概述
样片和购买
解决方案
资源
工具与软件
质量与可靠性
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  • The VD56G3 is a global shutter image sensor optimized for near infrared scenes. The sensor captures up to 98 frames per second in a 1124 x 1364 resolution format. The pixel construction of this device minimises crosstalk.

    主要特性

    • Global shutter technology, ST proprietary single layer
    • 3D stacked sensor 40 nm/65 nm
    • 2.61 µm x 2.61 µm BSI pixel with full DTI (deep trench isolation)
    • High-performance with excellent
      • QE (quantum efficiency)
      • MTF (modulation transfer function) up to near IR
      • Perfect PLS (shutter efficiency)
    • Smallest sensor on market with 1.5 Mpixel resolution
      • Compact die size: 3.6 mm x 4.3 mm
      • 1124 pixels x 1364 pixels
      • Very small pixel array, 2.9 mm x 3.6 mm
      • Optical format ¼ inch
    • Operating junction temperature: -30 °C to 85 °C
    • Dual lane transmitter MIPI CSI-2 (copyright© 2005-2010 MIPI Alliance, Inc. Standard for Camera Serial Interface 2 (CSI-2) version 1.0) version 1.3, 1.5 Gbps per lane
    • Fast mode+ I2C control interface
    • Integrated temperature sensor
    • Up to 98 fps (frames per second) at full resolution and 240 fps with VGA resolution
    • Programmable sequences of 4-frame contexts, including frame parameters
    • Automatic dark calibration
    • Dynamic and map-based defective correction
    • Embedded auto-exposure with 336 zone statistics
    • 8 multiple function IO, dynamically programmable with frame contexts (GPIO, strobe pulse, pulse-width modulation, V sync)
    • Up to 8 illumination control outputs synchronized with sensor integration periods and master/slave external frame start
    • Mirror/flip readout
    • Fully sequenceable with frame contexts
    • Crop
    • Binning (x2 and x4)
    • Sub sampling (x2 and x4)

适合您的资源

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技术文档

    • 描述 版本 文档大小 操作
      DB4116
      Advanced 1.5 Mpixel, backside illuminated Global Shutter, ultra compact sensor, with high QE, high MTF, excellent PLS, and full-features
      4.0
      2.52 MB
      PDF
      DB4116

      Advanced 1.5 Mpixel, backside illuminated Global Shutter, ultra compact sensor, with high QE, high MTF, excellent PLS, and full-features

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
VD56G3CC/RW
预览
GOOD DIE 工业 N/A

VD56G3CC/RW

Package:

GOOD DIE

Material Declaration**:

PDF XML

Marketing Status

预览

Package

GOOD DIE

Grade

Industrial

RoHS Compliance Grade

N/A

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
VD56G3CC/RW 没有经销商,请联系我们的销售办事处
预览
EAR99 NEC Tape Mounted GOOD DIE -30 85 FRANCE

VD56G3CC/RW

供货状态

预览

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape Mounted

封装

GOOD DIE

Operating Temperature (°C)

(最小值)

-30

(最大值)

85

Budgetary Price (US$)* / Qty

Country of Origin

FRANCE

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商