产品概述
描述
The LIS3DHH is an ultra-high-resolution and low-noise three-axis linear accelerometer. The LIS3DHH has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
The LIS3DHH is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.
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所有功能
- 3-axis, ±2.5 g full-scale
- Ultra-low noise performance: 45 μg/√Hz
- Excellent stability over temperature (<0.4 mg/°C) and time
- 16-bit data output
- SPI 4-wire digital output interface
- Embedded temperature sensor
- 12-bit temperature data output
- Embedded FIFO (depth 32 levels)
- High shock survivability
- Extended operating temperature range (-40 °C to +85 °C)
- ECOPACK®, RoHS and “Green” compliant
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精选 视频
This video on the SensorTile.box Pro Mode shows you how to use this IoT and wearable sensor development kit to create customized wireless applications using an STM32Cube function pack. Use-case on a Human Activity Recognition algorithm included.
Watch this short tutorial on the Expert mode of the SensorTile.box to learn how to use a graphical wizard to build programs without having to write any code.
The first video in the SensorTile.box series of short tutorials will guide you through the pre-recorded examples in the device firmware to help you use IoT and wearable sensor applications.
All tools & software
All resources
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产品规格 (1)
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| 08 Apr 2020 | 08 Apr 2020 |
应用手册 (1)
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| 12 Jun 2018 | 12 Jun 2018 |
技术文档 (1)
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| 18 Jan 2021 | 18 Jan 2021 |
Design Notes & Tips (5)
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| 21 Jan 2021 | 21 Jan 2021 | |||
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| 21 Jan 2021 | 21 Jan 2021 |
宣传册 (1)
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| 19 Jan 2021 | 19 Jan 2021 |
手册 (5)
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| 13 Jun 2019 | 13 Jun 2019 | |||
| 07 Apr 2021 | 07 Apr 2021 | |||
| 06 Aug 2020 | 06 Aug 2020 | |||
| 19 Mar 2021 | 19 Mar 2021 | |||
| 25 Feb 2021 | 25 Feb 2021 |
白皮书 (1)
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| 04 Dec 2018 | 04 Dec 2018 |
EDA Symbols, Footprints and 3D Models
STMicroelectronics - LIS3DHH
Speed up your design by downloading all the EDA symbols, footprints and 3D models for your application. You have access to a large number of CAD formats to fit with your design toolchain.
Symbols
Footprints
3D models
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| LIS3DHHTR | 1 distributors | 批量生产 | EAR99 | NEC | Tape And Reel | LGA 5X5X1.7 16LD CERAMIC CAVITY | -40 | 85 | MALTA | 5.2 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
5.2 / 1k