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产品概述

主要优势

为您的蓝牙低功耗应用提供一个功能丰富的平台

可借助MEMS传感器、LED、灵活的电源和SMA连接器实现丰富的功能。您执行设计和测试的理想之选。

用于设计开发和测试的出色参考硬件

凭借B-WB1M-WPAN1，您可以测试产品的RF性能、功耗以及与其他板件和组件的集成情况。同时，您还可以将其用作具备众多资源的参考设计。开放式硬件平台。

包含海量资源的开放式硬件平台

B-WB1M-WPAN1是一个开放式硬件平台，支持IAR Embedded Workbench^®、MDK-ARM和STM32CubeIDE等多种IDE。该平台还提供了众多在线资源，包括意法半导体Wiki和CubeFW。

描述

B-WB1M-WPAN1 STM32WB连接扩展板提供了一种经济且灵活的方案，使用户能够使用STM32WB系列STM32WB1MMC微控制器模块尝试新理念并构建原型。

B-WB1M-WPAN1产品需要一个单独的探头进行编程和调试。STLINK-V3SET调试器可以通过MIPI10/STDC14线缆连接。

B-WB1M-WPAN1 STM32WB连接扩展板配有一个USB Type-C^®连接器（仅用于电源），位于附加STMod+适配器板上。

B-WB1M-WPAN1产品配有STM32WB全套软件HAL库，STM32CubeWB MCU软件包则提供各种打包软件示例。

所有功能
STM32WB连接扩展板内嵌一个包括以下各项的STM32WB1MMC模块：

超低功耗STM32WB15CCY双核Arm^® Cortex^®‑M4/M0+，Bluetooth^®低功耗5.4，AES‑256，具有320 KB Flash存储器和48 KB SRAM，采用WLCSP49封装

射频收发器多标准无线Bluetooth^®低功耗，符合Bluetooth^®规范5.4，传输速率为1 Mb/s和2 Mb/s

256 KB串行I²C总线EEPROM

意法半导体的MEMS传感器：

集成式高精度温度传感器

3D加速度计和3D陀螺仪

用户LED

用户按钮和复位按钮

板连接器：

MIPI^®调试

STMod+

附加STMod+适配器板的USB Type-C^®仅用于电源

灵活的电源选项：外部电源或附加板上的USB V_BUS

STM32CubeWB MCU软件包提供全面的免费软件库和示例

支持多种集成开发环境 (IDE)，包括IAR Embedded Workbench^®、MDK-ARM，以及STM32CubeIDE
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<h1><b>无线Bluetooth<sup>®</sup>低功耗评估板：B-WB1M-WPAN1</b></h1>

无线Bluetooth^®低功耗评估板：B-WB1M-WPAN1

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软件开发工具

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	资源标题	版本	更新时间

产品规格 (1)

	资源标题	版本	更新时间
PDF	DB5045 STM32WB connectivity expansion board	1.0	18 Oct 2023	18 Oct 2023 DB5045 STM32WB connectivity expansion board 1.0

技术文档 (1)

	资源标题	版本	更新时间
PDF	TN1235 Overview of ST-LINK derivatives	5.0	07 Mar 2023	07 Mar 2023 TN1235 Overview of ST-LINK derivatives 5.0

用户手册 (1)

	资源标题	版本	更新时间
PDF	UM3200 STM32WB connectivity expansion board	1.0	06 Nov 2023	06 Nov 2023 UM3200 STM32WB connectivity expansion board 1.0

简报 (2)

	资源标题	版本	更新时间
PDF	STM32 Development Boards Portfolio	23.06	20 Jun 2023	20 Jun 2023 STM32 Development Boards Portfolio 23.06
PDF	STM32WBxM Wireless Modules Bluetooth LE 5.4, Zigbee 3.0 and Thread product overview	23.11	07 Nov 2023	07 Nov 2023 STM32WBxM Wireless Modules Bluetooth LE 5.4, Zigbee 3.0 and Thread product overview 23.11

宣传册 (2)

	资源标题	版本	更新时间
PDF	STM32WB Wireless Series - Bluetooth LE™ 5.3 and IEEE 802.15.4	23.11	06 Nov 2023	06 Nov 2023 STM32WB Wireless Series - Bluetooth LE™ 5.3 and IEEE 802.15.4 23.11
PDF	STM32WBxM Wireless Series - Bluetooth LE 5.4, Zigbee 3.0 and Thread	23.11	05 Nov 2023	05 Nov 2023 STM32WBxM Wireless Series - Bluetooth LE 5.4, Zigbee 3.0 and Thread 23.11

许可协议 (1)

	资源标题	版本	更新时间
PDF	Open Reference Material License Agreement v5		30 Sep 2016	30 Sep 2016 Open Reference Material License Agreement v5

Evaluation Board Terms of Use (1)

	资源标题	版本	更新时间
PDF	使用条款	1.7	29 May 2023	29 May 2023 使用条款 1.7

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Board Manufacturing Specifications (4)

	资源标题	版本	更新时间
ZIP	MB1868 Board Design Project File	1.0	02 Aug 2023	02 Aug 2023 MB1868 Board Design Project File 1.0
ZIP	MB1868 Manufacturing File	1.0	02 Aug 2023	02 Aug 2023 MB1868 Manufacturing File 1.0
ZIP	MB1880 Board Design Project File	1.0	23 Nov 2023	23 Nov 2023 MB1880 Board Design Project File 1.0
ZIP	MB1880 Manufacturing File	1.0	23 Nov 2023	23 Nov 2023 MB1880 Manufacturing File 1.0

物料清单 (2)

	资源标题	版本	更新时间
ZIP	MB1868 Bill of materials	1.0	02 Aug 2023	02 Aug 2023 MB1868 Bill of materials 1.0
ZIP	MB1880 Bill of materials	1.0	23 Nov 2023	23 Nov 2023 MB1880 Bill of materials 1.0

Schematic Pack (2)

	资源标题	版本	更新时间
PDF	MB1868-WB1M-E01 Board Schematic	1.0	02 Aug 2023	02 Aug 2023 MB1868-WB1M-E01 Board Schematic 1.0
PDF	MB1880-UART-A01 Board Schematic	1.0	23 Nov 2023	23 Nov 2023 MB1880-UART-A01 Board Schematic 1.0

质量与可靠性

产品型号	Marketing Status	符合RoHS级别	材料声明**
B-WB1M-WPAN1	批量生产	Ecopack1

B-WB1M-WPAN1

Package:

Ecopack1

Material Declaration**:

More Info

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系销售支持。

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B-WB1M-WPAN1

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STM32WB1MMC

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B-WB1M-WPAN1 批量生产

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(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处或我们的经销商。

B-WB1M-WPAN1

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为您的蓝牙低功耗应用提供一个功能丰富的平台

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简报 (2)

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Board Manufacturing Specifications (4)

物料清单 (2)

Schematic Pack (2)

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无线Bluetooth^®低功耗评估板：B-WB1M-WPAN1