STEVAL-BFA001V2B

批量生产
Design Win

Multi-sensor predictive maintenance kit with IO-Link stack v.1.1

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样片和购买
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工具与软件
质量与可靠性
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产品概述

描述

The STEVAL-BFA001V2B is an industrial reference design kit for condition monitoring (CM) and predictive maintenance (PdM), in a layout that is designed to meet IEC61000-4-2/4 and EN60947 requirements for industrial applications.

The hardware consists of a highly compact (50 x 9 x 9 mm) industrial sensor board specifically designed for real industrial applications, and the necessary debugging tools, cables, plugs and adapters for an industrial communications scenario. The connection is managed using a standard multipolar cable with one wire used for IO-Link data.

The STSW-BFA001V2 firmware package (freely available on www.st.com) includes dedicated algorithms for advanced time and frequency domain signal processing and analysis of the high bandwidth 3D digital accelerometer for vibration monitoring. The package includes pressure, relative humidity and temperature sensor monitoring samples as well as audio algorithms for acoustic emission (AE).

The firmware runs on the high performance STM32F469AI, ARM® Cortex®-M4, 32-bit microcontroller. The sensor data analysis results can be displayed on a user PC terminal emulator via wired connectivity or the related IO-Link master board interface.

IO-Link device stack v1.1. (for evaluation purposes, with some limitations) is included in object library format with IO-Link Device Descriptor (IODD) for all measurements and with dedicated examples to demonstrate device interoperability with any master tool. It supports BLOB transfer for vibration and acoustic FFT data, event generator and parameter configuration.

The package includes a GUI to demonstrate the IO-Link device features when connected to the STEVAL-IDP004V2 multi-port master evaluation board.

  • 所有功能

    • Kit content:
      • Sensor node (marked STEVAL-IDP005V2; not available for separate sale)
      • Communication adapter board (marked STEVAL-UKI001V2; not available for separate sale)
      • STLINK-V3MINI programming and debugging interface
      • Cables and connector
    • Main supply voltage: 18 - 32 V
    • Main components of the sensor node:
      • 32-bit ARM® Cortex®-M4 core for signal processing and analysis (STM32F469AI)
      • Ultra-wide bandwidth (up to 6kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB)
      • Absolute digital pressure sensor (LPS22HB)
      • Relative humidity and temperature sensors (HTS221)
      • Digital microphone sensors (IMP34DT05)
      • IO-Link PHY device (L6362A)
      • EEPROM (M95M01-DF) for data storage
      • Step-down switching regulator and LDO regulator (L6984 and LDK220)
      • ESD protection (ESDALC6V1-1U2, SMBJ33CA)
    • Complete set of firmware demo examples based on 3D accelerometer library with advanced frequency and time domain signal processing for predictive maintenance, including:
      • Programmable FFT size (256, 512, 1024, 2048), overlapping and averaging
      • Programmable windowing (Flat Top, Hanning, Hamming, Rectangular)
      • Speed RMS moving average, acceleration max. peak
      • Programmable threshold for warning and alarm conditions in spectral band
    • Microphone algorithms for:
      • PDM to PCM
      • Sound pressure level (SPL)
      • Audio FFT
    • IO-Link device stack v1.1 protocol and IO-Link Device Descriptor (IODD) for all measurements included (provided by TEConcept GmbH)
    • M12 standard industrial connector
    • SWD connector for debugging and programming capability
    • Reset button
    • Expansion connector with GPIO, ADC, I²C bus, timer
    • Designed to meet IEC industrial standard requirements

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All tools & software

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      状态
      描述
      类型
      供应商

      STSW-BFA001V2

      批量生产

      Software package for STEVAL- BFA001V2B multi-sensor development kit for condition monitoring and predictive maintenance

      评估工具软件 ST
      STSW-BFA001V2

      描述:

      Software package for STEVAL- BFA001V2B multi-sensor development kit for condition monitoring and predictive maintenance
    • 产品型号
      状态
      描述
      类型
      供应商

      FP-IND-PREDMNT1

      批量生产

      通过信号处理使能预测性维护的多传感器节点的STM32Cube功能包

      STM32 ODE功能包软件 ST
      FP-IND-PREDMNT1

      描述:

      通过信号处理使能预测性维护的多传感器节点的STM32Cube功能包
    • 产品型号
      状态
      描述
      类型
      供应商

      STEVAL-IDP004V2

      批量生产

      基于L6360的IO-Link主控多端口评估板

      通信和接口评估板 ST
      STEVAL-IDP004V2

      描述:

      基于L6360的IO-Link主控多端口评估板

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 WEEE Compliant 材料声明**
STEVAL-BFA001V2B
批量生产
CARD 工业 Ecopack2 Yes

STEVAL-BFA001V2B

Package:

CARD

Material Declaration**:

Marketing Status

批量生产

Package

CARD

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
核心产品
供货状态
供应商
ECCN (US)
ECCN (EU)
Country of Origin
Budgetary Price (US$)*/Qty
STEVAL-BFA001V2B Available at distributors

经销商的可用性 STEVAL-BFA001V2B

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
L6362A, IIS3DWB, STM32F469AI
批量生产
ST 3A991.a.2 NEC ITALY

STEVAL-BFA001V2B 批量生产

ECCN (US):
3A991.a.2
Budgetary Price (US$)*/Qty:
-

产品型号:

STEVAL-BFA001V2B

核心产品:

L6362A, IIS3DWB, STM32F469AI

供应商:

ST

ECCN (EU):

NEC

Country of Origin:

ITALY

代理商名称

代理商库存报告日期:

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商