VD56G3

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Design Win

Consumer Global Shutter 1.5Mp

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概述
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
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Sales Briefcase

产品概述

描述

The VD56G3 is a global shutter image sensor optimized for near infrared scenes. The sensor captures up to 98 frames per second in a 1124 x 1364 resolution format. The pixel construction of this device minimises crosstalk.

  • 所有功能

    • Global shutter technology, ST proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)
    • High-performance with excellent
      • QE (quantum efficiency)
      • MTF (modulation transfer function) up to near IR
      • Perfect PLS (shutter efficiency)
    • Smallest sensor on market with 1.5 Mpixel resolution
      • Compact die size: 3.6 mm x 4.3 mm
      • 1124 pixels x 1364 pixels
      • Very small pixel array, 2.9 mm x 3.6 mm
      • Optical format ¼ inch
    • Operating junction temperature: -30 °C to 85 °C
    • Dual lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.5 Gbps per lane
    • Fast mode+ I2C control interface
    • Integrated temperature sensor
    • Up to 98 fps (frames per second) at full resolution and 240 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic and map-based defective correction
    • Embedded auto-exposure with 336 zone statistics
    • 8 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 8 illumination control outputs synchronized with sensor integration periods and master/slave external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Sub sampling (x2 and x4)

EDA符号、封装和3D模型

STMicroelectronics - VD56G3

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
VD56G3CC/RW
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GOOD DIE 工业 N/A

VD56G3CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

预览

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
VD56G3CC/RW Available at distributors

经销商的可用性 VD56G3CC/RW

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
预览
EAR99 NEC Tape Mounted GOOD DIE -30 85 FRANCE

VD56G3CC/RW 预览

封装:
GOOD DIE
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

VD56G3CC/RW

ECCN (EU):

NEC

包装类型:

Tape Mounted

Operating Temperature (°C)

Min:

-30

Max:

85

Country of Origin:

FRANCE

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商