产品概述
描述
The X-STM32MP-MSP01 is a multisensor evaluation board that embeds motion MEMS, environmental, ambient light and Time-of-Flight sensors, a digital microphone, and an NFC tag. This board works with the STM32MPU discovery kit. It can be used with the X-LINUX-MSP1 to read the sensors.
The X-STM32MP-MSP01 main devices are the ISM330DHCX 3-axis accelerometer and gyroscope, the IIS2MDC 3-axis magnetometer, and the LPS22HH MEMS nano pressure sensor.
The board also includes the STTS22H digital temperature sensor, the VD6283TX ambient light sensor, the IIS2DLPC 3-axis accelerometer, the VL53L5CX multizone ranging sensor, and the MP23DB02MM digital MEMS microphone. The on-board dynamic NFC/RFID tag IC can work with a dual interface for the I²C, through a 13.56 MHz RFID reader, or via an NFC phone.
The X-STM32MP-MSP01 interfaces with the STM32MP1Dev via a 40-pin GPIO connector pins using I²C, SPI, and general GPIO pins. It is compatible with STM32MP157F-DK2 and a Raspberry Pi GPIO connector layout.
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所有功能
- Included sensors:
ISM330DHCX: 3-axis accelerometer and 3-axis gyroscope IIS2MDC: 3-axis digital magnetometer (±50 gausses) IIS2DLPC: 3-axis accelerometer for industrial applications (±2/±4/±8/±16 g) STTS22H: digital temperature sensor (-40 to +125°C) LPS22HH: nano pressure sensor (260 - 1260 hPa) VD6283TX: ambient light sensor VL53L5CX: Time-of-Flight (ToF) multizone ranging sensor - Dynamic NFC/RFID tag
- Digital microphone
- Standard DIL 24 pin socket for adapter boards
- Compatible with STM32MP157F-DK2 and Raspberry Pi
- Included sensors:
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全部资源
| 资源标题 | 版本 | 更新时间 |
|---|
Board Manufacturing Specifications (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| ZIP | 1.0 | 11 Oct 2022 | 11 Oct 2022 |
物料清单 (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 11 Oct 2022 | 11 Oct 2022 |
Schematic Pack (1)
| 资源标题 | 版本 | 更新时间 | ||
|---|---|---|---|---|
| 1.0 | 11 Oct 2022 | 11 Oct 2022 |
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | WEEE Compliant | 材料声明** |
|---|---|---|---|---|---|---|
| X-STM32MP-MSP01 | 批量生产 | CARD | 工业 | Ecopack2 | Yes | |
X-STM32MP-MSP01
Package:
CARDMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 核心产品 | 供货状态 | 供应商 | ECCN (US) | ECCN (EU) | Country of Origin | Budgetary Price (US$)*/Qty | |
|---|---|---|---|---|---|---|---|---|---|---|
| X-STM32MP-MSP01 | distributors 无法联系到经销商，请联系我们的销售办事处 | STM32MP157F-DK2, ISM330DHCXTR, IIS2MDCTR, IIS2DLPCTR, STTS22HTR, VD6283TX45/1, VL53L5CXV0GC/1 | 批量生产 | ST | EAR99 | NEC | ITALY | |