产品概述
描述
The IIS3DHHC is an ultra-low noise, high-stability three-axis linear accelerometer. The IIS3DHHC has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The IIS3DHHC is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.
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所有功能
- Included in the 10-year longevity program
- 3-axis, ±2.5 g full-scale
- Ultra-low noise performance: 45 µg/√Hz
- Excellent stability over temperature (<0.4 mg/°C) and time
- 16-bit data output
- SPI 4-wire digital output interface
- Embedded FIFO (depth 32 levels)
- Embedded temperature sensor
- 12-bit temperature data output
- High shock survivability
- Extended operating temperature range (-40 °C to +85 °C)
- ECOPACK®, RoHS and “Green” compliant
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精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
全部资源
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产品规格 (1)
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| 31 Mar 2020 | 31 Mar 2020 |
应用手册 (3)
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| 19 Mar 2021 | 19 Mar 2021 |
技术文档 (1)
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| 18 Jan 2021 | 18 Jan 2021 |
Design Notes & Tips (5 of 7)
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| 23 Nov 2020 | 23 Nov 2020 |
简报 (1)
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| 22 Apr 2021 | 22 Apr 2021 |
宣传册 (3)
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| 19 Jan 2021 | 19 Jan 2021 | |||
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| 04 May 2021 | 04 May 2021 |
手册 (5 of 6)
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| 13 Jun 2019 | 13 Jun 2019 | |||
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| 25 Feb 2021 | 25 Feb 2021 | |||
| 06 Feb 2020 | 06 Feb 2020 |
白皮书 (1)
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| 04 Dec 2018 | 04 Dec 2018 |
EDA符号、封装和3D模型
STMicroelectronics - IIS3DHHC
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| IIS3DHHCTR | 1 distributors | 批量生产 | EAR99 | NEC | Tape And Reel | LGA 5X5X1.7 16LD CERAMIC CAVITY | - | - | MALTA | 5.5 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
5.5 / 1k