产品概述
描述
The LSM6DSO32 is a system-in-package featuring a 3D digital accelerometer and 3D digital gyroscope boosting power performance to 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer. The LSM6DSO32 supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.The LSM6DSO32 has a full-scale acceleration range of ±4/±8/±16±32 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
High robustness to mechanical shock makes the LSM6DSO32 the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSO32 is available in a plastic land grid array (LGA) package.
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所有功能
- Power consumption: 0.55 mA in combo high-performance mode
- “Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 9 kbytes
- ±4/±8/±16/±32 g full scale
- ±125/±250/±500/±1000/±2000 dps full scale
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (1.62 V)
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
- Advanced pedometer, step detector and step counter
- Significant Motion Detection, Tilt detection
- Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
- Programmable finite state machine: accelerometer, gyroscope and external sensors
- Embedded temperature sensor
- ECOPACK, RoHS and “Green” compliant
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All tools & software
EDA符号、封装和3D模型
STMicroelectronics - LSM6DSO32
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| LSM6DSO32TR |
批量生产
|
VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
|
LSM6DSO32TR
Package:
VFLGA2.5X3X.86 14L P.5 L.475X.25Material Declaration**:
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | 从分销商订购 | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| LSM6DSO32TR | 无法联系到经销商，请联系我们的销售办事处 |
批量生产
|
EAR99 | NEC | Tape And Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | 2.1 / 1k | ||
供货状态
批量生产ECCN (US)
EAR99Budgetary Price (US$)*/Qty
2.1 / 1k