产品概述
描述
The SPC56M-DIS Discovery+ kit helps to discover SPC56 M line Power Architecture®Microcontrollers with full access to CPUs, GPI/O's and peripherals such as CAN, UART, JTAG, K-Line, LIN at budget price. Free ready-to-run application firmware examples are available inside SPC5Studio to support quick evaluation and development.
SPC5Studio includes visual configurable code generation engine, board support package (BSP), startup routines, interrupt services, free RTOS (optional) and a full set of low level drivers. SPC5Studio includes Hightec GNU "C" compiler, with a 30-days full free trial license. SPC5Studio is available for free download.
The SPC56 M line is designed to address cost sensitive powertrain and transmission applications.
The SPC56M key functionality is Time processing units (eTPU) a coprocessor to create events in sync with internal or external signals without flooding the CPU with interrupt to serve.
An E2E Community is available on ST WEB to get ST experts support in getting started quickly with SPC56 microcontrollers.
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所有功能
- SPC563M64L7 32-bit Power Architecture®Book E compliant e200z335 CPU core, 1.5Mbyte on-chip in an LQFP176 package.
- Board Supply: Single 5VDC external power supply input.
- All GPIOs and DSPI/uSB signals accessible by a 4x36 100mil pin grid array allowing connection of an additional boards for dedicated applications.
- JTAG interface (7x2 male 100mil)
- 2 high speed CAN interface (DB9 male)
- 2 eSCI interface (DB9 female) or 1
- SCI interface + 1 K-LINE interface.
- 2 deserial serial peripheral interface (DSPI) modules (compatible with Microsecond Bus)
- 1 Optional high speed Nexus interface
- 4 LEDs: LE3 for 5 V power on,LE4 for Reset, LE1 and LE2 for GPIO99 and GPIO98 (for user)
- 12MHz crystal.
- 2 potentiometers for ADC quick evaluation
- Reset push button.
- Board size 145 x 97.5mm
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All tools & software
All resources
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产品规格 (1)
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|---|---|---|---|---|
| 19 Sep 2016 | 19 Sep 2016 |
应用手册 (1)
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|---|---|---|---|---|
| 13 Sep 2018 | 13 Sep 2018 |
用户手册 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 17 Jul 2015 | 17 Jul 2015 | |||
| 15 Mar 2021 | 15 Mar 2021 | |||
| 15 Mar 2021 | 15 Mar 2021 |
Evaluation Board Terms of Use (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 07 Oct 2020 | 07 Oct 2020 |
All resources
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Board Manufacturing Specifications (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 10 Aug 2016 | 10 Aug 2016 | ||
| ZIP | 10 Aug 2016 | 10 Aug 2016 |
Schematic Pack (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 29 Apr 2016 | 29 Apr 2016 |
质量与可靠性
| 产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
|---|---|---|---|
| SPC563M-DISP | 批量生产 | Ecopack1 | |
SPC563M-DISP
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| SPC563M-DISP | 2 distributors | Buy Direct | - | 批量生产 | ST | EAR99 | NEC | - | FRANCE | - | 147.0 / 1 |
