LSM6DSOX

批量生产
Education

iNEMO inertial module with Machine Learning Core, Finite State Machine and advanced Digital Functions. Ultra-low power for battery operated IoT, Gaming, Wearable and Personal Electronics.

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质量与可靠性
Sales Briefcase
开始
样片和购买
Partner products
  • The LSM6DSOX is a system-in-package featuring a 3D digital accelerometer and a 3D digital gyroscope boosting performance at 0.55 mA in high-performance mode and enabling always-on low-power features for an optimal motion experience for the consumer.

    The LSM6DSOX supports main OS requirements, offering real, virtual and batch sensors with 9 kbytes for dynamic data batching. ST’s family of MEMS sensor modules leverages the robust and mature manufacturing processes already used for the production of micromachined accelerometers and gyroscopes. The various sensing elements are manufactured using specialized micromachining processes, while the IC interfaces are developed using CMOS technology that allows the design of a dedicated circuit which is trimmed to better match the characteristics of the sensing element.
    The LSM6DSOX has a full-scale acceleration range of ±2/±4/±8/±16 g and an angular rate range of ±125/±250/±500/±1000/±2000 dps.
    The LSM6DSOX fully supports EIS and OIS applications as the module includes a dedicated configurable signal processing path for OIS and auxiliary SPI, configurable for both the gyroscope and accelerometer. The LSM6DSOX OIS can be configured from the Auxiliary SPI and primary interface (SPI / I²C & MIPI I3CSM).
    High robustness to mechanical shock makes the LSM6DSOX the preferred choice of system designers for the creation and manufacturing of reliable products. The LSM6DSOX is available in a plastic land grid array (LGA) package.

    主要特性

    • Power consumption: 0.55 mA in combo high-performance mode
    • “Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 9 kbyte
    • Android compliant
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000 dps full scale
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (1.62 V)
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • SPI / I²C & MIPI I3CSM serial interface with main processor data synchronization
    • Auxiliary SPI for OIS data output for gyroscope and accelerometer
    • OIS configurable from Aux SPI, primary interface (SPI / I²C & MIPI I3CSM)
    • Advanced pedometer, step detector and step counter
    • Significant Motion Detection, Tilt detection
    • Standard interrupts: free-fall, wakeup, 6D/4D orientation, click and double-click
    • Programmable finite state machine: accelerometer, gyroscope and external sensors
    • Machine Learning Core
    • S4S data synchronization
    • Embedded temperature sensor
    • ECOPACK®, RoHS and “Green” compliant

样片和购买

产品型号
封装
包装类型
供货状态
ECCN (US)
Country of Origin
Budgetary Price (US$)*/Qty
从ST订购
从分销商订购
LSM6DSOXTR VFLGA2.5X3X.86 14L P.5 L.475X.25 Tape And Reel
批量生产
EAR99 PHILIPPINES 2.5 / 1k 查看供货情况

...的经销商可用性LSM6DSOXTR

代理商名称
地区 库存 最小订购量 第三方链接
ARROW EUROPE 2010 0 马上订购

代理商库存报告日期: 2020-06-04

代理商名称

ARROW

库存

2010

Min.Order

0

地区

EUROPE 马上订购

代理商库存报告日期: 2020-06-04

LSM6DSOXTR

封装

VFLGA2.5X3X.86 14L P.5 L.475X.25

包装类型

Tape And Reel

Budgetary Price (US$)*/Qty

2.5 / 1k

...的经销商可用性LSM6DSOXTR

代理商名称
地区 库存 最小订购量 第三方链接
ARROW EUROPE 2010 0 马上订购

代理商库存报告日期: 2020-06-04

代理商名称

ARROW

库存

2010

Min.Order

0

地区

EUROPE 马上订购

代理商库存报告日期: 2020-06-04

供货状态

批量生产

Budgetary Price (US$)* / Qty

2.5 / 1k

ECCN (US)

EAR99

Country of Origin

PHILIPPINES

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商

生态系统

    • 产品型号

      AWS IoT Core is a managed cloud service that lets connected devices easily and securely interact with cloud applications and other devices

      Microsoft Azure is an ever-expanding set of cloud services to help your organization meet your business challenges. It's the freedom to build, manage, and deploy applications on a massive, global network using your favorite tools and frameworks.

      IBM Watson IoT Platform is a managed, cloud-hosted service designed to make it simple to derive value from your Internet of Things devices.

    • 产品型号

      High-performance inertial platform.

      Ready-to-use BLE System-on-Module packed with sensors, low power ARM® 32-bit Cortex®-M4 CPU and coin battery. Speed up IoT product development today!

      Connecting low-power SUB 1GHZ RF transceiver to the Cloud with fully customisable sensors, ARM® 32-bit Cortex®-M4 CPU and coin battery.

    • 产品型号

      Motion MEMS and environmental sensor expansion board for STM32 Nucleo

软件

    • 产品型号

      GUI for X-CUBE-MEMS1, motion MEMS and environmental sensor software expansion for STM32Cube

    • 产品型号

      STM32Cube function pack for ultra-low power IoT node with artificial intelligence (AI) application based on audio and motion sensing

      STM32Cube function pack for the Pro Mode of the SensorTile.box wireless multi sensor development kit

      AlgoBuilder firmware template generator expansion for STM32Cube

      Sensor and motion algorithm software expansion for STM32Cube

    • 产品型号

      Application for the graphical design of algorithms

      Standard C platform-independent drivers for MEMS motion and environmental sensors

      Configuration examples for embedded Finite State Machine feature

      Configuration examples for embedded Machine Learning Core feature

    • 产品型号

      BLE sensor application for Android and iOS

评估工具

    • 产品型号

      STM32 Nucleo-64 development board with STM32F401RE MCU, supports Arduino and ST morpho connectivity

      STM32 Nucleo-64 development board with STM32L073RZ MCU, supports Arduino and ST morpho connectivity

      STM32 Nucleo-64 development board with STM32L152RE MCU, supports Arduino and ST morpho connectivity

      STM32 Nucleo-64 development board with STM32L476RG MCU, supports Arduino and ST morpho connectivity

      Professional MEMS tool: ST MEMS adapters motherboard based on the STM32F401VE and compatible with all ST MEMS adapters

      LSM6DSOX adapter board for a standard DIL24 socket

      MEMS sensor sample kit

      SensorTile.box wireless multi sensor development kit with user friendly app for IoT and wearable sensor applications

支持和应用

    • 产品型号

      End-to-end development services: Hardware, Firmware, Software development, Enclosure, Cloud and mobile APPs. Speed up your IoT project with SensiEDGE!

      Engineering services on theSensorTile.box surch as Plastic housing, HW and SW/App customizations and boards Manufacturing.

00 选择要下载的文档

技术文档

    • 描述 版本 文档大小 操作
      DS12814
      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope
      3.0
      3.12 MB
      PDF
      DS12814

      iNEMO inertial module: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      AN5273
      LSM6DSOX: Finite State Machine
      4.0
      1.38 MB
      PDF
      AN5259
      LSM6DSOX: Machine Learning Core
      3.0
      3.38 MB
      PDF
      AN5272
      LSM6DSOX: always-on 3D accelerometer and 3D gyroscope
      3.0
      1.66 MB
      PDF
      AN5273

      LSM6DSOX: Finite State Machine

      AN5259

      LSM6DSOX: Machine Learning Core

      AN5272

      LSM6DSOX: always-on 3D accelerometer and 3D gyroscope

    • 描述 版本 文档大小 操作
      TN0018
      LGA 封装中MEMS 传感器的表面贴装指南
      1.0
      251.2 KB
      PDF
      TN0018

      LGA 封装中MEMS 传感器的表面贴装指南

    • 描述 版本 文档大小 操作
      DT0105
      1-point or 3-point tumble sensor calibration
      1.0
      148.7 KB
      PDF
      DT0064
      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差
      1.0
      673.72 KB
      PDF
      DT0106
      Residual linear acceleration by gravity subtraction to enable dead-reckoning
      1.0
      192.08 KB
      PDF
      DT0105

      1-point or 3-point tumble sensor calibration

      DT0064

      MEMS 传感器中的噪声分析和识别,Allan,时间,Hadamard,重叠,修正,总体方差

      DT0106

      Residual linear acceleration by gravity subtraction to enable dead-reckoning

    • 描述 版本 文档大小 操作
      AN5353
      How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications
      1.0
      981.19 KB
      PDF
      AN5353

      How to use a sensor on a DIL 24 socket in X-CUBE-MEMS1 package applications

Presentations & Training Material

    • 描述 版本 文档大小 操作
      Neural Networks on the STM32 with STM32Cube.AI 5.1
      1.17 MB
      PDF

      Neural Networks on the STM32 with STM32Cube.AI

出版刊物和宣传资料

    • 描述 版本 文档大小 操作
      ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT 1.0
      113.79 KB
      PDF
      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core 1.0
      1.05 MB
      PDF
      LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core 1.0
      98.3 KB
      PDF

      ISM330DHCX iNEMO 6-axis inertial module with Machine Learning Core for IIoT

      LSM6DSOX iNEMO 6-axis inertial module with Machine Learning core

      LSM6DSRX iNEMO 6-axis inertial module with Machine Learning core

    • 描述 版本 文档大小 操作
      MEMS Sensors for automotive applications 1.0
      3.33 MB
      PDF
      MEMS and Sensors Quick Reference Guide 1.1
      919.75 KB
      PDF
      MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience 1.0
      2.28 MB
      PDF
      Sensor & motion algorithm software pack for STM32Cube 1.0
      544.58 KB
      PDF

      MEMS Sensors for automotive applications

      MEMS and Sensors Quick Reference Guide

      MEMS and Sensors Smart Motion tracking, IoT for an enhanced user experience

      Sensor & motion algorithm software pack for STM32Cube

产品型号 供货状态 封装 符合RoHS级别 材料声明**
LSM6DSOXTR
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSOXTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持