IIS3DWB

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Ultra-wide bandwidth, low-noise 3-axis digital accelerometer for industrial applications

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  • The IIS3DWB is a system-in-package featuring a 3-axis digital accelerometer with low noise over an ultra-wide and flat frequency range. The wide bandwidth, low noise, very stable and repeatable sensitivity, together with the capability of operating over an extended temperature range (up to +105 °C), make the device particularly suitable for vibration monitoring in industrial applications.

    The high performance delivered at low power consumption, together with the digital output and the embedded digital features like the FIFO and the interrupts are enabling features for battery-operated industrial wireless sensor nodes.
    The IIS3DWB has a selectable full-scale acceleration range of ±2/±4/±8/±16 g and is capable of measuring accelerations with a bandwidth up to 5 kHz with an output data rate of 26.7 kHz. A 3 kB first-in, first-out (FIFO) buffer is integrated in the device to avoid any data loss and to limit intervention of the host processor.
    The MEMS sensor module family from ST leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes to serve automotive, industrial and consumer markets. The sensing elements are manufactured using ST’s proprietary micromachining process, while the embedded IC interfaces are developed using CMOS technology.
    The IIS3DWB has a self-test capability which allows checking the functioning of the sensor in the final application. The IIS3DWB is available in a 14-lead plastic land grid array (LGA) package and is guaranteed to operate over an extended temperature range from -40 °C to +105 °C.

    主要特性

    • 3-axis accelerometer with digital output
    • User-selectable full-scale: ±2/±4/±8/±16 g
    • Ultra-wide and flat frequency response range: from dc to 5 kHz (±3 dB point)
    • Ultra-low noise density: down to 90 µg/√Hz in 3-axis mode / 65 µg/√Hz in single-axis mode
    • High stability of the sensitivity over temperature and against mechanical shock
    • Extended temperature range from -40 to +105 °C
    • Low power: 1.1 mA with all 3 axes delivering full performance
    • SPI serial interface
    • Low-pass or high-pass filter with selectable cut-off frequency
    • Interrupts for wake-up / vibration - no vibration / FIFO thresholds
    • Embedded FIFO: 3 kB
    • Embedded temperature sensor
    • Embedded self-test
    • Supply voltage: 2.1 V to 3.6 V
    • Compact package: LGA 2.5 x 3 x 0.83 mm 14-lead
    • ECOPACK®, RoHS and “Green” compliant

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
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ECCN (US)
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IIS3DWBTR VFLGA2.5X3X.86 14L P.5 L.475X.25 Tape And Reel
Evaluation
9 - EAR99 - 没有经销商,请联系我们的销售办事处

IIS3DWBTR

封装

VFLGA2.5X3X.86 14L P.5 L.475X.25

包装类型

Tape And Reel

单价(US$)

9.0*

供货状态

Evaluation

单价(US$)

9

数量

-

ECCN (US)

EAR99

Country of Origin

-

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

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支持和应用

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DB3769
      Ultra-wide bandwidth, low-noise 3-axis digital accelerometer
      1.0
      495.33 KB
      PDF
      DB3769

      Ultra-wide bandwidth, low-noise 3-axis digital accelerometer

    • 描述 版本 文档大小 操作
      TN0018
      LGA 封装中MEMS 传感器的表面贴装指南
      1.0
      251.2 KB
      PDF
      TN0018

      LGA 封装中MEMS 传感器的表面贴装指南

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      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
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      DT0053
      6-point tumble sensor calibration
      1.0
      464.9 KB
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      DT0126
      Low-power application design with ST's MEMS accelerometers
      1.0
      184.68 KB
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      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
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      DT0127
      ST's MEMS accelerometer sensor testing & self-test
      1.1
      409.32 KB
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      DT0105

      1-point or 3-point tumble sensor calibration

      DT0053

      6-point tumble sensor calibration

      DT0126

      Low-power application design with ST's MEMS accelerometers

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

      DT0127

      ST's MEMS accelerometer sensor testing & self-test

出版刊物和宣传资料

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      MEMS Sensors for automotive applications 1.0
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      MEMS and Sensors Quick Reference Guide 1.1
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      MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.0
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      Sensor & motion algorithm software pack for STM32Cube 1.0
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      MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience

      Sensor & motion algorithm software pack for STM32Cube

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产品型号 供货状态 封装 符合RoHS级别 材料声明**
IIS3DWBTR
Evaluation
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

IIS3DWBTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

Marketing Status

Evaluation

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

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