3-axis accelerometer, ultra high resolution, low-noise, SPI 4-wire digital output, ±2.5g full-scale

下载数据手册

Order a free sample and buy from our distributors

样片和购买
概述
工具与软件
资源
解决方案
质量与可靠性
Sales Briefcase
eDesignSuite
开始
样片和购买
Partner products
  • The LIS3DHH is an ultra-high-resolution and low-noise three-axis linear accelerometer.

    The LIS3DHH has a full scale of ±2.5 g and is capable of providing the measured accelerations to the application through an SPI 4-wire digital interface.
    The sensing element is manufactured using a dedicated micromachining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers.
    The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The LIS3DHH is available in a high-performance (low-stress) ceramic cavity land grid array (CC LGA) package and can operate within a temperature range of -40 °C to +85 °C.

    主要特性

    • 3-axis, ±2.5 g full-scale
    • Ultra-low noise performance: 45 μg/√Hz
    • Excellent stability over temperature (<0.4 mg/°C) and time
    • 16-bit data output
    • SPI 4-wire digital output interface
    • Embedded temperature sensor
    • 12-bit temperature data output
    • Embedded FIFO (depth 32 levels)
    • High shock survivability
    • Extended operating temperature range (-40 °C to +85 °C)
    • ECOPACK®, RoHS and “Green” compliant

样片和购买

产品型号
封装
包装类型
供货状态
预算价格(US$)
数量
ECCN (US)
Country of Origin
从分销商订购
从ST订购
LIS3DHHTR LGA 5X5X1.7 16LD CERAMIC CAVITY Tape And Reel
Active
5.2 1000 EAR99 - 查看供货情况

Distributor availability ofLIS3DHHTR

代理商名称
地区 库存 最小订购量 Third party link
DIGIKEY WORLDWIDE 2137 1 Order Now
AVNET AMERICA 3000 0 Order Now
MOUSER WORLDWIDE 1894 1 Order Now
Farnell Element14 EUROPE 944 1 Order Now

代理商库存报告日期: 2019-08-08

代理商名称

DIGIKEY

库存

2137

Min.Order

1

地区

WORLDWIDE Order Now

AVNET

库存

3000

Min.Order

0

地区

AMERICA Order Now

MOUSER

库存

1894

Min.Order

1

地区

WORLDWIDE Order Now

Farnell Element14

库存

944

Min.Order

1

地区

EUROPE Order Now

代理商库存报告日期: 2019-08-08

Get sample

LIS3DHHTR

封装

LGA 5X5X1.7 16LD CERAMIC CAVITY

包装类型

Tape And Reel

Unit Price (US$)

5.2*

Distributor availability ofLIS3DHHTR

代理商名称
地区 库存 最小订购量 Third party link
DIGIKEY WORLDWIDE 2137 1 Order Now
AVNET AMERICA 3000 0 Order Now
MOUSER WORLDWIDE 1894 1 Order Now
Farnell Element14 EUROPE 944 1 Order Now

代理商库存报告日期: 2019-08-08

代理商名称

DIGIKEY

库存

2137

Min.Order

1

地区

WORLDWIDE Order Now

AVNET

库存

3000

Min.Order

0

地区

AMERICA Order Now

MOUSER

库存

1894

Min.Order

1

地区

WORLDWIDE Order Now

Farnell Element14

库存

944

Min.Order

1

地区

EUROPE Order Now

代理商库存报告日期: 2019-08-08

供货状态

Active

Unit Price (US$)

5.2

数量

1000

ECCN (US)

EAR99

Country of Origin

-

(*) Suggested Resale Price per unit (USD) for BUDGETARY USE ONLY. For quotes, prices in local currency, please contact your local ST Sales Office  or our Distributors

精选 产品

适合您的资源

相关应用

音频和视频

生态系统

    • 产品型号

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

    • 产品型号

      Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!

      SensiBLE 2.0 SoM integrates a rechargeable Li-Ion battery, a variety of sensors, and a low power Cortex M0 core that executes Bluetooth protocols.

      Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

软件

    • 产品型号

      Android sensor HAL for MEMS motion and environmental sensors (Industrial I/O framework)

      Android sensor HAL for MEMS motion and environmental sensors (Input framework)

      Standard C platform-independent drivers for MEMS motion and environmental sensors

      Linux device drivers for MEMS motion and environmental sensors (Industrial I/O framework)

      Linux device drivers for MEMS motion and environmental sensors (Input framework)

评估工具

    • 产品型号

      LIS3DHH adapter board for a standard DIL 24 socket

支持和应用

00 选择要下载的文档

技术文档

    • Description 版本 文档大小 操作
      DS11987
      MEMS motion sensor: three-axis digital output accelerometer
      3.0
      635.63 KB
      PDF
      DS11987

      MEMS motion sensor: three-axis digital output accelerometer

    • Description 版本 文档大小 操作
      AN5139
      LIS3DHH: three-axis digital ouput accelerometer
      2.0
      382.27 KB
      PDF
      AN5139

      LIS3DHH: three-axis digital ouput accelerometer

    • Description 版本 文档大小 操作
      TN0018
      LGA 封装中MEMS 传感器的表面贴装指南
      1.0
      251.2 KB
      PDF
      TN0018

      LGA 封装中MEMS 传感器的表面贴装指南

    • Description 版本 文档大小 操作
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0053
      6-point tumble sensor calibration
      1.0
      464.9 KB
      PDF
      DT0126
      Low-power application design with ST's MEMS accelerometers
      1.0
      184.68 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0127
      ST's MEMS accelerometer sensor testing & self-test
      1.1
      409.32 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0053

      6-point tumble sensor calibration

      DT0126

      Low-power application design with ST's MEMS accelerometers

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

      DT0127

      ST's MEMS accelerometer sensor testing & self-test

出版刊物和宣传资料

    • Description 版本 文档大小 操作
      MEMS Sensors for automotive applications 1.0
      3.33 MB
      PDF
      MEMS和传感器 智能运动追踪、IoT和增强用户体验 1.0
      11.08 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      544.58 KB
      PDF

      MEMS Sensors for automotive applications

      MEMS和传感器 智能运动追踪、IoT和增强用户体验

      Sensor & motion algorithm software pack for STM32Cube

    • Description 版本 文档大小 操作
      Capacitive MEMS accelerometer for condition monitoring 1.0
      3.35 MB
      PDF

      Capacitive MEMS accelerometer for condition monitoring

产品型号 供货状态 封装 符合RoHS级别 材料声明**
LIS3DHHTR
Active
LGA 5X5X1.7 16LD CERAMIC CAVITY Ecopack2

LIS3DHHTR

Package:

LGA 5X5X1.7 16LD CERAMIC CAVITY

Material Declaration**:

PDF XML

Marketing Status

Active

Package

LGA 5X5X1.7 16LD CERAMIC CAVITY

RoHS Compliance Grade

Ecopack2

(**) The Material Declaration forms available on st.com may be generic documents based on the most commonly used package within a package family. For this reason, they may not be 100% accurate for a specific device. Please contact our sales support for information on specific devices.