产品概述
描述
The EVLKST8500GH hybrid connectivity solution for the ST8500 SoC platform combines the advantages of both PLC and RF technologies to enable applications with the best coverage in any network conditions and topologies.
You can easily explore features and benefits of the ST hybrid PLC&RF solution using the EVLKST8500GH915 kit together with the STSW-ST8500GH firmware and documentation package.
Messages between two nodes in the PLC&RF hybrid network are sent over the best available medium PLC or RF. The media selection for each link in the network is done automatically and adjusted dynamically, enabling highly efficient hybrid mesh networking.
The ST hybrid PLC&RF solution is based on open standards and enables seamless integration into existing G3-PLC networks and adoption in multiple applications and systems.
Note that at least two EVLKST8500GH915 kits must be ordered to test hybrid PLC&RF connectivity between two nodes.
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所有功能
- Hybrid PLC&RF connectivity development kit based on ST market-proven and widely used connectivity chipsets ST8500, STLD1 and S2-LP, respectively as protocol controller, PLC line driver and RF transceiver
- Modular board architecture:
- EVALMODST8500-1, full-feature PLC module based on ST8500 and STLD1
- X-NUCLEO-S2915A1 for evaluation of RF connectivity in the 860-940 MHz band
- NUCLEO-G070RB with STM32G070RB microcontroller as programmable application controller and interface to PC thanks to the onboard ST-LINK acting also as USB Virtual COM port
- ST8500GH-MB base board for module interconnection plus RS485 and CAN bus connectivity to develop Smart Connectivity applications
- 12 V, 1 A universal DC adapter included for easy start and usage
- Easy expansion of the application functionalities through the STM32 Nucleo open development platform, with a wide choice of specialized shields to be connected to the NUCLEO-G070RB
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All tools & software
全部资源
| 资源标题 | 版本 | 更新时间 |
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产品规格 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 2.0 | 22 Dec 2020 | 22 Dec 2020 |
应用手册 (2)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.2 | 22 Feb 2022 | 22 Feb 2022 | ||
| 2.0 | 14 Dec 2022 | 14 Dec 2022 |
用户手册 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 17 Feb 2021 | 17 Feb 2021 |
宣传册 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 09 Feb 2021 | 09 Feb 2021 |
Evaluation Board Terms of Use (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.7 | 29 May 2023 | 29 May 2023 |
全部资源
| 资源标题 | 版本 | 更新时间 |
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Board Manufacturing Specifications (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 26 Nov 2020 | 26 Nov 2020 |
物料清单 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 26 Nov 2020 | 26 Nov 2020 |
Schematic Pack (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 2.0 | 09 Feb 2021 | 09 Feb 2021 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
|---|---|---|---|---|---|---|
| EVLKST8500GH915 | 批量生产 | CARD | 工业 | Ecopack1 | - | |
EVLKST8500GH915
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|
| EVLKST8500GH915 | distributors 无法联系到经销商，请联系我们的销售办事处 | ST8500 | 批量生产 | ST | 5A002.a.2 | 5A002.a.2 | ITALY | |