产品概述
描述
The H3LIS200DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output. The device features ultra-low-power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.The H3LIS200DL has dynamically user-selectable full scales of ±100g/±200g and is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
The H3LIS200DL is available in a small thin plastic land grid array package (LGA) and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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所有功能
- Wide supply voltage, 2.16 V to 3.6 V
- Low-voltage compatible IOs, 1.8 V
- Ultra-low power consumption down to 10 μA in low-power mode
- ±100g/±200g dynamically selectable full scales
- I2C/SPI digital output interface
- 8-bit data output
- Sleep-to-wakeup function
- 10000 g high shock survivability
- ECOPACK®, RoHS and “Green” compliant
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精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
全部资源
| Resource title | Latest update |
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产品规格 (1)
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|---|---|---|---|---|
| 08 Apr 2020 | 08 Apr 2020 |
技术文档 (1)
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|---|---|---|---|---|
| 18 Jan 2021 | 18 Jan 2021 |
Design Notes & Tips (5)
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| 21 Jan 2021 | 21 Jan 2021 | |||
| 21 Jan 2021 | 21 Jan 2021 | |||
| 21 Jan 2021 | 21 Jan 2021 | |||
| 21 Jan 2021 | 21 Jan 2021 | |||
| 21 Jan 2021 | 21 Jan 2021 |
宣传册 (2)
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|---|---|---|---|---|
| 19 Jan 2021 | 19 Jan 2021 | |||
| 30 Apr 2021 | 30 Apr 2021 |
手册 (5 of 7)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 13 Jun 2019 | 13 Jun 2019 | |||
| 07 Apr 2021 | 07 Apr 2021 | |||
| 06 Aug 2020 | 06 Aug 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 25 Feb 2021 | 25 Feb 2021 | |||
| 06 Feb 2020 | 06 Feb 2020 | |||
| 23 Jun 2020 | 23 Jun 2020 |
白皮书 (1)
| Resource title | Latest update | |||
|---|---|---|---|---|
| 04 Dec 2018 | 04 Dec 2018 |
EDA符号、封装和3D模型
STMicroelectronics - H3LIS200DL
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| H3LIS200DL | 批量生产 | LLGA 16 3x3x1.0 | Ecopack2 | |
| H3LIS200DLTR | 批量生产 | LLGA 16 3x3x1.0 | Ecopack2 | |
H3LIS200DL
Package:
LLGA 16 3x3x1.0Material Declaration**:
H3LIS200DLTR
Package:
LLGA 16 3x3x1.0Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| H3LIS200DL | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tray | LLGA 16 3x3x1.0 | -40 | 85 | MALTA | 4.0 / 1k | ||
| H3LIS200DLTR | 2 distributors | Free Sample Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | LLGA 16 3x3x1.0 | -40 | 85 | MALTA | 4.0 / 1k | |
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
4.0 / 1k