LSM6DSV

批量生产
Design Win

iNEMO惯性模块:3D加速度计和3D陀螺仪

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产品概述

描述

The LSM6DSV is a high-end, low-noise, low-power 6-axis IMU, featuring a 3-axis digital accelerometer and a 3-axis digital gyroscope, with a triple core for processing acceleration and angular rate data on three separate channels (user interface, OIS, and EIS) with dedicated configuration, processing, and filtering.

The LSM6DSV enables processes in edge computing, leveraging embedded advanced dedicated features such as a sensor fusion low-power (SFLP) algorithm and a finite state machine (FSM) for configurable motion tracking.

The LSM6DSV supports the adaptive self-configuration (ASC) feature, which allows the FSM to automatically reconfigure the device in real time based on the detection of a specific motion pattern, without any intervention from the host processor.

  • 所有功能

    • Triple core for UI, EIS, and OIS data processing
    • "Always-on" experience with low power consumption for both accelerometer and gyroscope
    • Smart FIFO up to 4.5 KB
    • Android compliant
    • ±2/±4/±8/±16 g full scale
    • ±125/±250/±500/±1000/±2000/±4000 dps full scale
    • SPI / I²C & MIPI I3C® v1.1 serial interface with main processor data synchronization
    • Auxiliary SPI for OIS data output for gyroscope and accelerometer
    • OIS configurable from aux. SPI, primary interface (SPI / I²C & MIPI I3C® v1.1)
    • EIS dedicated channel on primary interface with dedicated filtering
    • Advanced pedometer, step detector, and step counter
    • Significant motion detection, tilt detection
    • Standard interrupts: free-fall, wake-up, 6D/4D orientation, click and double click
    • Programmable finite state machine for accelerometer, gyroscope, and external sensor data processing with high rate @ 960 Hz
    • Embedded adaptive self-configuration (ASC)
    • Embedded sensor fusion low-power algorithm
    • Embedded temperature sensor
    • Analog supply voltage: 1.71 V to 3.6 V
    • Independent IO supply (extended range: 1.08 V to 3.6 V)
    • Power consumption: 0.65 mA in combo high-performance mode
    • Compact footprint: 2.5 mm x 3 mm x 0.83 mm
    • ECOPACK and RoHS compliant

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EDA符号、封装和3D模型

STMicroelectronics - LSM6DSV

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Symbols

符号

Footprints

封装

3D model

3D模型

质量与可靠性

产品型号 Marketing Status 封装 符合RoHS级别 材料声明**
LSM6DSV
预览
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2
LSM6DSVTR
批量生产
VFLGA2.5X3X.86 14L P.5 L.475X.25 Ecopack2

LSM6DSV

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

预览

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

LSM6DSVTR

Package:

VFLGA2.5X3X.86 14L P.5 L.475X.25

Material Declaration**:

PDF XML

Marketing Status

批量生产

Package

VFLGA2.5X3X.86 14L P.5 L.475X.25

RoHS Compliance Grade

Ecopack2

(**) st.com上提供的材料声明表单可能是基于包装系列中最常用的封装的通用文档。因此,它们可能不是100%适用于特定的设备。有关特定设备的信息,请联系 销售支持

样片和购买

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产品型号
Order from distributors
从ST订购
供货状态
ECCN (US)
ECCN (EU)
包装类型
封装
温度(ºC) Country of Origin
Budgetary Price (US$)*/Qty
最小值
最大值
LSM6DSVTR Available at distributors

经销商的可用性 LSM6DSVTR

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
批量生产
EAR99 NEC Tape and Reel VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 THAILAND
LSM6DSV Available at distributors

经销商的可用性 LSM6DSV

代理商名称
地区 库存 最小订购量 第三方链接

代理商库存报告日期:

无法联系到经销商,请联系我们的销售办事处
预览
EAR99 NEC Tray VFLGA2.5X3X.86 14L P.5 L.475X.25 -40 85 PHILIPPINES

LSM6DSVTR 批量生产

封装:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

LSM6DSVTR

ECCN (EU):

NEC

包装类型:

Tape and Reel

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

THAILAND

代理商名称

代理商库存报告日期:

LSM6DSV 预览

封装:
VFLGA2.5X3X.86 14L P.5 L.475X.25
ECCN (US):
EAR99
Budgetary Price (US$)*/Qty:
-

产品型号:

LSM6DSV

ECCN (EU):

NEC

包装类型:

Tray

Operating Temperature (°C)

Min:

-40

Max:

85

Country of Origin:

PHILIPPINES

Swipe or click the button to explore more details Don't show this again

(*) 建议转售单价(美元)仅用于预算用途。如需以当地货币计价的报价,请联系您当地的 ST销售办事处 或我们的 经销商