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The general purpose power line modem module is based on an ST7540 FSK power line modem transceiver and an STM32 microcontroller. The PLM module board is a fully functional communication module, with 8 programmable I/Os, a real-time clock and a Flash memory area for modem parameters and user data storage.
The firmware structure is made up of several layers, each dealing with a different feature. The application layer engine is the general interface between the user program and all the parts of the module. It deals with the communication ports, the module peripherals such as SPI, SCI, RTC, I/Os, LEDs and timing management. It is also the interface between the PLM stack and the user program. The PLM stack, itself made up of several layers, implements and manages the power line communication, manages the conflicts, timing and repetitions, the addressing, and so on.
Some features are managed directly by the application engine, and are transparent to the user, such as the RTC management or the module parameter update, as well as the module programming and configuration, which is done by particular programming or service commands managed and acknowledged directly by the application engine.
The user layer is fully customizable by using some easy to use APIs available for user application implementation. User data can be easily addressed to the PLM or to the other communication interface by simply changing the destination channel in the user data structure.主要特性
- Communication interfaces
- Configurable FSK power line modem interface with an embedded firmware stack for a complete power line communication management.
- SPI and USART interfaces for module interfacing
- Module hardware
- Internal configurable RTC time-clock with lithium backup battery
- Up to 8 user-configurable general purpose input/output pins
- Programmable user data and PLM parameters Flash memory area
- PLM communication protocol
- Configurable PLM data link stack working model (master/slave, multimaster)
- Unicast and broadcast data frame capability
- CSMA/CA and repetitions management
- Up to 100 bytes of user data payload
- SPI, USART communication protocol
- Programmable communication interface (SPI, SCI)
- Embedded data, programming and service APIs
- RoHS compliant
- Communication interfaces
All tools & software
All resources
产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Sep 2016 |
19 Sep 2016
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用户手册 (2)
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|---|---|---|---|---|
| 13 Sep 2018 |
13 Sep 2018
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| 13 Sep 2018 |
13 Sep 2018
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Magazine Articles (1)
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|---|---|---|---|---|
| 02 Apr 2018 |
02 Apr 2018
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Evaluation Board Terms of Use (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 07 Oct 2020 |
07 Oct 2020
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Board Manufacturing Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 16 Mar 2015 |
16 Mar 2015
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物料清单 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 16 Mar 2015 |
16 Mar 2015
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Schematic Pack (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 16 Mar 2015 |
16 Mar 2015
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All resources
Board Manufacturing Specifications (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| ZIP | 16 Mar 2015 |
16 Mar 2015
|
物料清单 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 16 Mar 2015 |
16 Mar 2015
|
Schematic Pack (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 16 Mar 2015 |
16 Mar 2015
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质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
|---|---|---|---|---|---|---|
| STEVAL-IHP005V1 |
批量生产
|
CARD | 工业 | Ecopack2 | - |
|
STEVAL-IHP005V1
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|
| STEVAL-IHP005V1 | 4 distributors | Buy Direct | ST7540; STM32F103CB |
批量生产
|
ST | EAR99 | NEC | ITALY | 106.0 / 1 |
