产品概述
描述
The STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits leverage the capabilities of the increased-frequency 800 MHz microprocessors in the STM32MP1 Series to allow users easily develop applications using STM32 MPU OpenSTLinux Distribution software for the main processor and STM32CubeMP1 software for the co-processor.
They include an ST-LINK embedded debug tool, LEDs, push-buttons, one Ethernet 1-Gbps connector, one USB Type-C® OTG connector, four USB Type-A Host connectors, one HDMI® transceiver, one stereo headset jack with analog microphone, and one microSD™ connector.
To expand the functionality of the STM32MP157D-DK1 and STM32MP157F-DK2 Discovery kits, two GPIO expansion connectors are also available for ARDUINO® and Raspberry Pi® shields.
Additionally, the STM32MP157F-DK2 Discovery kit features an LCD display with a touch panel, and Wi-Fi® and Bluetooth® Low Energy capability.
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所有功能
- Common features
- STM32MP157 Arm®-based dual Cortex®-A7 800 MHz 32 bits + Cortex®-M4 32 bits MPU in TFBGA361 package
- ST PMIC STPMIC1
- 4-Gbit DDR3L, 16 bits, 533 MHz
- 1-Gbps Ethernet (RGMII) compliant with IEEE-802.3ab
- USB OTG HS
- Audio codec
- 4 user LEDs
- 2 user and reset push-buttons, 1 wake-up button
- 5 V / 3 A USB Type-C® power supply input (not provided)
- Board connectors:
Ethernet RJ45 4 × USB Host Type-A USB Type-C® DRP MIPI DSISM HDMI® Stereo headset jack including analog microphone input microSD™ card GPIO expansion connector (Raspberry Pi® shield capability) ARDUINO® Uno V3 expansion connectors - On-board ST-LINK/V2-1 debugger/programmer with USB re-enumeration capability: Virtual COM port and debug port
- STM32CubeMP1 and full mainline open-source Linux® STM32 MPU OpenSTLinux Distribution (such as STM32MP1Starter) software and examples
- Support of a wide choice of Integrated Development Environments (IDEs) including IAR Embedded Workbench®, MDK-ARM, and STM32CubeIDE
- Board-specific features
- 4" TFT 480×800 pixels with LED backlight, MIPI DSISM interface, and capacitive touch panel
- Wi-Fi® 802.11b/g/n
- Bluetooth® Low Energy 4.1
- Common features
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全部资源
| 资源标题 | 版本 | Latest update |
|---|
Board Manufacturing Specifications (2)
| 资源标题 | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.0 | 14 Dec 2022 | 14 Dec 2022 | |
| ZIP | 2.1 | 14 Dec 2022 | 14 Dec 2022 |
物料清单 (1)
| 资源标题 | 版本 | Latest update | ||
|---|---|---|---|---|
| ZIP | 3.0 | 14 Dec 2022 | 14 Dec 2022 |
Schematic Pack (2)
| 资源标题 | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 30 Nov 2022 | 30 Nov 2022 | ||
| 1.0 | 30 Nov 2022 | 30 Nov 2022 |
质量与可靠性
| 产品型号 | Marketing Status | 符合RoHS级别 | 材料声明** |
|---|---|---|---|
| STM32MP157D-DK1 | 批量生产 | Ecopack1 | |
STM32MP157D-DK1
Package:
Ecopack1Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Specific features | Country of Origin | WEEE Compliant | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| STM32MP157D-DK1 | distributors 无法联系到经销商，请联系我们的销售办事处 | STM32MP157DAC1 | 批量生产 | ST | 3A991.a.2 | NEC | - | CHINA | true | |