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H3LIS331DL

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Low power High-g 3-axis accelerometer, SPI/I2C digital output MEMS motion sensor, user-selectable full scales of ±100g/±200g/±400g

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The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I²C/SPI serial interface standard output.

The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.
The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.

Key Features
- Wide supply voltage, 2.16 V to 3.6 V
- Low-voltage compatible IOs, 1.8 V
- Ultra-low power consumption down to 10 μA in low-power mode
- ±100g/±200g/±400g dynamically selectable full scales
- I²C/SPI digital output interface
- 16-bit data output
- Sleep-to-wakeup function
- 10000 g high-shock survivability
- ECOPACK^®, RoHS and “Green” compliant
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样片和购买

产品型号

封装

包装类型

供货状态

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数量

ECCN (US)

Country of Origin

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从ST订购

H3LIS331DLTR

LLGA 16 3x3x1.0

Tape And Reel

5.5

1000

EAR99

查看供货情况

Distributor availability ofH3LIS331DLTR

代理商名称	地区	库存	最小订购量	Third party link
AVNET	AMERICA	4000	0	Order Now
FUTURE	WORLDWIDE	5816	1	Order Now
MOUSER	WORLDWIDE	17479	1	Order Now
Farnell Element14	EUROPE	207	1	Order Now
RUTRONIK	EUROPE	4000	4000	Order Now

代理商库存报告日期: 2019-11-11

代理商名称

AVNET

库存

4000

Min.Order

地区

AMERICA Order Now

FUTURE

库存

5816

Min.Order

地区

WORLDWIDE Order Now

MOUSER

库存

17479

Min.Order

地区

WORLDWIDE Order Now

Farnell Element14

库存

207

Min.Order

地区

EUROPE Order Now

RUTRONIK

库存

4000

Min.Order

4000

地区

EUROPE Order Now

代理商库存报告日期: 2019-11-11

获取样片

H3LIS331DL

LLGA 16 3x3x1.0

Tray

5.5

1000

EAR99

查看供货情况

Distributor availability ofH3LIS331DL

代理商名称	地区	库存	最小订购量	Third party link
ANGLIA Live	EUROPE	198	1	Order Now

代理商库存报告日期: 2019-11-11

代理商名称

ANGLIA Live

库存

198

Min.Order

地区

EUROPE Order Now

代理商库存报告日期: 2019-11-11

H3LIS331DLTR

封装

LLGA 16 3x3x1.0

包装类型

Tape And Reel

More Info

单价(US$)

5.5*

Distributor availability ofH3LIS331DLTR

代理商名称	地区	库存	最小订购量	Third party link
AVNET	AMERICA	4000	0	Order Now
FUTURE	WORLDWIDE	5816	1	Order Now
MOUSER	WORLDWIDE	17479	1	Order Now
Farnell Element14	EUROPE	207	1	Order Now
RUTRONIK	EUROPE	4000	4000	Order Now

代理商库存报告日期: 2019-11-11

代理商名称

AVNET

库存

4000

Min.Order

地区

AMERICA Order Now

FUTURE

库存

5816

Min.Order

地区

WORLDWIDE Order Now

MOUSER

库存

17479

Min.Order

地区

WORLDWIDE Order Now

Farnell Element14

库存

207

Min.Order

地区

EUROPE Order Now

RUTRONIK

库存

4000

Min.Order

4000

地区

EUROPE Order Now

代理商库存报告日期: 2019-11-11

供货状态

批量生产

单价(US$)

5.5

数量

1000

ECCN (US)

EAR99

Country of Origin

H3LIS331DL

封装

LLGA 16 3x3x1.0

包装类型

Tray

More Info

单价(US$)

5.5*

Distributor availability ofH3LIS331DL

代理商名称	地区	库存	最小订购量	Third party link
ANGLIA Live	EUROPE	198	1	Order Now

代理商库存报告日期: 2019-11-11

代理商名称

ANGLIA Live

库存

198

Min.Order

地区

EUROPE Order Now

代理商库存报告日期: 2019-11-11

供货状态

批量生产

单价(US$)

5.5

数量

1000

ECCN (US)

EAR99

Country of Origin

(*) 建议转售单价（美元）仅用于预算用途。如需以当地货币计价的报价，请联系您当地的 ST销售办事处或我们的经销商。

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工业工具 (1)
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工业传感器 (1)
- 运动和振动
追踪 (1)
- 托盘和集装箱追踪

能源分配 (1)
- 直流快速充电站

生态系统

Cloud

Part number	制造商	描述
AWS IoT Core	AWS	AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices
AZURE Cloud	Microsoft	Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.
Watson IoT Platform	IBM	IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

产品型号

AWS IoT Core

AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices

AZURE Cloud

Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

Watson IoT Platform

IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

元件与模块

Part number	制造商	描述
Accel 3 click	MikroElektronika	Accel 3 click carries the H3LIS331DL a low-power high-performance 3-axis linear accelerometer. The click is designed to run on a 3.3V power supply. It communicates with the target microcontroller over SPI or I2C interface, with additional functionality provided by the INT pin on the mikroBUS™ line.
SensiBLE	SensiEDGE	Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!
SensiBLE 2.0	SensiEDGE	SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.
SensiSUB	SensiEDGE	Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

产品型号

Accel 3 click

Accel 3 click carries the H3LIS331DL a low-power high-performance 3-axis linear accelerometer. The click is designed to run on a 3.3V power supply. It communicates with the target microcontroller over SPI or I2C interface, with additional functionality provided by the INT pin on the mikroBUS™ line.

SensiBLE

Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!

SensiBLE 2.0

SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.

SensiSUB

Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

软件

MCU 及 MPU嵌入式软件

Picture	Part number	制造商	描述
	X-CUBE-MEMS-XT1	ST	Sensor and DSP algorithm software expansion for STM32Cube

产品型号

X-CUBE-MEMS-XT1

Sensor and DSP algorithm software expansion for STM32Cube

MEMS and Sensors Software

Part number	制造商	描述
AndroidHALInput	ST	Android sensor HAL for MEMS motion and environmental sensors (Input framework)
C-Driver-MEMS	ST	Standard C platform-independent drivers for MEMS motion and environmental sensors
LinuxDriverInput	ST	Linux device drivers for MEMS motion and environmental sensors (Input framework)

产品型号

AndroidHALInput

Android sensor HAL for MEMS motion and environmental sensors (Input framework)

C-Driver-MEMS

Standard C platform-independent drivers for MEMS motion and environmental sensors

LinuxDriverInput

Linux device drivers for MEMS motion and environmental sensors (Input framework)

评估工具

产品评估工具

Picture	Part number	制造商	描述
	STEVAL-MKI153V1	ST	H3LIS331DL 3-axis digital accelerometer adapter board for standard DIL 24 socket, compatible with STEVAL-MKI109V2

产品型号

STEVAL-MKI153V1

H3LIS331DL 3-axis digital accelerometer adapter board for standard DIL 24 socket, compatible with STEVAL-MKI109V2

支持和应用

工程服务

Part number	制造商	描述
Hardware and firmware design	SIANA Systems	Complete hardware and firmware design for all applications
SensiEDGE customization services	SensiEDGE	End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!
SensorTile.box customization services	FAE Technology	Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

产品型号

Hardware and firmware design

Complete hardware and firmware design for all applications

SensiEDGE customization services

End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

SensorTile.box customization services

Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

00 选择要下载的文档

技术文档

产品规格

	描述	版本	文档大小	操作
	DS9012 MEMS motion sensor: low-power high-g 3-axis digital accelerometer	3.0	804.23 KB	PDF

DS9012

MEMS motion sensor: low-power high-g 3-axis digital accelerometer

PDF

技术文档

	描述	版本	文档大小	操作
	TN0018 LGA 封装中MEMS 传感器的表面贴装指南	1.0	251.2 KB	PDF

TN0018

LGA 封装中MEMS 传感器的表面贴装指南

PDF

Design Notes & Tips

描述	版本	文档大小	操作
DT0105 1-point or 3-point tumble sensor calibration	1.0	148.7 KB	PDF
DT0053 6-point tumble sensor calibration	1.0	464.9 KB	PDF
DT0076 Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation	1.0	490.58 KB	PDF
DT0126 Low-power application design with ST's MEMS accelerometers	1.0	184.68 KB	PDF
DT0106 Residual linear acceleration by gravity subtraction to enable dead-reckoning	1.0	192.08 KB	PDF
DT0127 ST's MEMS accelerometer sensor testing & self-test	1.1	409.32 KB	PDF

DT0105

1-point or 3-point tumble sensor calibration

PDF

DT0053

6-point tumble sensor calibration

PDF

DT0076

Compensating for accelerometer installation error: zeroing pitch and roll for a reference orientation

PDF

DT0126

Low-power application design with ST's MEMS accelerometers

PDF

DT0106

Residual linear acceleration by gravity subtraction to enable dead-reckoning

PDF

DT0127

ST's MEMS accelerometer sensor testing & self-test

PDF

出版刊物和宣传资料

宣传册

	描述	版本	文档大小	操作
	Industrial MEMS motion sensors	1.0	1.36 MB	PDF

Industrial MEMS motion sensors

PDF

手册

描述	版本	文档大小	操作
MEMS Sensors for automotive applications	1.0	3.33 MB	PDF
MEMS和传感器智能运动追踪、IoT和增强用户体验	1.0	11.08 MB	PDF
Sensor & motion algorithm software pack for STM32Cube	1.0	544.58 KB	PDF
Sensors for industrial and multi-segment solutions	1.0	1.77 MB	PDF

MEMS Sensors for automotive applications

PDF

MEMS和传感器智能运动追踪、IoT和增强用户体验

PDF

Sensor & motion algorithm software pack for STM32Cube

PDF

Sensors for industrial and multi-segment solutions

PDF

Magazine Articles

	描述	版本	文档大小	操作
	AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing	1.0	378.27 KB	PDF

AUTO - International Journal of THE FIA, March 2013: Size matters. ST’s high-g accelerometer revolutionizes crash safety in Formula One racing

PDF

白皮书

	描述	版本	文档大小	操作
	Capacitive MEMS accelerometer for condition monitoring	1.0	3.35 MB	PDF

Capacitive MEMS accelerometer for condition monitoring

PDF

产品型号	供货状态	封装	符合RoHS级别	Material Declaration**
H3LIS331DL	批量生产	LLGA 16 3x3x1.0	Ecopack2	PDF XML
H3LIS331DLTR	批量生产	LLGA 16 3x3x1.0	Ecopack2	PDF XML

H3LIS331DL

Package:

LLGA 16 3x3x1.0

Material Declaration**:

PDF XML

More Info

Marketing Status

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

H3LIS331DLTR

Package:

LLGA 16 3x3x1.0

Material Declaration**:

PDF XML

More Info

Marketing Status

Package

LLGA 16 3x3x1.0

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.

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