ISM330IS

批量生产
Design Win Education

iNEMO惯性模块:常开3D加速度计和3D陀螺仪,带嵌入式ISPU - 智能传感器处理单元

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产品概述

描述

The ISM330IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in industrial and IoT solutions. The ISM330IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
The ISM330IS features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The ISM330IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rd party tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node from small equipment or accessories to enterprise solutions for Industry 5.0 (for example, anomaly detection, asset tracking, factory automation, and so forth).
The ISM330IS is available in a plastic land grid array (LGA) package.
  • 所有功能

    • 3-axis accelerometer with selectable full scale: ±2/±4/±8/±16 g
    • 3-axis gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
    • Embedded ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the edge for a seamless digital-life experience
    • Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, ISPU not included)
    • Low noise: 70 μg/√Hz in high-performance mode
    • Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)
    • SPI / I²C serial interface
    • Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)
    • Temperature range from -40 to +85 °C
    • Embedded temperature sensor
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • ECOPACK and RoHS compliant

All tools & software

    • 产品型号
      状态
      描述
      类型
      供应商

      IMU383ZA

      批量生产

      High-performance inertial platform

      合作伙伴提供的硬件集成设备 ACEINNA
      IMU383ZA

      描述:

      High-performance inertial platform

      SensiBLE

      批量生产

      即用型BLE模块上系统包含了传感器、低功耗ARM® 32位Cortex®-M4 CPU和纽扣电池。立即行动,加快IoT产品开发速度!

      合作伙伴提供的硬件集成设备 SensiEDGE
      SensiBLE

      描述:

      即用型BLE模块上系统包含了传感器、低功耗ARM® 32位Cortex®-M4 CPU和纽扣电池。立即行动,加快IoT产品开发速度!

      SensiSUB

      批量生产

      将低功耗SUB 1GHZ RF收发器连接到云,具有完全可定制的传感器、ARM® 32位Cortex®-M4 CPU和纽扣电池。

      合作伙伴提供的硬件集成设备 SensiEDGE
      SensiSUB

      描述:

      将低功耗SUB 1GHZ RF收发器连接到云,具有完全可定制的传感器、ARM® 32位Cortex®-M4 CPU和纽扣电池。
    • 产品型号
      状态
      描述
      类型
      供应商

      FAE Engineering Services

      批量生产

      关于SensorTile.box的工程服务,例如塑料外壳、硬件和软件/应用定制和板的制造。

      合作伙伴提供的设计服务 FAE Technology
      FAE Engineering Services

      描述:

      关于SensorTile.box的工程服务,例如塑料外壳、硬件和软件/应用定制和板的制造。

      SensiEDGE customization services

      批量生产

      端到端开发服务:硬件、固件、软件开发、附件、云和移动应用。使用SensiEDGE加快IoT项目的开发速度!

      合作伙伴提供的设计服务 SensiEDGE
      SensiEDGE customization services

      描述:

      端到端开发服务:硬件、固件、软件开发、附件、云和移动应用。使用SensiEDGE加快IoT项目的开发速度!
    • 产品型号
      状态
      描述
      类型
      供应商

      AlgoBuilder

      批量生产

      算法的图形化设计应用

      Sensor Software Development Tools ST
      AlgoBuilder

      描述:

      算法的图形化设计应用

EDA符号、封装和3D模型

STMicroelectronics - ISM330IS

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
ISM330ISNTR
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2
ISM330ISTR
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

ISM330ISNTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

ISM330ISTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
ISM330ISNTR 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape and Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES
ISM330ISTR 无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape and Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES

ISM330ISNTR 批量生产

封装:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

ISM330ISNTR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

PHILIPPINES

无法联系到经销商,请联系我们的销售办事处

ISM330ISTR 批量生产

封装:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

ISM330ISTR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

PHILIPPINES

无法联系到经销商,请联系我们的销售办事处
Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商