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The IMP23ABSU is a compact, low-power microphone built with a capacitive sensing element and an IC interface.
The sensing element, capable of detecting acoustic waves, is manufactured using a specialized silicon micromachining process to produce audio sensors.
The IMP23ABSU has an acoustic overload point of 130 dBSPL with a typical 64 dB signal-to-noise ratio.
The sensitivity of the IMP23ABSU is -38 dBV ±1 dB @ 94 dBSPL, 1 kHz.
The IMP23ABSU is available in a package compliant with reflow soldering and is guaranteed to operate over an extended temperature range from -40 °C to +85 °C.主要特性
- Single supply voltage operation 1.52 V - 3.6 V
- Omnidirectional sensitivity
- High signal-to-noise ratio
- High acoustic overload point: 130 dBSPL typ.
- Package compliant with reflow soldering
- Enhanced RF immunity
- Ultra-flat frequency response
- Ultrasound bandwidth (up to 80 kHz)
- Low latency
- Ultra-low-power: 150 µA max.
- ECOPACK, RoHS, and “Green” compliant
精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
All resources
产品规格 (1)
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| 17 Sep 2020 |
17 Sep 2020
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应用手册 (1)
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| 17 Sep 2020 |
17 Sep 2020
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简报 (1)
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| 13 Nov 2020 |
13 Nov 2020
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宣传册 (2)
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| 26 Feb 2020 |
26 Feb 2020
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| 11 Nov 2020 |
11 Nov 2020
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手册 (3)
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| 09 Dec 2020 |
09 Dec 2020
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| 06 Aug 2020 |
06 Aug 2020
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| 19 Sep 2019 |
19 Sep 2019
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EDA Symbols, Footprints and 3D Models
STMicroelectronics - IMP23ABSU
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| IMP23ABSUTR |
批量生产
|
RHLGA 2.65X3.5X1.08(MAX)MM 4L | Ecopack1 |
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IMP23ABSUTR
Package:
RHLGA 2.65X3.5X1.08(MAX)MM 4LMaterial Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持 。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| IMP23ABSUTR | 4 distributors | Free Sample Buy Direct |
批量生产
|
EAR99 | NEC | Tape And Reel | RHLGA 2.65X3.5X1.08(MAX)MM 4L | -40 | 85 | CHINA | 1.0 / 1k | |
