LIS2DU12

评估

MEMS digital output motion sensor: high-performance, 3-axes accelerometer with small footprint and advanced features

下载数据摘要
概述
Online design
样片和购买
解决方案
文件
CAD资源
工具与软件
质量与可靠性
Partner products
Sales Briefcase

产品概述

描述

The LIS2DU12 is an ultra-low-power three-axis linear accelerometer embedding advanced digital functions. The LIS2DU12 has user-selectable full scales of ±2g/±4g/±8g/±16g and is capable of measuring accelerations with output data rates from 1.6 Hz to 800 Hz.
The LIS2DU12 has an integrated 128-level FIFO buffer allowing to store a wide range of data, reducing system power consumption.
The embedded self-test capability allows the user to check that the sensor works in the final application.
The LIS2DU12 has a dedicated internal engine to process motion and acceleration detection including free-fall, wake-up, single/double-tap recognition, activity/inactivity, and 6D/4D orientation.
The LIS2DU12 is available in a small thin plastic land grid array package (LGA) and it is guaranteed to operate over an extended temperature range from -40°C to + 85 °C.
  • 所有功能

    • Supply voltage range from 1.62 to 3.6 V with independent IO supply
    • Ultra-low power consumption
      • Normal mode with anti-alias filter: 5.9 µA
      • Ultra-low-power mode: 0.45 µA
      • One-shot mode: 0.2 µA
      • Power-down: 0.02 µA
    • Low noise down to 160 µg/√Hz
    • ±2g/±4g/±8g/±16g full scales
    • ODR from 1.6 Hz to 800 Hz
    • Embedded temperature sensor
    • Embedded FIFO: up to 512 samples of accelerometer and temperature data in high resolution or up to 768 samples of acceleration data at low resolution
    • High-speed I²C/SPI/MIPI I3CSM digital output interface
    • Embedded digital functions (free-fall, wake-up, single/double-tap recognition, activity/inactivity, 6D/4D orientation)
    • Self-test
    • Small package: 2.0 x 2.0 x 0.74 (max) mm LGA 12-lead
    • 10000 g high shock survivability
    • ECOPACK, RoHS and “Green” compliant

特别推荐

All tools & software

    • 产品型号
      状态
      描述
      类型
      供应商

      LS53L1BT

      批量生产

      LS53L1BT motion and distance IoT Bluetooth board

      组件和模块 Gilisymo
      LS53L1BT

      描述:

      LS53L1BT motion and distance IoT Bluetooth board
    • 产品型号
      状态
      描述
      类型
      供应商

      FAE Engineering Services

      批量生产

      关于SensorTile.box的工程服务,例如塑料外壳、硬件和软件/应用定制和板的制造。

      工程服务 FAE Technology
      FAE Engineering Services

      描述:

      关于SensorTile.box的工程服务,例如塑料外壳、硬件和软件/应用定制和板的制造。

      Hardware and firmware design

      批量生产

      针对所有应用的完整硬件和固件设计

      工程服务 SIANA Systems
      Hardware and firmware design

      描述:

      针对所有应用的完整硬件和固件设计

      SensiEDGE customization services

      批量生产

      端到端开发服务:硬件、固件、软件开发、附件、云和移动应用。使用SensiEDGE加快IoT项目的开发速度!

      工程服务 SensiEDGE
      SensiEDGE customization services

      描述:

      端到端开发服务:硬件、固件、软件开发、附件、云和移动应用。使用SensiEDGE加快IoT项目的开发速度!

EDA符号、封装和3D模型

STMicroelectronics - LIS2DU12

为您的应用下载所有EDA符号、封装和3D模型,加快您的设计速度。您可以从大量CAD格式中进行选择,以匹配您的设计工具链。

Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
LIS2DU12TR
评估
LGA 2X2X0.74MAX 12 LEADS Ecopack2

LIS2DU12TR

Package:

LGA 2X2X0.74MAX 12 LEADS

Material Declaration**:

Marketing Status

评估

Package

LGA 2X2X0.74MAX 12 LEADS

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

产品型号
从分销商订购
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
LIS2DU12TR 无法联系到经销商,请联系我们的销售办事处
评估
EAR99 NEC Tape And Reel LGA 2X2X0.74MAX 12 LEADS -40 85 PHILIPPINES

LIS2DU12TR

供货状态

评估

ECCN (US)

EAR99

Budgetary Price (US$)*/Qty

ECCN (EU)

NEC

包装类型

Tape And Reel

封装

LGA 2X2X0.74MAX 12 LEADS

Operating Temperature (°C)

(最小值)

-40

(最大值)

85

Budgetary Price (US$)* / Qty

Country of Origin

PHILIPPINES

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商