产品概述
描述
The PWD5F60 is an advanced power system-in-package integrating gate drivers and four N-channel power MOSFETs in a compact QFN package.
The integrated power MOSFETs have an RDS(ON) of 1.38 Ω and 600 V drain-source breakdown voltage. The embedded gate drivers feature two comparators that can be used for peak current control or overcurrent protection and integrate bootstrap diodes. This allows to effectively drive loads in a tiny space and to drastically reduce external components and bill of materials.
The EVALPWD5F60 demonstrates how to use the PWD5F60 to drive a single-phase load in full-bridge topology. This allows control of both the direction and the value of the current flowing into the load. Typical applications that can benefit from the high integration of the PWD5F60 are, for example, single-phase BLDC motors and fans.
The board has a very small footprint and an optimized layout thanks to the integrated features of the PWD5F60, and it can be simply run by applying the supply voltages and a direction signal.
The board allows easy selection and modification of the relevant external component values, enabling fast performance evaluation under different applicative conditions as well as fine tuning of final application components.
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所有功能
- Power system-in-package integrating gate drivers and power MOSFETs featuring:
- RDS(ON) = 1.38 Ω
- BVDSS = 600 V
- 2 embedded comparators
- Very low area occupation, all active devices in SMT technology and no heatsink
- Fast-decay or slow-decay on-board constant OFF-time peak current control
- PWM voltage mode control with overcurrent protection possible via external logic signals
- Driver supply voltage range: 10 V to 20 V
- UVLO protection on low-side and high-side
- 3.3 V to 15 V compatible inputs with hysteresis and pull-down
- Internal bootstrap diode
- Bill of materials reduction
- Very compact and simplified layout
- Flexible, easy and fast design
- RoHS compliant
- Load current up to 1 A
- Power system-in-package integrating gate drivers and power MOSFETs featuring:
全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
Board Manufacturing Specifications (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 11 Sep 2018 | 11 Sep 2018 |
物料清单 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 11 Sep 2018 | 11 Sep 2018 |
Schematic Pack (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 11 Sep 2018 | 11 Sep 2018 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
|---|---|---|---|---|---|---|
| EVALPWD5F60 | 批量生产 | CARD | 工业 | Ecopack1 | Yes | |
EVALPWD5F60
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|
| EVALPWD5F60 | distributors 无法联系到经销商，请联系我们的销售办事处 | PWD5F60 | 批量生产 | ST | EAR99 | NEC | ITALY | |