B-WL5M-SUBG1

批量生产
Design Win

采用STM32WL5M的连接扩展板

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产品概述

主要优势

使用方便

模块已经过认证和RF微调,产品完全集成在CubeMX中。插入即可启用即用型无线连接。

超低功耗

针对低功耗无线电性能优化的低功耗PA,以及利用STM32WL5 SoC超低功耗架构的模块。

远程无线电性能

高功率LoRa无线电和PA具有远程通信能力,减少了网关需求和基础设施成本。

描述

The B-WL5M-SUBG1 STM32WL connectivity expansion board provides an affordable and flexible way for users to try out new concepts and build prototypes with the STM32WL series STM32WL5MOC microcontroller module.

The B-WL5M-SUBG1 product requires a separate probe for programming and debugging. The STLINK-V3SET debugger can be connected through a MIPI10/STDC14 cable.

The B-WL5M-SUBG1 STM32WL connectivity expansion board is provided with a USB Type-C® connector on an add-on STMod+ adapter board.

The B-WL5M-SUBG1 product is provided with the STM32WL comprehensive software HAL library and various packaged software examples available with the STM32CubeWL MCU Package.

  • 所有功能

    • STM32WL connectivity expansion board embedding an STM32WL5MOC module including:
      • Ultra‑low‑power STM32WL55JC microcontroller multiprotocol LPWAN dual‑core based on Arm® Cortex®‑M4/M0+, featuring 256 Kbytes of flash memory and 64 Kbytes of SRAM in a UFBGA73 package
      • RF transceiver (150 MHz to 960 MHz frequency range) supporting LoRa®, (G)FSK, (G)MSK, and BPSK modulations
    • 4‑Mbit CMOS serial flash memory and 256‑Kbit serial I2C bus EEPROM
    • MEMS sensors from STMicroelectronics:
      • Integrated high-accuracy temperature sensor
      • High-accuracy, ultra-low-power, 3-axis digital output magnetometer
      • 3D accelerometer and 3D gyroscope
      • Ultracompact piezoresistive absolute pressure sensor
    • Three user LEDs
    • User and reset push-buttons
    • Board connectors:
      • MIPI® debug
      • STMod+
      • Stubby antenna
      • USB Type-C® for power only on add‑on STMod+ adapter board
    • Flexible power supply options: external sources, or USB VBUS from the add‑on board
    • Comprehensive free software libraries and examples available with the STM32CubeWL MCU Package
    • Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE

质量与可靠性

产品型号 Marketing Status 符合RoHS级别 材料声明**
B-WL5M-SUBG1
批量生产
Ecopack1

B-WL5M-SUBG1

Package:

Ecopack1

Material Declaration**:

Marketing Status

批量生产

RoHS Compliance Grade

Ecopack1

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
供货状态
Budgetary Price (US$)*/Qty
从ST订购
Order from distributors
包装类型
RoHS
Country of Origin
ECCN (US)
ECCN (EU)
供应商
Specific features
WEEE Compliant
核心产品
B-WL5M-SUBG1
Available at distributors

经销商的可用性 B-WL5M-SUBG1

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

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B-WL5M-SUBG1 批量生产

Budgetary Price (US$)*/Qty:
-
包:
包装类型:
RoHS:
Country of Origin:
ECCN (US):
ECCN (EU):

产品型号:

B-WL5M-SUBG1

供应商:

ST

Specific features:

-

WEEE Compliant:

true

核心产品:

STM32WL5MOC

代理商名称

代理商库存报告日期:

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商