产品概述
描述
The H3LIS331DL is a low-power high-performance 3-axis linear accelerometer belonging to the “nano” family, with digital I2C/SPI serial interface standard output. The device features ultra-low power operational modes that allow advanced power saving and smart sleep-to-wakeup functions.The H3LIS331DL has dynamically user-selectable full scales of ±100g/±200g/±400g and it is capable of measuring accelerations with output data rates from 0.5 Hz to 1 kHz.
The H3LIS331DL is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.
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所有功能
- Wide supply voltage, 2.16 V to 3.6 V
- Low-voltage compatible IOs, 1.8 V
- Ultra-low power consumption down to 10 μA in low-power mode
- ±100g/±200g/±400g dynamically selectable full scales
- I2C/SPI digital output interface
- 16-bit data output
- Sleep-to-wakeup function
- 10000 g high-shock survivability
- ECOPACK®, RoHS and “Green” compliant
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精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 3.0 | 14 Apr 2020 | 14 Apr 2020 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 29 Jun 2021 | 29 Jun 2021 |
Design Notes & Tips (5 of 6)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.0 | 28 Feb 2020 | 28 Feb 2020 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.2 | 21 Jan 2021 | 21 Jan 2021 |
宣传册 (2)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 19 Jan 2021 | 19 Jan 2021 | ||
| 1.0 | 30 Apr 2021 | 30 Apr 2021 |
手册 (5 of 6)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 01.21 | 19 Mar 2021 | 19 Mar 2021 | ||
| 2.0 | 25 Feb 2021 | 25 Feb 2021 | ||
| 1.0 | 06 Feb 2020 | 06 Feb 2020 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
Magazine Articles (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 10 Aug 2016 | 10 Aug 2016 |
白皮书 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 04 Dec 2018 | 04 Dec 2018 |
EDA符号、封装和3D模型
STMicroelectronics - H3LIS331DL
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| H3LIS331DLTR | 2 distributors | Buy Direct | 批量生产 | EAR99 | NEC | Tape And Reel | LLGA 16 3x3x1.0 | -40 | 85 | MALTA | 6.05 / 1k | |
