产品概述
描述
The VD55G1 is an advanced global shutter with 2.16 μm pixel. It has a small die size of 2.7 x 2.2 mm².
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所有功能
- Compact global shutter technology (40 nm/65 nm)
- High performance 2.16 μm x 2.16 μm BSI deep CDTI pixel
- Smallest global shutter 804x704 pixels with a 5.9 mm2 footprint
- Die size of only 2.7 mm x 2.2 mm; smaller than VGA equivalents
- Small pixel array size of 1.73 mm x 1.73 mm
- Optical format 1/10" with 600x600 crop
- Disruptive streaming modes, with ST in-pixel, enabling features with a single frame only for ultralow latency and power
- Differential mode: ultrafast change tracking, event-like image
- Background removal, without host processing
- Spatial HDR, enabling 90dB+, without frame ghosting or latency
- Autonomous auto wake-up mode, with always-on scene change detection. Host can be fully off, with only VD55G1 consuming
- 1.0 mW at 1 Hz
- 1.5 mW at 5 Hz
- 2.7 mW at 10 Hz
- Very low power consumption
- 800x700 (full IQ, 5 msec exposure)
7 mW at 10 fps 35 mW at 48 fps - 640x480 (full IQ, 5 msec exposure)
6 mW at 10 fps 29 mW at 48 fps - Power consumption scaling with features/framerate and software standby
- 800x700 (full IQ, 5 msec exposure)
- High frame rate: 170 fps at 800x700, 260 fps at VGA and 460 fps at 320x240
- Disruptive I3C interface
- 10x faster control interface, fully backward compatible with I²C
- I3C image output in parallel of CSI-2 (10 fps at 320x240 or 5 fps at 400x400)
- Advanced raw ISP
- Dynamic defective pixel correction
- Smart noise pixel control (3 dB to 9 dB noise reduction)
- Embedded multi auto exposure. Independent auto exposure per context
- Different exposure for each pixel on the same frame (up to 3 exposures per frame)
- Piece wise linear gamma (PWL), one setup per context, 4 points x/y per setup
- Crop, analog, and digital binning (x2 and x4) and subsampling (x2 and x4)
- Mirror/flip readout
- Flexible camera module system
- Programmable sequences of 4-frame contexts, including illumination control
- Up to 4-LED control outputs, synchronized on sensor integration periods with flexible timings and PWM (pulse-width modulation) control
- Master/slave with external frame start
- 1024 bits OTP available for the user/host
- Integrated temperature sensor with ± 2°C accuracy [25°C; 85°C]
- 1.2 Gb/s single lane transmitter MIPI CSI-2, with support down to 400 Mb/s
- Operating junction temperature: -30°C to 85°C
- High optical performance: QE peak >= 90% and MTF 940 nm at 55% Nyquist/2, dynamic range of 65 dB
- Compact global shutter technology (40 nm/65 nm)
EDA符号、封装和3D模型
质量与可靠性
产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
---|---|---|---|---|---|
VD55G1CC/RW | 预览 | GOOD DIE | 工业 | N/A | |
VD55G1CC1/RW | 目标 | GOOD DIE | 工业 | N/A | |
VD55G1CCB0/RW | 预览 | GOOD DIE | 工业 | N/A |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持。
样片和购买
产品型号 | 供货状态 | Budgetary Price (US$)*/Qty | 从ST订购 | Order from distributors | 封装 | 包装类型 | RoHS | Country of Origin | ECCN (US) | ECCN (EU) | 温度(ºC) | Operating Temperature (°C) (min) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
最小值 | 最大值 | |||||||||||||
VD55G1CCB0/RW | | | distributors 无法联系到经销商,请联系我们的销售办事处 | GOOD DIE | Tape Mounted | FRANCE | EAR99 | NEC | -30 | 85 | -30 | |||
VD55G1CC1/RW | | | distributors 无法联系到经销商,请联系我们的销售办事处 | GOOD DIE | Tape Mounted | FRANCE | - | - | -30 | 85 | -30 | |||
VD55G1CC/RW | | | distributors 无法联系到经销商,请联系我们的销售办事处 | GOOD DIE | Tape Mounted | FRANCE | EAR99 | NEC | -30 | 85 | -30 |
VD55G1CC1/RW 目标
VD55G1CC/RW 预览