标准串行EEPROM

5引脚DFN是一种标准JEDEC封装，具有极其紧凑的外形（1.4 x 1.7 mm），使其成为介于标准8引脚DFN （2 x 3 mm）封装和更先进的芯片级封装解决方案之间的通用替代方案。其塑料封装使用传统的铜引线框架技术，稳定的性能使其非常适合搬运和制造应用。 DFN5 I2C EEPROM在保持简单制造工艺的同时确保降低尺寸和减轻重量，非常适合便携式应用中通信和传感器模块的引导、设置和数据记录功能。意法半导体的 DFN5 I2C EEPROM产品组合采用的元件存储空间 从2 - 128 Kb。

Camera modules for mobile devices follow a path of quick miniaturization while display resolution increases and requires a higher set of parameters to operate efficiently.

The 4-ball WLCSP I2C EEPROM family provides a minimal pin count, footprint and thickness, fitting the most stringent hardware design requirements. In addition, thanks to internally-wired device select code options, the EEPROM for rear and front cameras can share the same I2C bus, providing further module design optimization.

The factory-programmed settings can also be protected when selecting products with the software write-protect instruction.

Manufacturing robustness aspects are also covered with an optional back-side coating.

Choose your product: Compatible 4-ball I2C (with industry-standard footprint) or SWP 4-ball I2C (with software write-protect option)