VD55G0

批量生产
Design Win

Consumer Global Shutter 0.4Mp

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概述
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
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产品概述

描述

The VD55G0 is a global shutter image sensor with high BSI performance which captures up to 210 frames per second in a 644 x 604 resolution format. The pixel construction of this device minimizes crosstalk while enabling a high quantum efficiency (QE) in the near infrared spectrum.
  • 所有功能

    • Global shutter technology, ST proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full CDTI (capacitive deep trench)
    • High performance with excellentQE (quantum efficiency)MTF (modulation transfer function) up to near IRPerfect PLS (shutter efficiency)
    • Smallest sensor on market with:Compact die size: 2.6 mm x 2.5 mm640 pixel x 600 pixel resolutionVery small pixel array, 1.67 mm x 1.57 mmOptical format between 1/9 inch
    • Operating junction temperature: -30°C to 85°C
    • Single lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.2 Gbps per lane
    • Fast mode+ I2C control interface
    • Integrated temperature sensor
    • Up to 210 fps (frames per second) at full resolution and 260 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic defective correction
    • Embedded auto-exposure
    • 4 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 4 illumination control outputs, synchronized with sensor integration periods and master/slave external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Analog binning: 320x240 @ 500fps, 320x252 @ 480fps, 320x300 @ 414 fps
    • Sub sampling (x2 and x4)

EDA符号、封装和3D模型

STMicroelectronics - VD55G0

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
VD55G0CCA1/RW
批量生产
GOOD DIE 工业 N/A

VD55G0CCA1/RW

Package:

GOOD DIE

Material Declaration**:

Marketing Status

批量生产

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
VD55G0CCA1/RW 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape Mounted GOOD DIE -30 85 TAIWAN

VD55G0CCA1/RW 批量生产

封装:
GOOD DIE
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

VD55G0CCA1/RW

ECCN (EU):

NEC

包装类型:

Tape Mounted

Operating Temperature (°C)

Min:

-30

Max:

85

Country of Origin:

TAIWAN

无法联系到经销商,请联系我们的销售办事处
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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商