产品概述
描述
The LIS3DHH is an ultra-high-resolution and low-noise three-axis linear accelerometer. The LIS3DHH has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LIS3DHH is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.
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所有功能
- 3-axis, ±2.5 g full-scale
- Ultra-low noise performance: 45 μg/√Hz
- Excellent stability over temperature (<0.4 mg/°C) and time
- 16-bit data output
- SPI 4-wire digital output interface
- Embedded temperature sensor
- 12-bit temperature data output
- Embedded FIFO (depth 32 levels)
- High shock survivability
- Extended operating temperature range (-40 °C to +85 °C)
- ECOPACK®, RoHS and “Green” compliant
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精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
全部资源
| Resource title | 版本 | Latest update |
|---|
产品规格 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 3.0 | 08 Apr 2020 | 08 Apr 2020 |
应用手册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 12 Jun 2018 | 12 Jun 2018 |
技术文档 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 29 Jun 2021 | 29 Jun 2021 |
Design Notes & Tips (5)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.1 | 21 Jan 2021 | 21 Jan 2021 | ||
| 1.2 | 21 Jan 2021 | 21 Jan 2021 |
宣传册 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.1 | 19 Jan 2021 | 19 Jan 2021 |
手册 (5)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 2.0 | 07 Apr 2021 | 07 Apr 2021 | ||
| 2.1 | 06 Aug 2020 | 06 Aug 2020 | ||
| 01.21 | 19 Mar 2021 | 19 Mar 2021 | ||
| 2.0 | 25 Feb 2021 | 25 Feb 2021 | ||
| 1.0 | 23 Jun 2020 | 23 Jun 2020 |
白皮书 (1)
| Resource title | 版本 | Latest update | ||
|---|---|---|---|---|
| 1.0 | 04 Dec 2018 | 04 Dec 2018 |
EDA符号、封装和3D模型
STMicroelectronics - LIS3DHH
为您的应用下载所有EDA符号、封装和3D模型，加快您的设计速度。您可以从大量CAD格式中进行选择，以匹配您的设计工具链。
符号
封装
3D模型
