产品概述
描述
The ISM330IS is a system-in-package featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, boosting performance at 0.59 mA in high-performance mode and enabling always-on low-power features for optimal motion results in industrial and IoT solutions. The ISM330IS has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.The ISM330IS features programmable interrupts and an on-chip sensor hub which includes up to 6 sensors: the internal accelerometer & gyroscope and 4 external sensors.
The ISM330IS embeds a new ST category of processing, ISPU (intelligent sensor processing unit) to support real-time applications that rely on sensor data. The ISPU is an ultra-low-power, high-performance programmable core which can execute signal processing and AI algorithms in the edge. The main benefits of the ISPU are C programming and an enhanced ecosystem with libraries and 3rd party tools/IDE.
Its optimized ultra-low-power hardware circuitry for real-time execution of the algorithms is a state-of-the-art feature for any wireless sensor node from small equipment or accessories to enterprise solutions for Industry 5.0 (for example, anomaly detection, asset tracking, factory automation, and so forth).
The ISM330IS is available in a plastic land grid array (LGA) package.
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所有功能
- 3-axis accelerometer with selectable full scale: ±2/±4/±8/±16 g
- 3-axis gyroscope with selectable full scale: ±125/±250/±500/±1000/±2000 dps
- Embedded ISPU: ultra-low-power, high-performance programmable core to execute signal processing and AI algorithms in the edge for a seamless digital-life experience
- Low-power consumption: 0.59 mA in high-performance mode, 0.46 mA in low-power mode (gyroscope + accelerometer only, ISPU not included)
- Low noise: 70 μg/√Hz in high-performance mode
- Sensor hub feature to efficiently collect data from additional external sensors (up to 4 external sensors)
- SPI / I²C serial interface
- Analog supply voltage: 1.71 V to 3.6 V with independent IO supply (1.62 V)
- Temperature range from -40 to +85 °C
- Embedded temperature sensor
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
精选 视频
A new generation of MEMS sensors, featuring an embedded intelligent sensor processing unit (ISPU). Discover our new products with a C-programmable core to enhance signal processing and AI algorithms.
All tools & software
全部资源
| Resource title | 版本 | Latest update |
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产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 06 Jun 2022 | 06 Jun 2022 |
应用手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 05 Aug 2022 | 05 Aug 2022 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 31 Aug 2021 | 31 Aug 2021 |
Design Notes & Tips (3)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 24 Jan 2022 | 24 Jan 2022 | ||
| 1.0 | 19 Mar 2021 | 19 Mar 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 |
简报 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 13 Jan 2021 | 13 Jan 2021 |
手册 (4)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 05 Apr 2022 | 05 Apr 2022 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 12.21 | 09 Dec 2021 | 09 Dec 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
EDA符号、封装和3D模型
STMicroelectronics - ISM330IS
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| ISM330ISNTR | 批量生产 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
| ISM330ISTR | 批量生产 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
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| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| ISM330ISNTR | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | | ||
| ISM330ISTR | 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | | ||
ISM330ISNTR 批量生产
封装:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
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无法联系到经销商，请联系我们的销售办事处
Buy Direct at ST 无法联系到经销商，请联系我们的销售办事处
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