ST7590

NRND

OFDM窄带电力线网络片上系统

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概述
Online design
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
开始
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Sales Briefcase

产品概述

描述

ST7590 is the first complete Narrowband OFDM power line communication system-on-chip made using a multi-power technology with state of the art VLSI CMOS lithography. The ST7590 is based on dual core architecture to assure outstanding communication performance with a very high level of flexibility and programmability for either open standard or fully customized implementations.
  • 所有功能

    • Fully integrated narrow-band power line networking system-on-chip
    • High performing DSP engine with embedded turn-key firmware for Orthogonal frequency division multiplexing (OFDM) modulation, featuring:
      • 96 sub-carriers in CENELEC A band
      • BDPSK, QDPSK, 8DPSK programmable modulations
      • Programmable bit rate up to 128 kbps
      • Convolutional coding and Viterbi decoding
      • Signal to noise ratio and channel quality estimation
      • Full PRIME compliant PHY
    • On chip peripherals:
      • Host controller UART/SPI interface
      • I2C/SPI external data memory interface
      • High speed SRAM controller for optional external SRAM program code execution
      • Watchdog timer
    • On chip 128 bit AES encryption HW block
    • Fully integrated analog front end:
      • ADC and DAC
      • High sensitivity receiver
      • High linearity transmitter with intelligent gain control
    • Fully integrated power line driver
      • Up to 1 Arms, 14 Vpp single ended
      • Configurable active filtering topology
      • Ultra low distortion
      • Embedded temperature sensor
      • Current control
    • 3.3 V or 5 V I/O digital I/O supply
    • Integrated 5 V and 1.8 V linear regulators for AFE and digital core supply
    • 8 V to 18 V line driver power supply
    • Suitable for applications compliant with EN50065 and FCC part 15 specifications
    • -40 °C to +85 °C temperature range
    • QFN48 7x7 (ST7590) and TQFP 100 14x14 (ST7590T) exposed pad package options

电路原理图

特别推荐

EDA符号、封装和3D模型

STMicroelectronics - ST7590

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
ST7590T
NRND
TQFP 100 14x14x1.0 工业 Ecopack2

ST7590T

Package:

TQFP 100 14x14x1.0

Material Declaration**:

Marketing Status

NRND

Package

TQFP 100 14x14x1.0

Grade

Industrial

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ST7590T 无法联系到经销商,请联系我们的销售办事处 Buy Direct
NRND
5A992C 5A002A2 Tray TQFP 100 14x14x1.0 - - MALAYSIA 7.37 / 1k

ST7590T

供货状态

NRND

ECCN (US)

5A992C

Budgetary Price (US$)*/Qty

7.37 / 1k

ECCN (EU)

5A002A2

包装类型

Tray

封装

TQFP 100 14x14x1.0

Operating Temperature (°C)

(最小值)

-

(最大值)

-

Budgetary Price (US$)* / Qty

7.37 / 1k

Country of Origin

MALAYSIA

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商