STULPI01B

批量生产
Design Win

高速USB On-The-Go ULPI收发器

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概述
样片和购买
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文件
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质量与可靠性
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产品概述

描述

The STULPI01 is a high-speed USB 2.0 transceiver compliant with ULPI (UTMI+ low pin interface) and OTG (On-The-Go) specifications, providing a complete physical layer solution for any high-speed USB host, device or OTG dual-role core. It allows USB ASICs to interface with the physical layer of the USB through a 12-pin interface. It contains VBUS comparators, an ID line detector, USB differential drivers and receivers and a complete ULPI register map and interrupt generator. The STULPI01 transceiver is suitable for mobile applications and battery-powered devices because of its low-power consumption, Power-down operating mode and minimal die/package dimensions.

  • 所有功能

    • USB-IF high-speed certified to the universal serial bus specification rev. 2.0
    • Meets the requirements of the universal serial bus specification rev. 2.0, On-The-Go supplement to the USB 2.0 specification 1.0a and ULPI transceiver specification 1.1
    • Standard ULPI (UTMI+ low pin interface) 1.1 digital interface
    • Fully compliant with ULPI 1.1 register set
    • External square wave clock with VDVIOamplitude must be applied to oscillator input XI
    • Supports 480 Mbit/s High-speed, 12 Mbit/s Full-speed and 1.5 Mbit/s Low-speed modes of operation
    • Supports 2.7 V UART mode
    • Supports session request protocol (SRP) and host negotiation protocol (HNP) for dual-role device features
    • Ability to control external charge pump for higher VBUS currents
    • Single supply, +3 V to +4.5 V voltage range
    • Integrated dual voltage regulator to supply internal circuits with stable 3.3 V and 1.2 V
    • Integrated overcurrent detector
    • Integrated HS termination and FS/LS/OTG pull-up/pull-down resistors
    • Integrated USB 2.0 “short-circuit withstand” protection
    • Power-down mode with very low-power consumption for battery-powered devices
    • Ideal for system ASICs with built-in USB host, device or OTG cores
    • Available in μTFBGA36 RoHS package
    • –40 to 85 °C operating temperature range

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EDA符号、封装和3D模型

STMicroelectronics - STULPI01B

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 等级规格 符合RoHS级别 材料声明**
STULPI01BTBR
批量生产
TFBGA 36 3.6x3.6 工业 Ecopack3

STULPI01BTBR

Package:

TFBGA 36 3.6x3.6

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

TFBGA 36 3.6x3.6

Grade

Industrial

RoHS Compliance Grade

Ecopack3

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
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供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
STULPI01BTBR Available at distributors

经销商的可用性 STULPI01BTBR

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

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批量生产
EAR99 NEC Tape and Reel TFBGA 36 3.6x3.6 -40 85 MALAYSIA

STULPI01BTBR 批量生产

封装:
TFBGA 36 3.6x3.6
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

STULPI01BTBR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

MALAYSIA

代理商名称

代理商库存报告日期:

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(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商