产品概述
描述
ST7590 is the first complete Narrowband OFDM power line communication system-on-chip made using a multi-power technology with state of the art VLSI CMOS lithography. The ST7590 is based on dual core architecture to assure outstanding communication performance with a very high level of flexibility and programmability for either open standard or fully customized implementations.-
所有功能
- Fully integrated narrow-band power line networking system-on-chip
- High performing DSP engine with embedded turn-key firmware for Orthogonal frequency division multiplexing (OFDM) modulation, featuring:
- 96 sub-carriers in CENELEC A band
- BDPSK, QDPSK, 8DPSK programmable modulations
- Programmable bit rate up to 128 kbps
- Convolutional coding and Viterbi decoding
- Signal to noise ratio and channel quality estimation
- Full PRIME compliant PHY
- On chip peripherals:
- Host controller UART/SPI interface
- I2C/SPI external data memory interface
- High speed SRAM controller for optional external SRAM program code execution
- Watchdog timer
- On chip 128 bit AES encryption HW block
- Fully integrated analog front end:
- ADC and DAC
- High sensitivity receiver
- High linearity transmitter with intelligent gain control
- Fully integrated power line driver
- Up to 1 Arms, 14 Vpp single ended
- Configurable active filtering topology
- Ultra low distortion
- Embedded temperature sensor
- Current control
- 3.3 V or 5 V I/O digital I/O supply
- Integrated 5 V and 1.8 V linear regulators for AFE and digital core supply
- 8 V to 18 V line driver power supply
- Suitable for applications compliant with EN50065 and FCC part 15 specifications
- -40 °C to +85 °C temperature range
- QFN48 7x7 (ST7590) and TQFP 100 14x14 (ST7590T) exposed pad package options
电路原理图
全部资源
| Resource title | Latest update |
|---|
产品规格 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 19 Sep 2016 | 19 Sep 2016 |
应用手册 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 15 Apr 2021 | 15 Apr 2021 | |||
| 13 Sep 2018 | 13 Sep 2018 | |||
| 12 Mar 2016 | 12 Mar 2016 |
Design Notes & Tips (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Sep 2018 | 13 Sep 2018 |
宣传册 (3)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 09 Feb 2021 | 09 Feb 2021 | |||
| 17 Nov 2020 | 17 Nov 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 |
手册 (2)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 03 Jun 2021 | 03 Jun 2021 | |||
| 15 Jun 2018 | 15 Jun 2018 |
许可协议 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 10 Apr 2019 | 10 Apr 2019 |
EDA符号、封装和3D模型
STMicroelectronics - ST7590
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 等级规格 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|---|
| ST7590T | NRND | TQFP 100 14x14x1.0 | 工业 | Ecopack2 | |
ST7590T
Package:
TQFP 100 14x14x1.0Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| ST7590T | 无法联系到经销商，请联系我们的销售办事处 | Buy Direct | NRND | 5A992C | 5A002A2 | Tray | TQFP 100 14x14x1.0 | - | - | MALAYSIA | 7.37 / 1k | |
