommended Tools & Software
All tools & software
全部资源
| Resource title | 版本 | Latest update |
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产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 4.0 | 12 Jul 2018 | 12 Jul 2018 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 3.0 | 21 Nov 2019 | 21 Nov 2019 |
用户手册 (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 5.0 | 28 Feb 2020 | 28 Feb 2020 | ||
| 1.0 | 25 Feb 2019 | 25 Feb 2019 |
简报 (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 5.6 | 01 Jul 2020 | 01 Jul 2020 | ||
| 21.06 | 22 Jun 2021 | 22 Jun 2021 |
宣传册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 18.10 | 30 Apr 2021 | 30 Apr 2021 |
许可协议 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 21 Sep 2016 | 21 Sep 2016 |
Utilities (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 17 Jul 2018 | 17 Jul 2018 |
Evaluation Board Terms of Use (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.7 | 28 Apr 2021 | 28 Apr 2021 |
全部资源
| Resource title | 版本 | Latest update |
|---|
Board Manufacturing Specifications (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 28 Jul 2017 | 28 Jul 2017 |
物料清单 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 28 Jul 2017 | 28 Jul 2017 |
Schematic Pack (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 1.0 | 28 Jul 2017 | 28 Jul 2017 |
质量与可靠性
| 产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
|---|---|---|---|
| B-L475E-IOT01A1 | 批量生产 | Ecopack1 | |
| B-L475E-IOT01A2 | 批量生产 | Ecopack1 | |
B-L475E-IOT01A1
Package:
Ecopack1Material Declaration**:
B-L475E-IOT01A2
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| B-L475E-IOT01A1 | 4 distributors | Buy Direct | STM32L475VG | 批量生产 | ST | 5A992C | 5A002A2 | Sub-GHz (915 MHz) RF module | CHINA | true | 53.0 / 1 | |
| B-L475E-IOT01A2 | 4 distributors | Buy Direct | STM32L475VG | 批量生产 | ST | 5A992C | 5A002A2 | Sub-GHz (868 MHz) RF module | CHINA | true | 53.0 / 1 |
