产品概述
描述
The LSM6DSV is a high-end, low-noise, low-power 6-axis IMU, featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, with a triple core for processing acceleration and angular rate data on three separate channels (user interface, OIS, and EIS) with dedicated configuration, processing, and filtering.
The LSM6DSV enables processes in edge computing, leveraging embedded advanced dedicated features such as a sensor fusion low-power (SFLP) algorithm and a finite state machine (FSM) for configurable motion tracking.
The LSM6DSV supports the adaptive self-configuration (ASC) feature, which allows the FSM to automatically reconfigure the device in real time based on the detection of a specific motion pattern, without any intervention from the host processor.
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所有功能
- Triple core for UI, EIS, and OIS data processing
- "Always-on" experience with low power consumption for both accelerometer and gyroscope
- Smart FIFO up to 4.5 KB
- Android compliant
- ±2/±4/±8/±16 g full scale
- ±125/±250/±500/±1000/±2000/±4000 dps full scale
- SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
- Auxiliary SPI for OIS data output for gyroscope and accelerometer
- OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
- EIS dedicated channel on primary interface with dedicated filtering
- Advanced pedometer, step detector, and step counter
- Significant motion detection, tilt detection
- Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click
- Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
- Embedded adaptive self-configuration (ASC)
- Embedded sensor fusion low-power algorithm
- Embedded temperature sensor
- Analog supply voltage: 1.71 V to 3.6 V
- Independent IO supply (extended range: 1.08 V to 3.6 V)
- Power consumption: 0.65 mA in combo high-performance mode
- Compact footprint: 2.5 mm x 3 mm x 0.83 mm
- ECOPACK and RoHS compliant
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EDA符号、封装和3D模型
STMicroelectronics - LSM6DSV
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符号
封装
3D模型
质量与可靠性
| 产品型号 | Marketing Status | 封装 | 符合RoHS级别 | 材料声明** |
|---|---|---|---|---|
| LSM6DSV | 预览 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 | |
| LSM6DSVTR | 批量生产 | VFLGA2.5X3X.86 14L P.5 L.475X.25 | Ecopack2 |
(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此，它们可能不是100%适用于特定的设备。有关特定设备的信息，请联系 销售支持。
样片和购买
| 产品型号 | Order from distributors | 从ST订购 | 供货状态 | ECCN (US) | ECCN (EU) | 包装类型 | 封装 | 温度（ºC） | Country of Origin | Budgetary Price (US$)*/Qty | ||
|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 最小值 | 最大值 | |||||||||||
| LSM6DSVTR | distributors 无法联系到经销商，请联系我们的销售办事处 | 批量生产 | EAR99 | NEC | Tape and Reel | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | THAILAND | | ||
| LSM6DSV | distributors 无法联系到经销商，请联系我们的销售办事处 | 预览 | EAR99 | NEC | Tray | VFLGA2.5X3X.86 14L P.5 L.475X.25 | -40 | 85 | PHILIPPINES | | ||