VD55G1

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Advanced Global Shutter 2D imaging sensor with 800x700 resolution, in compact size

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产品概述

描述

The VD55G1 is a unique ultracompact and low-power image sensor in the ST Bright Sense portfolio. It has been developed to enable the next generation of smart and power-efficient systems. Leveraging the world’s first 2.16 µm global shutter pixel, the sensor highlights maximum compactness. It has a tiny 2.73 x 2.16 mm² footprint that fits into the most size-constrained devices such as AR/VR glasses or personal electronics.

With its well-thought-out design, the VD55G1 maintains low power consumption even when pushed at the highest frame rates, making it ideal for battery-powered devices. In addition to this low operating power, the sensor embeds an auto wake up feature. This enables the sensor to operate in an ultralow power sleepy mode when no change or event is detected. As soon as an event is detected, the sensor automatically sends a trigger to its host processor to switch into full streaming mode to capture the corresponding event. Thanks to this clever feature, vision system makers can finally get rid of the power-hungry, ineffective 24/7 operation of systems such as security cameras, auto-ID, or in-line product inspection.

Besides auto wake up, the VD55G1 embeds a complete toolbox of on-chip features for optimizing image quality, adjusting frame rate, or improving data efficiency. Autoexposure, noise reduction, and various image corrections help to get stunning images directly from the sensor. This sensor can perform background removal for more efficient face ID, or capture event frames in an event-like mode, enabling the output of event information in a synchronous manner.

Combining a small form factor, power efficiency, and a full range of clever features, the VD55G1 is the ideal vision extension for the next generation of smart embedded systems. Its single-lane MIPI CSI-2 output and I²C or I3C control interface makes it natively compatible with the broadest range of processing units. To facilitate further integration, the sensor is provided along with development kits, camera modules, and drivers. All can be found on st.com.

  • 所有功能

    • Tiny sensor, which can fit everywhere:
      • World’s first 2.16 µm global shutter pixel for optimum compactness
      • Footprint of only 2.73 x 2.16 mm²
      • Small optical format of 1/9 inch (800 x 700) and 1/10 inch (600 x 600)
    • Ultralow power solution with:
      • Smart auto wake up feature, with ultralow power sleepy mode, and smart wake up when an event is detected
      • Low power operation of ≤ 2 mW in autowake up mode
      • Power consumption scaling with features, frame rate, and software standby
    • Optimized image quality straight out of the sensor with:
      • Cutting-edge performance of ST proprietary pixels combining global shutter, BSI, CDTI, and 3D stacking
      • High sensitivity and sharpness in both visible and NIR
      • Various on-chip features to optimize image quality, such as autoexposure, noise reduction, or defect correction
    • Seamless integration into embedded systems:
      • 1-lane MIPI CSI-2 output
      • I²C and I3C control interface
      • Effortless integration with VD55G1 development kit, camera modules, with drivers available from st.com

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EDA符号、封装和3D模型

STMicroelectronics - VD55G1

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产品型号 Marketing Status 等级规格 符合RoHS级别 材料声明**
VD55G1CC/RW
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GOOD DIE 工业 N/A
VD55G1CC1/RW
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GOOD DIE 工业 N/A
VD55G1CCB0/RW
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VD55G1CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

预览

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

VD55G1CC1/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

预览

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

VD55G1CCB0/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

评估

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商